ビームセンス List of Products and Services

The "Power Transistor Void Inspection Software" is a product that quantifies the soldering condition of transistors and IC chip components and displays the void rate. It identifies the shape of the mounted components and clearly displays the areas of voids that are not easily visible in relation to their surface area. It quantifies the void condition and shows the void rate relative to the component area. Additionally, matching with data files is straightforward. The data can display solder rates, NG judgments, inspection area sizes, solder area sizes, and more. 【Features】 - Recognizes component shapes by setting parameters - Capable of recognizing component shapes through image capture of Gerber data - Inspection can start simply by specifying the folder to be inspected - Displays in red if below the specified solder rate *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

The "BGA Void Inspection Software" identifies the characteristic points of void areas in BGA balls and clearly displays the hard-to-see void areas. The detection accuracy is high and has been verified with CT data. Additionally, inspection result images and data can be output in CSV format, allowing for verification on external computers. Furthermore, it is possible to set a void rate to determine OK or NG, and by using the coordinate registration function of the BeamSense X-ray device FLEX series, automatic inspection can be performed with a single setup. 【Features】 ■ Ability to specify the inspection range and display NG judgment for void rates above the set threshold ■ Conditions specified in setting mode can be recalled ■ Inspection can be started simply by specifying the folder to be inspected ■ Easy comparison with data files ■ Data can display void rate, NG judgment, coordinates, area, and more *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

This is a calendar featuring photo examples of 3DX-ray CT images. Our micro-focus X-ray fluoroscopy and CT device, "Smart X-ray," is designed for ultra-energy efficiency and can easily process large amounts of data with computer-based data processing. It is suitable for X-ray inspection (fluoroscopy, cross-sectional observation, 3D) of small parts and circuit boards. Please feel free to print it out and use it. 【Image Contents (3DX-ray CT Images)】 ■ Surface-mounted circuit boards ■ Wireless earphones ■ Electrical circuit boards ■ LED light bulbs ■ Dried small fish, etc. *For more details, please refer to the PDF materials or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

"Isn't X-ray dangerous?" "What is it used for?" "Are there similar products?" A simple explanation of X-ray inspection devices is available in a video posted on "Suita ch" in Suita City, Osaka. 【Benefits of Using X-ray Inspection Devices】 - Discover defects in parts that are not visible to the naked eye - Count very small parts - Combine with PC application software to expand possibilities infinitely X-ray transmission devices have improved over the past 20 years, with image processing performance over 1200 times and high-definition monitor prices reduced to 1/100! If you have concerns about price, device size, or convenience, please contact BeamSense. *For more details, please refer to the PDF materials or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

To analyze the wiring and metal patterns of multilayer printed circuit boards, we used to cut the printed circuit boards layer by layer and conduct visual (visible light) inspections. This method destroys the printed circuit boards, making it difficult to analyze valuable boards, and non-destructive inspection is desired. On the other hand, conventional non-destructive X-ray CT imaging faced challenges in layer separation of multilayer printed circuit boards due to limitations in resolution and density resolution. We have now developed a new X-ray CT system that allows for high-resolution CT imaging of multilayer circuit boards, enabling layer separation. Additionally, we have adopted new CAD software to provide wiring patterns visualized in CAD format layer by layer. [Features] ■ Separation and extraction of wiring patterns of multilayer boards using X-ray CT ■ Provision of wiring patterns visualized in CAD format layer by layer ■ Conversion of images of circuit board wiring patterns into CAD data *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

Utilizing new digital technology in the historically established field of X-ray imaging, we achieve realistic and easily understandable X-ray images. We solve your concerns regarding implementation P boards, reel components, and semiconductor parts through X-ray inspection, such as "I want to inspect the BGA joints," "I want to check for soldering abnormalities in resistors, capacitors, etc.," "I want to know about abnormalities in individual components," and "I want to check for wire bond disconnections, shorts, bends, etc." We have numerous case photos showcasing X-ray inspection in our catalog. ≪Proposals for Solving Your Concerns≫ ■ Void analysis software ■ Inspection software for mounted components ■ Inspection and counting software for reel components ■ Automatic inspection software for wire bonds *For more details, please refer to the PDF materials or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

