ゼストロンジャパン List of Products and Services

"VIGON PE 190A" is a water-based alkaline cleaner specifically designed for spray equipment. Based on MPC technology, it reliably removes flux residues from lead frames, discrete components, power modules, power LEDs, printed circuit boards, and especially from low stand components from below. It also demonstrates excellent effectiveness on severely oxidized or heavily soiled copper surfaces, ensuring superior material compatibility in subsequent processes such as wire bonding, adhesive bonding, and molding. 【Features】 ■ Reliably removes flux residues ■ Prepares copper surfaces in a clean state, activating them for bonding connections ■ Maintains an activated copper surface for an extended period without re-oxidation ■ Particularly excellent material compatibility with dies, without damaging passivation ■ Excellent rinsing properties, does not foam *For more details, please refer to the PDF document or feel free to contact us.

"VIGON PE 194A" is a water-based weak alkaline cleaning agent specially designed for spray and immersion equipment. It has excellent material compatibility with highly sensitizing metals, especially with die materials, and can remove copper oxide films in a short time. Based on MPC technology, it reliably removes flux residues from power semiconductors, lead frames, discrete components, power LEDs, and printed circuit boards. 【Features】 - Effectively removes flux residues from power semiconductors and printed circuit boards - Weakly alkaline, with excellent material compatibility, especially for die and highly sensitizing metals - Prepares copper surfaces in a clean state, activating them for bonding connections - Does not have a flash point, eliminating the need for explosion-proof equipment - Usable with various types of spray equipment *For more details, please refer to the PDF document or feel free to contact us.

"ZESTRON CO 150" is a solvent-based cleaning agent specifically designed for ultrasonic immersion processes. It can be used for pre-cleaning in combination with HFE-based cleaning agents without dilution, or as a co-solvent. It is particularly suitable for cleaning flux residues from eutectic and lead-free no-clean solder on electronic components, power modules, and lead frame-based discrete components. 【Features】 ■ Excellent cleaning performance for eutectic and lead-free solder ■ Improved quality in wire bonding and molding ■ Provides a stable cleaning process due to its composition that is less prone to boiling ■ Allows for a wide range of concentration management in process control ■ Stabilizes the cooling process and contributes to minimizing HFE consumption ■ Since it does not use water, it is possible to keep ion contamination levels low *For more details, please refer to the PDF document or feel free to contact us.

"VIGON PE 215N" is a neutral water-based cleaning agent specifically designed for spray cleaning devices. Thanks to MPC technology, it can reliably remove flux residues from power electronics components, making it particularly suitable for cleaning power modules after die attachment and heat sink soldering. Additionally, it excels in material compatibility and the removal of copper oxide films, which enhances the subsequent processes of wire bonding/adhesive bonding and molding, as it is also effective in removing oxide films from copper substrates. 【Features】 ■ Excellent for cleaning flux from power electronics and power modules ■ Provides activated copper substrates for applications such as adhesive bonding ■ pH neutral, with excellent material compatibility with dies, and does not damage passivation ■ No flash point or foaming, making it suitable for spray cleaning machines without explosion-proof specifications *For more details, please refer to the PDF document or feel free to contact us.

The "ATRON AC 205" is a cleaning agent designed with FAST technology to remove flux residues from circuit boards. This product offers shorter processing times and a longer lifespan. It is particularly suitable for high-pressure inline cleaning equipment that requires very short processing times. Additionally, it is effective on power LEDs, flip chip packages, CMOS, and BGA. 【Features】 ■ Quickly removes advanced lead-free and eutectic solder flux residues ■ Mild composition preserves the shine of solder joints and pads ■ Improves light conversion and lifespan of power LEDs, as well as the quality of wire bonding ■ Does not contain harmful substances such as ethanolamine ■ Very low VOC values *For more details, please refer to the PDF document or feel free to contact us.

