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ゼストロンジャパン

EstablishmentJanuary 2013
capital1000Ten thousand
number of employees9
addressKanagawa/Samukawa-cho, Koza-gun/1-17-16 Ichinomiya
phone0467-53-8658
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last updated:Sep 04, 2025
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ゼストロンジャパン List of Products and Services

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Printed circuit board cleaning Printed circuit board cleaning
Power semiconductor cleaning Power semiconductor cleaning
Package cleaning Package cleaning
Metal mask cleaning Metal mask cleaning
Metal mask cleaning (SMT printer) Metal mask cleaning (SMT printer)
Printing error substrate Printing error substrate
Palette cleaning Palette cleaning
Reflow oven cleaning Reflow oven cleaning
Dispenser nozzle and jig cleaning Dispenser nozzle and jig cleaning
Cleaning Process Management Cleaning Process Management
Cleaning column Cleaning column
Technical data Technical data
Metal

Metal mask cleaning (SMT printer)

In addition to the automatic cleaning of metal masks, it is important to perform back wiping cleaning of the metal mask in the printing machine to maintain optimal and excellent printing quality. The most crucial aspect of back wiping cleaning is the cleaning agent itself. It needs to have excellent cleaning properties, low consumption, and high compatibility with cream solder. During back wiping cleaning, the interaction between the flow of the cleaning agent passing through the openings and the cream solder cannot be avoided. Cleaning agents like IPA (isopropyl alcohol) can affect the viscosity of the cream solder, leading to accumulation and impacting printing quality. Additionally, IPA is volatile, resulting in very high consumption. Zestron's cleaning agents are characterized by their ability to wipe clean, low consumption, and no impact on the viscosity of cream solder. Zestron offers water-based and solvent-based cleaning agents developed for back wiping of metal masks and nano-coated metal masks in printing machines. Furthermore, Zestron's cleaning agents are approved by major printing machine manufacturers and metal mask manufacturers.

Metal Mask Back Cleaning Agent VIGON UC 160

Remove IPA, safe and environmentally friendly! Excellent wettability against non-woven fabric significantly reduces the surrounding area of cream solder.

VIGON UC 160 is a water-based cleaning agent specially designed for use in printers to remove cream solder from metal masks. It has excellent wettability on non-woven fabrics, improving cleaning performance and significantly reducing the residue around the cream solder. As a result, it can suppress solder bridges on the circuit board, leading to reliable printing results. Additionally, it is ideal as a substitute for IPA due to its excellent health and safety properties. 【Features】 ■ Cleaning of the back of metal masks in printers ■ Environmentally friendly and highly safe water-based cleaning ■ No negative impact on paste printability ■ Cost benefits from reduced paper usage ■ Reduced defect rates due to high cleaning performance *For more details, please refer to the PDF document or feel free to contact us.

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Water-based cleaning agent for metal masks - HYDRON SC 300

Since the water-based cleaning agent has no flash point, explosion-proof specifications are not required for the cleaning equipment!

The "HYDRON SC 300" is a water-based cleaning agent developed for cleaning metal masks. It reliably removes cream solder and SMT adhesives at room temperature without leaving any residue on the surface of the metal mask. Additionally, it can be used in both the cleaning and rinsing processes, dries without leaving any cleaning agent residue, and can also be used for wiping the back of printing machines. 【Features】 ■ Exhibits excellent effectiveness in cleaning cream solder and adhesives, leaving no residue ■ Usable in both cleaning and rinsing processes ■ Dries without leaving residue on the metal mask ■ Does not foam even when using a spray cleaning machine ■ Contains less than 20% VOC, implementing environmental measures ■ Excellent material compatibility with metal masks *For more details, please refer to the PDF document or feel free to contact us.

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Water-based cleaning agent for metal masks VIGON SC 200

Sure! Here is the translation: "A water-based metal mask cleaner that reliably cleans cream solder and SMT adhesive, also usable for wiping the back of printing machines."

VIGON SC 200 is a room temperature water-based cleaning agent developed for cleaning metal masks. It is suitable for spray and ultrasonic cleaning machines and can also be used for cleaning test print circuit boards. Depending on the type of flux, it can be used on printed circuit boards that have already been soldered on one side due to printing errors. 【Features】 - It can separate and remove flux from the cleaning solution, extending the life of the cleaning solution and reducing costs. - No need to replace the cleaning solution, which simplifies maintenance. - Improved workability and environmental conservation achieved through low odor, low VOC, and environmentally friendly components. - Safe line management due to no flash point. - Excellent cleaning performance at room temperature (25°C). - Superior cleaning ability for Pb-free, halogen-free, and eutectic solders. *For more details, please refer to the PDF document or feel free to contact us.

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Cleaning agent for metal masks ZESTRON SD 100

Low odor, usable at room temperature! Cream solder cleaning agent for metal masks and screens.

"ZESTRON SD 100" is a solvent-based cleaning agent specially designed for removing cream solder from metal masks, using an explosion-proof spray-type cleaning machine. Depending on the type of flux, it can also be used on misprinted circuit boards. Furthermore, it can be used for back wiping in printing machines and for manual wiping cleaning. Additionally, this product has been approved for use by major manufacturers worldwide in metal mask printers. 【Features】 ■ High contamination retention, leading to long life and reduced maintenance time ■ Excellent drying properties, contributing to shorter cleaning times ■ Low odor, suitable for use at room temperature ■ Suitable for manual wiping cleaning of metal masks and back wiping in printing machines *For more details, please refer to the PDF document or feel free to contact us.

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