新興製作所 List of Products and Services

Polishing processing is a grinding method that finishes a wrapped surface of pear skin into a flat mirror surface. Compared to wrapping processing, the application of pressure during processing remains the same, but the processing liquid and media are completely different. For polishing processing of hard materials, hard polishing using diamond powder is employed, while for oxides and magnetic materials, mechanochemical polishing is used. The surface roughness can achieve levels from sub-micron to nanometers. Additionally, there are both double-sided and single-sided processing machines, and when high precision such as TTV and LTV is required, double-sided machines are used.

○ Cutting Processing of Materials Shinko Seisakusho began mass production processing using a fixed abrasive method in 2009 and owns a fixed abrasive wire saw for cutting silicon wafers for solar cells. Currently, it achieves a processing yield of over 96% and mass-produces more than 4 million silicon wafers per month. ○ Polishing and Lapping Processing Polishing processing is a method that further flattens and finishes the lapped surface formed during lapping processing to a mirror finish. It uses a soft polishing tool and employs fine particles (micron, sub-micron) as abrasives. ○ Material Development - Single Crystal SiC In 2010, marking the 50th anniversary of its founding, the company started its own material development. Utilizing its technology to handle materials supplied by clients, it aims to focus on developing its own brand of materials in the future. As the first step, it has developed single crystal SiC material, with plans to sell SiC wafers in sight.

This document is a glossary of terms from Shinko Seisakusho, a company specializing in ultra-precision processing technologies such as grinding, polishing, cutting, and diamond wire in Osaka, Okayama, and Tsuyama. It provides detailed explanations of terms including "precision cutting processing," "lapping processing," "single-sided processing machine," "surface roughness units," and "optical flat." 【Terms Included (Excerpt)】 ■ Precision Cutting Processing ■ Lapping Processing ■ Polishing Processing (Mirror Finish) ■ Single-Sided Processing Machine ■ Abrasives ■ Polishing Agents *For more details, please refer to the PDF document or feel free to contact us.

Our company specializes in "precision cutting and polishing processing" of a wide range of materials, including ceramics, crystalline materials, glass, metals, and resins. Among these, in our "polishing technology," we utilize two methods: lapping processing and polishing processing (mirror polishing method) to achieve the desired surface roughness. 【Features of Our Polishing Technology】 ■ Capable of processing a wide range of difficult-to-cut materials ■ Can process thousands to tens of thousands of pieces simultaneously ■ We can provide consistent support for SiC single crystals, which are in growing demand in the power semiconductor market, from outer shape processing and cutting to mirror polishing. *For more details, please download the PDF document or feel free to contact us.

At Shinko Seisakusho Co., Ltd., we perform "polishing processing." Polishing processing is a mirror polishing method that finishes a wrapped surface with a pearly texture to a smooth surface. There are methods such as mechanical polishing and chemical mechanical polishing (CMP), and our company appropriately selects the method according to the various material properties from single crystals, ceramics, metals, to resins, and finishes to your desired surface roughness. We can accommodate various requests for surface roughness ranging from sub-micron to nano-order. If you have any concerns regarding the surface condition of your materials, please feel free to contact us. *For more details, please refer to the PDF document or feel free to reach out to us.

Shinko Seisakusho Co., Ltd. offers cutting and polishing technologies as professionals in ultra-precision machining and polishing. With ultra-precision cutting using a multi-wire saw, it is possible to cut materials such as silicon carbide, silicon nitride, cemented carbide, and tungsten. Dicing of small pieces can process tens of thousands of units at once. Additionally, ultra-precision polishing through single-sided and double-sided polishing allows for mirror polishing of φ2mm small pieces, SiC single crystals, and ceramics, with small piece polishing capable of processing tens of thousands of units at once. 【Business Activities】 ■ Precision polishing of mechanical and electronic components ■ Precision cutting of mechanical and electronic components ■ Polishing of optical single crystals *For more details, please refer to the PDF document or feel free to contact us.

Our company specializes in "ultra-precision lapping processing/ultra-precision polishing processing." "Ultra-precision lapping processing" involves performing sliding motion (fitting) while containing free abrasive particles (grinding agents), which polishes the workpiece by micro-cutting, resulting in a flatter finish. "Ultra-precision polishing processing" is a polishing method that finishes the lapped surface to a flat mirror finish. For hard materials, hard polishing processing using diamond powder is employed, while mechanochemical polishing is used for oxides and magnetic materials. 【Features of Ultra-Precision Lapping Processing】 - Free abrasive processing that results in a flatter finish for the workpiece - Achieves high-precision processing surfaces and dimensions - Compatible with a wide range of materials, from ceramics to metals, glass, and single crystals - A processing method has also been developed that uses diamond abrasives fixed to a metal flat plate to generate high-precision surfaces. *For more details, please refer to the PDF document or feel free to contact us.

We also have single wire saws in addition to multi-wire saws. With the single wire saw, it is possible to process large diameter materials and thick plates that are difficult to process with multi-wire saws. By adopting a fixed abrasive method using diamond wire, we can significantly reduce processing loss of expensive materials. 【Main compatible materials】 Aluminum Nitride AlN / Alumina Al2O3 / Sapphire / Silicon Carbide SiC / Copper Cu / Molybdenum Mo / Tungsten W / Copper Molybdenum / Copper Tungsten / Quartz Glass / Lithium Niobate LiNbO3 / Lithium Tantalate LiTaO3 / Barium Titanate BaTiO3 / Zirconia ZrO2 / Silicon Nitride Si3N4 / Cemented Carbide / Ceramic Matrix Composites (CMC) / Crystalline materials (Si, SiC, GaN, etc.) *For more details, please download the PDF catalog or feel free to contact us.