The "ATRON AC 207" is a cleaning agent developed based on FAST technology for processing at particularly low concentrations. It improves the cleaning ability and liquid lifespan of conventional surfactant-based cleaners, and has been developed to be effective on metals with high sensitization. Due to its mild formulation and low concentration specifications, this product demonstrates excellent material compatibility with highly sensitizing metals such as aluminum, brass, and nickel. 【Features】 - Excellent cleaning ability even at low concentrations and low temperatures - Rapid removal of advanced lead-free and eutectic fluxes across a wide variety - Maintains the gloss of solder joints and pads due to its mild formulation - Removes adhesive flux and maintains void-free underfill - Improves wire bonding quality in power modules - Long lifespan and low VOC values *For more details, please refer to the PDF document or feel free to contact us.

"VIGON PE 180" is a neutral water-based cleaning agent developed for the removal of flux from power electronics and printed circuit boards using spray equipment. It effectively removes flux and is a product with excellent material compatibility. It is used for flux removal from lead frames, discrete components, power modules, power LEDs, and printed circuit boards. Additionally, it excels in removing oxide films from copper surfaces to improve wire bonding/adhesive bonding in the next process and molding properties. 【Features】 ■ Exhibits excellent effectiveness in flux removal ■ Activates copper surfaces without staining ■ Shows excellent material compatibility due to its neutrality ■ Good rinsability due to MPC composition ■ Does not require explosion-proof equipment as it has no flash point *For more details, please refer to the PDF document or feel free to contact us.

"VIGON A 200" is a water-based cleaning agent specially designed for use in high-pressure and medium-pressure spray equipment, such as inline and batch systems. Based on MPC technology, it is capable of removing various types of flux residues from electronic substrates, ceramic substrates, power modules, and lead frames. It meets high cleanliness requirements for subsequent processes such as wire bonding and coating. 【Features】 - Maintains high cleanliness for wire bonding and coating processes - Free of surfactants and excellent rinsability, leaving no residues on surfaces - Easily filterable, extending liquid life and reducing cleaning agent costs - No flash point, allowing for introduction into immersion tanks without explosion-proof specifications - Does not foam even in high-pressure spray applications - Halogen-free and low odor *For more details, please refer to the PDF document or feel free to contact us.

"VIGON A 201" is a flux cleaner that demonstrates excellent performance in spray cleaning in fine spaces such as under low stand-off components. This product, which is an MPC-based cleaner used at low concentrations, is particularly suitable for removing flux residues from no-clean solder that is eutectic and lead-free. It maintains a glossy solder joint surface without additives after cleaning. Additionally, it is suitable for removing tacky flux from flip chips and CMOS. 【Features】 ■ Cleans low stand-off components effectively ■ Particularly effective for lead-free no-clean solder ■ Maintains gloss on soldered areas of the substrate after cleaning ■ Long liquid life, low maintenance costs, and reduced cost per cleaned component ■ Easy rinsing, leaving no residues on the surface *For more details, please refer to the PDF document or feel free to contact us.

"VIGON N 640" is a specially designed neutral cleaning agent for the removal of flux from printed circuit boards. It is suitable for use in batch spray cleaning machines. It offers excellent cleaning performance against advanced cream solder and fluxes that are generally difficult to remove. Additionally, it has excellent material compatibility with highly sensitizing metals such as copper and nickel. 【Features】 ■ Suitable for use in batch spray cleaning machines ■ Excellent operability, maintaining a constant concentration between the tank and chamber ■ Effective against difficult-to-remove cream solder ■ Can be easily rinsed with ion-exchanged water ■ High material compatibility due to its neutral nature *For more details, please refer to the PDF document or feel free to contact us.