This is a calendar featuring photo examples of 3DX X-ray CT images. Please feel free to print it out for your use. ≪Image Content≫ 3DX X-ray CT images *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

On the sample table of the micro-focus X-ray fluoroscopy device "FLEX-M863," reel parts are set up, and X-ray imaging is performed in all areas to capture images of the parts inside the reel. This software counts the number of parts inside the reel based on the transmitted images of those parts. As for the imaging methods for the reel, there are two approaches: one is an individual shooting method where images of a single field of view are captured separately in all four directions and then combined into one image; the other is a continuous method where images are taken continuously in the vertical direction and then expanded horizontally to create a large single image. 【FLEX-S1TC Applicable Uses】 ■ Confirmation of the number of received parts during purchasing ■ Inventory management in production sites ■ Process management in production planning ■ Understanding material management information in IoT *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

This unit can be attached to the X-ray source section of the micro-focus X-ray fluoroscopy devices "FLEX-M863" and "M345," allowing for the capture of optical images in video or still format along the same optical axis as the X-ray, with a field of view that is the same as or larger than that of the X-ray imaging. By reading the optical images of the parts being X-rayed, it becomes possible to read the part numbers, part names, or the manufacturing numbers of the target substrates. The collaboration between visible images and invisible X-ray images can expand the new possibilities of X-ray fluoroscopy devices. 【Applications of FLEX-BSU-OPC】 ■ Confirmation of optical images in X-ray imaging ■ Reading of part numbers and part names of X-ray imaged components ■ Realization of X-ray and optical hybrid automatic inspection devices ■ Simultaneous recording of dynamic changes in heating units using X-ray and optical methods *For more details, please refer to the PDF materials or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

The "Smart X-ray SmaRoe" is an X-ray fluoroscopy device (X-ray inspection system) that uses computer imaging technology to make X-ray images more user-friendly. It achieves a reproducible X-ray irradiation imaging system with a compact micro-focus X-ray source and a unique shutter mechanism. It can assist not only in the detection of defective products and the quantification of good products but also in product development through data accumulation. We offer a lineup including the standard tabletop model "FLEX-M863," as well as the "FLEX-MH867" and "FLEX-M345," which have the ability to penetrate 15mm steel plates. 【Features】 ■ Ideal for X-ray inspection (fluoroscopy, cross-sectional observation, 3D) of small parts and circuit boards ■ PC-based data processing allows for easy handling of large volumes of data ■ Ultra energy-efficient design ■ Enhanced functionality of conventional standard imaging (2D images) ■ Enhanced functionality through stereo transmission imaging (2.5D images) ■ Enhanced functionality through 3D tomographic imaging (3D images) *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

The "Smart X-ray SmaRoe" is an X-ray fluoroscopy device (X-ray inspection system) that utilizes computer imaging technology to make X-ray images more user-friendly. It achieves a reproducible X-ray irradiation imaging system with a compact micro-focus X-ray source and a unique shutter mechanism. We offer a lineup including the standard tabletop model "FLEX-M863," as well as the "FLEX-MH867" and "FLEX-M345," which have a fluoroscopic capability of 15mm steel plates. 【Features】 ■ Ideal for X-ray inspection (fluoroscopy, cross-sectional observation, 3D) of small parts and circuit boards ■ Computer-based data processing allows for easy handling of large volumes of data ■ Ultra energy-efficient design ■ Enhanced functionality of conventional normal imaging (2D images) ■ Enhanced functionality through stereo transmission imaging (2.5D images) ■ Enhanced functionality through 3D tomographic imaging (3D images) *For more details, please refer to the PDF materials or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

This case study collection introduces applications of the X-ray fluoroscopy device (X-ray inspection device) and system "Smart X-ray SmaRoe" that make X-ray images easier to use by utilizing computer imaging technology. In the future, our company will continue to advance technology development so that "Smart X-ray" can be applied to fields previously considered impossible. [Featured Cases] ■ Nano-focus X-ray fluoroscopy technology "FLEX-NANO445" ■ Micro-focus X-ray CT device "FLEX-M345CT" ■ CT image digitization system ■ BGA void analysis technology "BGA Pro" ■ Stereo X-ray image 3D analysis device, etc. *For more details, please refer to the PDF materials or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

