JAPAN FINE CERAMICS CO., LTD. （JFC） List of Products and Services

It is a composite material in which metal silicon is impregnated into SiC ceramic porous bodies. By changing the ratio of SiC, it is possible to achieve a thermal conductivity that matches the needs. It has low thermal expansion and is attracting attention as an alternative material to various materials.

• Ceramics
• Fine Ceramics
• Composite Materials

We have significantly reduced the cost of high-performance MMC using the die-casting method. ● Features of die-cast MMC 1. Low thermal expansion: 2/3 that of aluminum 2. High thermal conductivity: greater than aluminum 3. Lightweight and high rigidity: as light as aluminum with a Young's modulus greater than that of cast iron

• Other metal materials

A high-purity alumina substrate created from our unique ceramic thin plate manufacturing technology. Its high strength, resulting from high purity, makes it less prone to cracking and allows for thinner substrates, making it suitable for high-performance sensors.

• Printed Circuit Board
• Fine Ceramics
• Other electronic parts

■Low surface roughness ■High bending strength ■Low dielectric loss ■Dense

• Printed Circuit Board

We provide ultra-high precision resistors that can be used from DC to high frequency in conjunction with laser trimming technology. 【Features】 ○ Achieves an extremely low temperature coefficient of resistance (TCR) that is not seen in conventional products through special film processing technology based on Ta2Nx (tantalum nitride) material, which has excellent environmental resistance. ○ Types of resistors: Various resistors can be manufactured - Circuit configuration resistors: Chip resistors (SMD) and network resistors - Also compatible with other types such as W/B type, soldered type, and solder bump type. ○ Substrate materials: - Alumina substrates (purity 99.5%, 99.9%) - Others (please consult separately) ○ Conductor film composition: - Ti/Pd/Au - Ti/Pd/Cu/Ni/Au - Ti/Pt/Au ● For other functions and details, please contact us.

• Resistors

【Features】 ○ AuSn composition: Au:Sn=7:3 (standard) (other compositions are also available) ○ Standard film thickness (t): 3μm ○ Film thickness tolerance: ±20% ○ Pattern minimum dimension (D): 50μm ○ Pattern tolerance: ±10μm ● For other functions and details, please contact us.

• Other electronic parts

We provide thin film integrated circuit components with circuit formation on substrates that have undergone various through-hole processing and slitting. 【Features】 ○ Formation of side patterns (0.38t or more) and AuSn solder patterns ○ Simultaneous mounting of conductors, thin film resistors, and thin film inductors ○ Low loss and low noise circuit formation in high-frequency bands made possible by the combination of our unique 99.9% alumina substrate and fine patterns ○ Substrate materials: Aluminum nitride substrates (AlN substrates), quartz substrates, etc. ○ Total technology development, quality assurance, and problem-solving made possible by being a substrate manufacturer ○ We provide quality according to product functions and specifications, and we respond quickly to short delivery times and design changes. For other functions and details, please contact us.

• Other electronic parts

"Metal ceramic composite material with rigidity exceeding that of cast iron due to the lightness of aluminum" Aluminum is light but bends. Iron does not bend but is heavy. This is a new material that solves the designer's dilemma. In addition to excellent specific rigidity, its outstanding thermal properties of low thermal expansion and high thermal conductivity make it suitable for movable stages. The adoption of MMC is progressing in high-speed moving parts of mountings and machine tools. It meets diverse needs through gravity casting, low-pressure casting, and die casting methods.

• Mounter
• Other semiconductor manufacturing equipment
• Other industrial robots

Metal-ceramic composite materials with the rigidity exceeding that of cast iron due to the lightweight of aluminum. Their excellent specific rigidity, high thermal conductivity, and low thermal expansion make them suitable for enclosures. We can meet diverse needs through die casting, gravity casting, and low-pressure casting. We are also capable of developing other composite materials, so please feel free to contact us regarding this opportunity.

• Ceramics
• Fine Ceramics
• Composite Materials

It is a composite material containing SiC ceramic particles in Si alloy. It has higher bending rigidity than crystalline Si, and there is no occurrence of cracking or chipping during use, allowing for stable film formation until the end. With a film formation rate (deposition speed) 1.3 times that of crystalline Si targets, efficient film formation is possible.

• Sputtering Equipment
• Other metal materials
• Fine Ceramics

By combining SiC and aluminum, we have achieved an increase in fracture toughness while maintaining the wear resistance of ceramics. It is being adopted as a liner material in various crushing equipment. For more details, please download the catalog.

• Ceramics
• Fine Ceramics
• Composite Materials

1. We have developed a composite material, SA001, made of metallic silicon and aluminum. It is lighter than aluminum, has a higher Young's modulus than cast iron, and boasts a specific stiffness that is twice that of aluminum, marking the birth of a super material. ● Adoption achievements: Parts for high-precision 3D measuring machines, parts for semiconductor manufacturing equipment ● Application proposal: Temperature control plates for electrostatic chucks *By changing the material from aluminum to SA001, we have resolved the thermal expansion difference issue with alumina ESC. 2. Introduction of bonding technology for composite materials MMC Our unique bonding technology for composite materials MMC has made it possible to create hollow structures and integrated flow paths.

• Other metal materials

By combining SiC ceramics with metallic silicon, we have achieved high thermal conductivity that surpasses ceramics and low thermal expansion comparable to silicon. Thermal conductivity that exceeds SiC and AlN! By changing the composite ratio, various properties can be realized. Surface treatment (plating) is possible, and it can also be used for electrostatic chucks. It can be made larger than ceramics. We also offer a combination of SiC and aluminum. For more details, please refer to the PDF catalog.

• Ceramics
• Fine Ceramics
• Other metal materials

We have developed a composite material SA001 made of metallic silicon and aluminum. This super material is lighter than aluminum, has a higher Young's modulus than cast iron, and boasts a specific stiffness that is twice that of aluminum. Thanks to our joining technology, it can also accommodate hollow structures and built-in flow paths. ● Adoption achievements: Parts for high-precision 3D measuring machines, parts for semiconductor manufacturing equipment ● Application proposal: Temperature control plates for electrostatic chucks * By changing the material from aluminum to SA001, we can resolve the thermal expansion difference issue with alumina ESC.

• Other metal materials
• aluminum
• Composite Materials

We have prepared a φ450mm (18-inch) fixture for semiconductor equipment compatible with φ450mm (18-inch) wafers. Since standard Si wafers are still quite expensive and carry a risk of damage, those who are having difficulty using them freely are encouraged to contact us. Please try our composite materials as fixtures for transport tests and adhesion tests.

• Fine Ceramics
• Other semiconductor manufacturing equipment