新興製作所 Product Lineup

○ Cutting Processing of Materials Shinko Seisakusho began mass production processing using a fixed abrasive method in 2009 and owns a fixed abrasive wire saw for cutting silicon wafers for solar cells. Currently, it achieves a processing yield of over 96% and mass-produces more than 4 million silicon wafers per month. ○ Polishing and Lapping Processing Polishing processing is a method that further flattens and finishes the lapped surface formed during lapping processing to a mirror finish. It uses a soft polishing tool and employs fine particles (micron, sub-micron) as abrasives. ○ Material Development - Single Crystal SiC In 2010, marking the 50th anniversary of its founding, the company started its own material development. Utilizing its technology to handle materials supplied by clients, it aims to focus on developing its own brand of materials in the future. As the first step, it has developed single crystal SiC material, with plans to sell SiC wafers in sight.

A "multi-wire saw" is a device that fixes the workpiece to a descending table and presses it against a wire tool that runs at high speed over guide rollers to perform slicing operations. The "guide rollers" have grooves formed at pitches that match the thickness of the product to be processed. Depending on the pitch, it is possible to wind dozens to thousands of wires. 【Features】 ■ Minimal cutting loss ■ Cost-effective and high yield slicing ■ Good thickness and flatness accuracy ■ Capable of slicing thin sheets of about 0.1mm *For more details, please refer to the PDF document or feel free to contact us.

This document is a glossary of terms from Shinko Seisakusho, a company specializing in ultra-precision processing technologies such as grinding, polishing, cutting, and diamond wire in Osaka, Okayama, and Tsuyama. It provides detailed explanations of terms including "precision cutting processing," "lapping processing," "single-sided processing machine," "surface roughness units," and "optical flat." 【Terms Included (Excerpt)】 ■ Precision Cutting Processing ■ Lapping Processing ■ Polishing Processing (Mirror Finish) ■ Single-Sided Processing Machine ■ Abrasives ■ Polishing Agents *For more details, please refer to the PDF document or feel free to contact us.

Shinko Seisakusho Co., Ltd. offers cutting and polishing technologies as professionals in ultra-precision machining and polishing. With ultra-precision cutting using a multi-wire saw, it is possible to cut materials such as silicon carbide, silicon nitride, cemented carbide, and tungsten. Dicing of small pieces can process tens of thousands of units at once. Additionally, ultra-precision polishing through single-sided and double-sided polishing allows for mirror polishing of φ2mm small pieces, SiC single crystals, and ceramics, with small piece polishing capable of processing tens of thousands of units at once. 【Business Activities】 ■ Precision polishing of mechanical and electronic components ■ Precision cutting of mechanical and electronic components ■ Polishing of optical single crystals *For more details, please refer to the PDF document or feel free to contact us.