This case study collection introduces applications of the X-ray fluoroscopy device (X-ray inspection device) and system "Smart X-ray SmaRoe" that make X-ray images more user-friendly using computer imaging technology. Our company will continue to explore new possibilities in X-ray fluoroscopy. 【Featured Cases】 ■ Heating Unit BSU-HU ■ USB3.0-Cooled 16-bit X-ray CCD Flat Panel Sensor - Examples of high-speed imaging with USB3.0 - Evaluation of density resolution ■ Wire Bonding Inspection ■ FLEX-Nano445CT Imaging Example-1 (Wood Materials), etc. *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

The X-ray fluoroscopy device (X-ray inspection device) "FLEX-M863" combines a 1.5 million pixel CCD sensor arranged in a grid of 1500×1000 pixels, each measuring 20×20μm, with a compact micro-focus X-ray source, allowing for high-definition images with a resolution of 2μm at 10x magnification. It does not use lead except for the shielding glass. Additionally, it operates with an ultra-low power consumption of 150W, making it an environmentally friendly device. The operation is computer-based and can be easily managed with a joystick and mouse, and the captured data can be stored on the computer's hard disk, facilitating information sharing and application to traceability systems. 【Features】 ○ 2μm resolution at 10x magnification ○ High-definition images comparable to high definition with 1.5 million pixels ○ Open design that prioritizes ease of use and safety ○ Tilt table with approximately 17 degrees of inclination ○ Built-in electric zoom and tilt mechanism For more details, please contact us or download the catalog.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

- Suitable for comprehensive X-ray inspection of small parts and circuit boards (fluoroscopy, 3D tomography, 3D imaging). - Pixel resolution is approximately 2µm at maximum magnification. - Power consumption is 150W for the main unit, making it energy-efficient. - Equipped with a 3DCT (three-dimensional computed tomography) function that can capture high-resolution images down to the plastic composition. - Being one of the smallest devices in the world, it can be installed next to an optical microscope or on a laboratory bench.

• X-ray inspection equipment

It is ideal for welding inspection (radiography and 3D CT) of steel plates up to 15mm thick.

• X-ray inspection equipment

The "FLEX-M863" is an X-ray fluoroscopy device (X-ray inspection device) with a 10x magnification and a resolution of 2μm, providing high-definition images comparable to high definition with 1.5 million pixels. It is lead-free except for the shielding glass, and it also has an ultra-low power consumption of 150W. Additionally, a large special X-ray shielding glass is placed on the front door, and the built-in cross laser line marker allows for easy confirmation of the internal sample and alignment for photography. 【Features】 ■ No lead is used except for the shielding glass ■ Ultra-low power consumption of 150W ■ Easy operation with a computer-based joystick and mouse ■ Equipped with a tilt table with approximately 17 degrees of inclination on both sides *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

The "FLEX-U1RT" is a table unit designed to rotate samples around an axis parallel to the X-axis. It can rotate 360 degrees with a size of 40mm in width and 200mm in length. By using the optional CT software, it is also possible to capture 3D CT images of samples with diameters ranging from 1mm to 10mm. *For more details, please refer to the PDF materials or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

The "FLEX-U2PS" is a unit designed to reproducibly set printed circuit boards ranging from 50mm x 50mm to 240mm x 320mm on the sample table of the device. Even during operations such as tilting the board, there is no shifting of the board. *For more details, please refer to the PDF materials or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

The "FLEX-U3DS" is a PCB fixture for observing the implementation state of BGA. It can be set at a position where the board is rotated 45 degrees and tilted at a 60-degree angle. Additionally, we offer a table unit "FLEX-U1RT" for rotating samples around an axis parallel to the X-axis, as well as a fixture table unit for mounted boards, "FLEX-U2PS." *For more details, please refer to the PDF materials or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

The "Stereo X-ray Image 3D Analysis Device" provides a high-speed and high-precision 3D measurement method suitable for industrial applications by performing 3D measurements using only X-ray images from two directions, unlike X-ray CT. This product can be applied for various purposes and allows for precise measurement and detailed examination of the bonding wires inside semiconductor packages from multiple viewpoints. 【Features】 ■ High-precision 3D measurement ■ Precise calibration ■ Applicable for various purposes *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

