新興製作所 List of Products and Services

At Shinko Seisakusho, mass production processing using the fixed abrasive method, which is becoming a global trend, is possible! We manufacture solar silicon wafers using the fixed abrasive method (diamond wire) with two types of materials: single crystal and polycrystalline. Currently, the yield rate for the fixed abrasive method has achieved over 95% on a mass production basis, with more than 4 million silicon wafers produced per month. 【Main Supported Materials】 Aluminum Nitride (AlN) / Alumina (Al2O3) / Sapphire / Silicon Carbide (SiC) / Copper (Cu) / Molybdenum (Mo) / Tungsten (W) / Copper Molybdenum / Copper Tungsten / Quartz Glass / Lithium Niobate (LiNbO3) / Lithium Tantalate (LiTaO3) / Barium Titanate (BaTiO3) / Zirconia (ZrO2) / Silicon Nitride (Si3N4) / Cemented Carbide (SK Material) / Ceramic Matrix Composites (CMC) *For more details, please download the PDF catalog or feel free to contact us.

○ Cutting Processing of Materials Shinko Seisakusho began mass production processing using a fixed abrasive method in 2009 and owns a fixed abrasive wire saw for cutting silicon wafers for solar cells. Currently, it achieves a processing yield of over 96% and mass-produces more than 4 million silicon wafers per month. ○ Polishing and Lapping Processing Polishing processing is a method that further flattens and finishes the lapped surface formed during lapping processing to a mirror finish. It uses a soft polishing tool and employs fine particles (micron, sub-micron) as abrasives. ○ Material Development - Single Crystal SiC In 2010, marking the 50th anniversary of its founding, the company started its own material development. Utilizing its technology to handle materials supplied by clients, it aims to focus on developing its own brand of materials in the future. As the first step, it has developed single crystal SiC material, with plans to sell SiC wafers in sight.

This document is a glossary of terms from Shinko Seisakusho, a company specializing in ultra-precision processing technologies such as grinding, polishing, cutting, and diamond wire in Osaka, Okayama, and Tsuyama. It provides detailed explanations of terms including "precision cutting processing," "lapping processing," "single-sided processing machine," "surface roughness units," and "optical flat." 【Terms Included (Excerpt)】 ■ Precision Cutting Processing ■ Lapping Processing ■ Polishing Processing (Mirror Finish) ■ Single-Sided Processing Machine ■ Abrasives ■ Polishing Agents *For more details, please refer to the PDF document or feel free to contact us.

At Shinco Manufacturing Co., Ltd., we perform "slicing processing." The cutting technology that started with a wire diameter of 120μm and diamond sizes of 15-25μm (total cutting allowance of 150μm) has now been reduced to a wire diameter of φ60μm and diamond sizes of 6-12μm (total cutting allowance of 75μm), which is half of what it was at that time. Currently, we are receiving positive feedback from customers both domestically and internationally, and we are expanding our fixed abrasive cutting technology, developed through silicon wafer processing for solar cells, into new markets. If you have any issues with cutting technology for various materials, we offer both free abrasive and fixed abrasive methods, so please feel free to contact us. *For more details, please refer to the PDF document or feel free to reach out to us.

Shinko Seisakusho Co., Ltd. offers cutting and polishing technologies as professionals in ultra-precision machining and polishing. With ultra-precision cutting using a multi-wire saw, it is possible to cut materials such as silicon carbide, silicon nitride, cemented carbide, and tungsten. Dicing of small pieces can process tens of thousands of units at once. Additionally, ultra-precision polishing through single-sided and double-sided polishing allows for mirror polishing of φ2mm small pieces, SiC single crystals, and ceramics, with small piece polishing capable of processing tens of thousands of units at once. 【Business Activities】 ■ Precision polishing of mechanical and electronic components ■ Precision cutting of mechanical and electronic components ■ Polishing of optical single crystals *For more details, please refer to the PDF document or feel free to contact us.

Among the various cutting technologies, our company is capable of mass production using the fixed abrasive method, which is becoming a global trend in recent years, through "multi-wire cutting." We excel particularly in ceramics, metals, and crystalline materials. Compared to the free abrasive method, there are various advantages, and we have compiled information on the mechanisms of the free abrasive method and the fixed abrasive method in multi-wire cutting. 【Contents】 ■ What is multi-wire cutting? ■ Cutting process ■ Comparison of free abrasive method and fixed abrasive method ■ Advantages of the fixed abrasive method ■ Summary *For more details, please download the PDF catalog or feel free to contact us.

We also have single wire saws in addition to multi-wire saws. With the single wire saw, it is possible to process large diameter materials and thick plates that are difficult to process with multi-wire saws. By adopting a fixed abrasive method using diamond wire, we can significantly reduce processing loss of expensive materials. 【Main compatible materials】 Aluminum Nitride AlN / Alumina Al2O3 / Sapphire / Silicon Carbide SiC / Copper Cu / Molybdenum Mo / Tungsten W / Copper Molybdenum / Copper Tungsten / Quartz Glass / Lithium Niobate LiNbO3 / Lithium Tantalate LiTaO3 / Barium Titanate BaTiO3 / Zirconia ZrO2 / Silicon Nitride Si3N4 / Cemented Carbide / Ceramic Matrix Composites (CMC) / Crystalline materials (Si, SiC, GaN, etc.) *For more details, please download the PDF catalog or feel free to contact us.