JAPAN FINE CERAMICS CO., LTD. （JFC） Product Lineup

We provide thin film integrated circuit components with circuit formation on substrates that have undergone various through-hole processing and slitting. 【Features】 ○ Formation of side patterns (0.38t or more) and AuSn solder patterns ○ Simultaneous mounting of conductors, thin film resistors, and thin film inductors ○ Low loss and low noise circuit formation in high-frequency bands made possible by the combination of our unique 99.9% alumina substrate and fine patterns ○ Substrate materials: Aluminum nitride substrates (AlN substrates), quartz substrates, etc. ○ Total technology development, quality assurance, and problem-solving made possible by being a substrate manufacturer ○ We provide quality according to product functions and specifications, and we respond quickly to short delivery times and design changes. For other functions and details, please contact us.

■Low surface roughness ■High bending strength ■Low dielectric loss ■Dense

We provide ultra-high precision resistors that can be used from DC to high frequency in conjunction with laser trimming technology. 【Features】 ○ Achieves an extremely low temperature coefficient of resistance (TCR) that is not seen in conventional products through special film processing technology based on Ta2Nx (tantalum nitride) material, which has excellent environmental resistance. ○ Types of resistors: Various resistors can be manufactured - Circuit configuration resistors: Chip resistors (SMD) and network resistors - Also compatible with other types such as W/B type, soldered type, and solder bump type. ○ Substrate materials: - Alumina substrates (purity 99.5%, 99.9%) - Others (please consult separately) ○ Conductor film composition: - Ti/Pd/Au - Ti/Pd/Cu/Ni/Au - Ti/Pt/Au ● For other functions and details, please contact us.

【Features】 ○ AuSn composition: Au:Sn=7:3 (standard) (other compositions are also available) ○ Standard film thickness (t): 3μm ○ Film thickness tolerance: ±20% ○ Pattern minimum dimension (D): 50μm ○ Pattern tolerance: ±10μm ● For other functions and details, please contact us.

A high-purity alumina substrate created from our unique ceramic thin plate manufacturing technology. Its high strength, resulting from high purity, makes it less prone to cracking and allows for thinner substrates, making it suitable for high-performance sensors.

We form thin-film integrated circuits on various high-intensity, high thermal conductivity ceramic substrates. ● Formation of air bridges, side patterns (0.3t or more), and AuSn solder patterns ● Simultaneous mounting of conductors, thin-film resistors, and thin-film inductors ● Circuit formation with low dielectric loss and low noise in the high-frequency range through the combination of our unique 99.9% alumina substrate and fine patterns ● Substrate materials: alumina, aluminum nitride, zirconia, quartz

This product was originally used by users who bonded two circuit boards together (after joining with solder, paste, and adhesive), and it was created with the concept of providing it as a "single integrated component." By making it a single component, (1) the user's effort and costs for joining are reduced, and (2) thermal conduction loss from joining materials has been eliminated. Furthermore, it has become possible to form thin-film integrated circuits on stepped ceramic substrates. [Application Example] The step difference between the upper and lower circuit boards is adjusted to match the thickness of the laser element, which is mounted on the lower board. This allows the top surface of the laser element and the upper circuit board to be at the same height, enabling wire bonding at the shortest distance.

The 5th generation mobile communication system (5G) services have started, and its impact on autonomous driving and telemedicine is anticipated. These technologies utilize high frequencies known as microwaves and millimeter waves to transmit large volumes of data at high speeds with low latency. However, conventional multi-layer ceramic capacitors (MLCCs) face the challenge that the stacked internal electrodes become inductive components at high frequencies, leading to degraded performance. The single-layer capacitors (SLC) developed by JFC have a simple structure with electrodes only on the front and back of the dielectric, which helps suppress inductive components and achieve excellent performance even at high frequencies. The next generation of 5G, known as 6G, will operate at even higher frequencies, and the demand for single-layer capacitors is expected to continue to grow in the future, with various applications anticipated.

By using alumina with a purity of 99.9%, we provide fine circuit patterns (line/space=30um/30um) that enable operation in the 30GHz band required for next-generation wireless communication systems. 【Thin Film Integrated Circuits】 We pattern integrated circuits on various ceramic substrates. ●Side patterns (over 0.3t), and AuSn solder patterns is possible. ● Simultaneous mounting of conductors, thin film resistors, and thin film inductors is possible. ● The combination of our unique 99.9% alumina substrate and fine patterns allows for the formation of circuits with low dielectric loss and low noise in high-frequency bands. ● For substrate materials, we also accommodate aluminum nitride (ALN) substrates, quartz substrates, and more. 【High-Quality Alumina Substrates】 ● Dense ● The three-point bending strength is 660MPa, which is significantly higher than conventional products (about twice as much). ● Excellent electrical properties with low dielectric loss in high-frequency bands.