The "FLEX-M Series" is an X-ray inspection device (X-ray inspection equipment) that is optimal for X-ray inspection (fluoroscopy, cross-sectional observation, 3D) of small components and circuit boards. It can easily process large volumes of data with computer-based data processing. It features an ultra-energy-saving design. 【Product Lineup】 ○FLEX-M345: One of the world's smallest 3D CT machines ○FLEX-M863: Desktop standard model ○FLEX-MH867: Penetration capability for 15mm steel plates For more details, please contact us or download the catalog.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

This is a compact heating unit that can perform thermal treatment of samples while controlling the temperature according to a programmed temperature profile, with flat glass heaters arranged on the top and bottom. 【Features】 ■ The glass heaters are made of thin quartz glass, allowing them to be integrated into X-ray imaging devices (X-ray inspection equipment) to observe temperature changes and X-ray imaging simultaneously. ■ The glass heaters are also transparent to visible light, enabling photography with visible light cameras. ■ Any temperature from room temperature up to a maximum of 300°C and the time to reach that temperature can be set. For more details, please contact us or download the catalog.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

We would like to introduce a product that applies "Smart X-ray." The "3D Image Visualization System BS-VA" is a 3D CT image measurement and analysis software designed to analyze image information in more detail from the 3D image data created by BEAMSENSE CT. It was developed in collaboration with iPlants System Co., Ltd., a venture originating from Iwate Prefectural University. 【Applicable Uses】 - Measurement of distances and angles between two or multiple points within a 3D image - Calculation of the size, number, and volume ratio of voids within a three-dimensional image - Calculation of volume ratios of materials with significantly different absorption coefficients - Creation of STL data for 3D printers *For more details, please refer to the PDF materials or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

We would like to introduce products that utilize "Smart X-ray." Our company is advancing research and development in pursuit of new possibilities for "Smart X-ray" by capturing sub-micron fine X-ray fluoroscopic images using high-precision X-ray CCD technology and ultra-fine nano-focus X-ray fluoroscopy devices (X-ray inspection devices). In the future, we will continue to develop technology that allows X-ray fluoroscopy to be applied to fields previously considered impossible by integrating high magnification at the level of electron microscopes with three-dimensional image reconstruction software technology. 【FLEX-NANO445 Applications】 ■ Confirmation of the shape of wire bonds and TSVs at the 1μm level ■ Observation of resin materials that easily transmit X-rays is possible *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

We would like to introduce a product that applies "smart X-ray" technology. The 'FLEX-M345CT', a micro-focus X-ray CT device, utilizes high-precision X-ray CCD sensor technology and a compact micro-focus X-ray source to capture micron-level detailed X-ray CT images with the world's smallest dimensions, thereby expanding the applications of X-ray CT. Additionally, it can now be applied to observe the orientation of fiber materials such as CFRP and the mixing state of resin materials. 【Applicable Uses】 - Observation of voids in wire bonds and sealing materials of LSI - Observation and measurement of internal structures and shapes of small components such as LEDs and batteries - Internal observation and measurement of resin materials that easily transmit X-rays - Observation and measurement of the internal structures of solder joints and voids in printed circuit boards - Observation and measurement of the internal structures of various sensors *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

We would like to introduce a product that applies "Smart X-ray." The "CT Image Quantification System" uses the world's smallest X-ray CT device, the "FLEX-M345CT," to synthesize X-ray CT images from micron-level fine X-ray transmission images, and further convert that image data into CAD data. The goal is to perform 3D image processing of each component part using the 3D image processing system "BS-VE" from the obtained 3D CT data, and to create CAD data based on that processing. *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

We would like to introduce a product that applies "Smart X-ray." "BGA Pro" assists in soldering analysis by calculating and processing image signal changes of BGA and CSP that are not visible in regular X-ray transmission images, quantifying their size and position, and clearly displaying the internal condition of the solder. 【Applicable Uses】 ■ By quantifying the void state of BGA and CSP, it can evaluate the soldering condition. ■ Understanding the void state can be utilized as information for setting conditions such as reflow. *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