"VIGON N 680" is a neutral cleaning agent specially designed for water-based spray cleaning (inline and batch). It effectively removes various flux residues from electronic circuit boards and can penetrate and clean even low stand-off components very well. Additionally, it has excellent material compatibility with metals that are highly sensitizing, such as copper. Please feel free to contact us if you have any inquiries. 【Features】 ■ Particularly excellent for cleaning under low stand-off components ■ High rinsability provides a wide range of applications ■ Superior material compatibility with highly sensitizing metals like copper and aluminum ■ Sufficient effectiveness even at low concentrations depending on the process ■ Can be sent to wastewater treatment without neutralization *For more details, please refer to the PDF document or feel free to contact us.

VIGON N 600 is a neutral water-based flux cleaning agent. It has been developed for inline and batch spray, as well as immersion methods. Its neutral pH and excellent cleaning ability allow it to remove a wide variety of flux residues from substrates, making it an unprecedented cleaning agent. Additionally, because it is neutral, this cleaning agent has high material compatibility with metals and polymers that are highly sensitizing. 【Features】 ■ Excellent material compatibility due to neutral pH ■ Superior cleaning ability for various types of flux ■ Flux is expelled from the system via a filter, resulting in a long liquid life ■ Low VOC, environmentally friendly cleaning agent *For more details, please refer to the PDF document or feel free to contact us.

VIGON US is a water-based cleaning agent specifically designed for ultrasonic, spray, and centrifugal cleaning devices. It removes all types of flux residues from electronic substrates, flip chips, and CMOS. 【Features】 - Excellent flux cleaning performance with ultrasonic and spray methods - Low VOC and environmentally friendly due to being water-based - Proven performance in cleaning flip chips and BGAs - Long-lasting cleaning solution due to effective flux separation and removal - No flash point, ensuring high operational safety *For more details, please refer to the PDF document or feel free to contact us.

ZESTRON FA+ is a solvent-based cleaner developed to wash away all types of flux residues from electronic components, ceramic composite substrates, power modules, and lead frames. It features excellent cleaning performance and a high contamination tolerance, resulting in an exceptionally long liquid lifespan. 【Features】 ■ Excellent cleaning power and long cleaning liquid lifespan ■ Halogen-free and biodegradable ■ Improves the quality of wire bonding/molding for power modules, lead frame-based discretes, and power LEDs ■ Achieves void-free underfill by completely removing sticky flux from flip chips and CMOS, enhancing image resolution *For more details, please refer to the PDF document or feel free to contact us.

ZESTRON VD is a solvent-based cleaning agent. It can remove flux residues from electronic components, ceramic composite substrates, and lead frame-based discretes in a closed-system single-chamber vacuum cleaning machine. 【Features】 ■ Excellent cleaning performance for a wide variety of solvent-based fluxes ■ Distillation regeneration is possible, compatible with single-chamber vacuum distillation and steam rinse processes ■ Immersion cleaning and rinsing can be performed with a single solution ■ Free of surfactants ■ Contains no halogen compounds such as chlorine, fluorine, or bromine *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce the "Cleaning Test" conducted by Zestron Japan Co., Ltd. From our technical center, you can choose a device that meets your requirements from our inline and batch-type spray, jet, and ultrasonic equipment, and try cleaning workpieces under conditions equivalent to those in a production environment using spray or immersion processes (ultrasonic or jet). Our engineers will propose suitable cleaning equipment, and while conducting the cleaning test, we will analyze the cleanliness at our analysis center. 【Test Flow (Partial)】 ■1. Hearing ■2. Cleaning Test ■3. Cleanliness Analysis ■4. Report Submission *The PDF document is a company brochure.

Electronics assembly refers to the technology of mounting electronic components onto a substrate. Specifically, it involves the process of joining components such as semiconductors, resistors, and capacitors to a printed circuit board to form an electrical circuit. The sizes of these components tend to become smaller in response to the demands for higher performance and space-saving in products, and accordingly, fine joining technologies are also evolving. This has a significant impact on the cleaning processes as well. We will explain the evolution of joining technologies and cleaning in fine joining. *For detailed content of the article, you can view it through the related links. For more information, please download the PDF or feel free to contact us.*