We would like to introduce a technology that applies "smart X-ray." Our company has improved an X-ray transmission imaging device that has a proven track record in analyzing double-layer printed circuit boards. By using stereo imaging for three-dimensional measurement, we have developed a technology that separates and visualizes the wiring and metal patterns within multilayer printed circuit boards layer by layer. By utilizing this technology, it becomes possible to analyze the circuit patterns within multilayer printed circuit boards non-destructively. 【Applicable Uses】 - Comparison of differences between manufactured printed circuit boards and design drawings using Gerber data - Detection inspection of fragile areas that are difficult to identify with electrical testing - Analysis of existing board patterns for the manufacturing and design of new printed circuit boards *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

We would like to introduce a technology that applies "smart X-ray." Our company has developed a technology that separates and visualizes the wiring and metal patterns within multilayer printed circuit boards by differentiating X-ray transmission images obtained by cutting the printed circuit board layer by layer. By utilizing this technology, it becomes possible to analyze the circuit patterns within multilayer printed circuit boards. 【Applicable Uses】 ■ Comparison of differences between manufactured printed circuit boards and design drawings in Gerber data ■ Pattern analysis of existing boards ■ Remanufacturing of printed circuit boards without manufacturing data *For more details, please refer to the PDF materials or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

We would like to introduce a product that utilizes "Smart X-ray." The X-ray CCD flat panel sensor, which has a 16-bit density resolution and transmits images via USB 3.0, improves data transfer speed and allows for capturing and displaying more delicate images. Additionally, with a resolution of 750x500 pixels, it can save 3 frames of semi-video per second. [Overview] - Images that could not be distinguished with 14-bit resolution are displayed with 4 times the detail, providing more delicate images. - Smooth expression and storage of semi-video thanks to high-speed transfer via USB 3.0. *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

We would like to introduce a product that applies "Smart X-ray." The 'X-ray CCD Flat Panel Sensor' has a 16-bit density resolution for image transmission via USB 3.0, which improves data transfer speed and allows for capturing and displaying more delicate images. Additionally, with a resolution of 750x500 pixels, it can save 3 frames per second of quasi-video. 【Applications】 ■ Recognizes and displays samples with density differences that were difficult to distinguish with 14-bit resolution due to 16-bit processing. ■ Smooth expression and storage of quasi-video thanks to the high-speed transfer of USB 3.0. *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

We would like to introduce a technology that applies "smart X-ray" imaging. Our company has developed a technology that diagnoses images of the interior of IC chips using X-ray imaging, allowing for the detection of defects such as wire bonding disconnections, shorts, and bends. By utilizing this technology, it becomes possible to conduct defect inspections occurring within the IC. 【Applicable Uses】 ■ Defect inspection of IC chips occurring in the process after wire bonding. ■ Re-inspection of lot-out products. ■ Confirmation of finishing for each manufacturing lot. *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

We would like to introduce a product that applies "Smart X-ray". Our company has developed a compact nano-focus X-ray CT device by combining a high-performance X-ray CCD sensor, a nano-focus X-ray device, and the drive mechanism of "FLEX-M345". Thanks to our unique X-ray CCD sensor, it is now possible to perform X-ray CT imaging of cellulose fibers in wood-based materials. 【Applications】 ■ 3D observation of the internal distribution of cellulose in wood-based materials ■ Observation of the internal distribution of carbon fiber materials ■ Observation of resin filling conditions and voids *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment

We would like to introduce a product that applies "Smart X-ray." The "X-ray Image BSFM Analysis Simulation Software" allows for the display and analysis of image data ".tmp" captured with BEAMSENSE FLEX on a separate computer from the controller PC of the X-ray fluoroscopy device (X-ray inspection device), which has been a long-standing request. It is useful for detailed analysis of captured images, simulation analysis of data, creation of report images, and for learning how to operate the device. 【Applicable Uses】 ■ Evaluation of ".tmp" images without location restrictions ■ Utilization of the device's image processing functions ■ Easy comparison of data from other companies or different departments *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment
• Other measurement, recording and measuring instruments
• Other image-related equipment