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ゼストロンジャパン

EstablishmentJanuary 2013
capital1000Ten thousand
number of employees9
addressKanagawa/Samukawa-cho, Koza-gun/1-17-16 Ichinomiya
phone0467-53-8658
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last updated:Sep 04, 2025
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ゼストロンジャパン List of Products and Services

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Printed circuit board cleaning Printed circuit board cleaning
Power semiconductor cleaning Power semiconductor cleaning
Package cleaning Package cleaning
Metal mask cleaning Metal mask cleaning
Metal mask cleaning (SMT printer) Metal mask cleaning (SMT printer)
Printing error substrate Printing error substrate
Palette cleaning Palette cleaning
Reflow oven cleaning Reflow oven cleaning
Dispenser nozzle and jig cleaning Dispenser nozzle and jig cleaning
Cleaning Process Management Cleaning Process Management
Cleaning column Cleaning column
Technical data Technical data
Power

Power semiconductor cleaning

Zestron provides aqueous and solvent-based cleaners for the cleaning of power semiconductors (power electronics) such as DCB, IGBT modules, discrete components on lead frames, and power LEDs. Zestron's cleaners are appropriately suited for any process, such as bonding and molding, and deliver optimal results when conducting shear tests and power cycle tests. - Power module cleaning - Cleaning of lead frame-based and discrete components - Power LED cleaning

Cleaning agent for power semiconductors and printed circuit boards / VIGON PE 194A

Weakly alkaline flux cleaner, excellent rinsing properties, does not foam, suitable for spray and immersion equipment!

"VIGON PE 194A" is a water-based weak alkaline cleaning agent specially designed for spray and immersion equipment. It has excellent material compatibility with highly sensitizing metals, especially with die materials, and can remove copper oxide films in a short time. Based on MPC technology, it reliably removes flux residues from power semiconductors, lead frames, discrete components, power LEDs, and printed circuit boards. 【Features】 - Effectively removes flux residues from power semiconductors and printed circuit boards - Weakly alkaline, with excellent material compatibility, especially for die and highly sensitizing metals - Prepares copper surfaces in a clean state, activating them for bonding connections - Does not have a flash point, eliminating the need for explosion-proof equipment - Usable with various types of spray equipment *For more details, please refer to the PDF document or feel free to contact us.

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Power semiconductor and printed circuit board water-based cleaning agent VIGON PE190A

No explosion-proof equipment is required as it does not have a flash point! Usable with various types of spray devices.

"VIGON PE 190A" is a water-based alkaline cleaner specifically designed for spray equipment. Based on MPC technology, it reliably removes flux residues from lead frames, discrete components, power modules, power LEDs, printed circuit boards, and especially from low stand components from below. It also demonstrates excellent effectiveness on severely oxidized or heavily soiled copper surfaces, ensuring superior material compatibility in subsequent processes such as wire bonding, adhesive bonding, and molding. 【Features】 ■ Reliably removes flux residues ■ Prepares copper surfaces in a clean state, activating them for bonding connections ■ Maintains an activated copper surface for an extended period without re-oxidation ■ Particularly excellent material compatibility with dies, without damaging passivation ■ Excellent rinsing properties, does not foam *For more details, please refer to the PDF document or feel free to contact us.

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Water-based flux cleaner for power semiconductors VIGON PE215N

No ignition point! Prevents re-oxidation of copper substrates with effective rinsing! Long-term protection of activated copper substrates.

"VIGON PE 215N" is a neutral water-based cleaning agent specifically designed for spray cleaning devices. Thanks to MPC technology, it can reliably remove flux residues from power electronics components, making it particularly suitable for cleaning power modules after die attachment and heat sink soldering. Additionally, it excels in material compatibility and the removal of copper oxide films, which enhances the subsequent processes of wire bonding/adhesive bonding and molding, as it is also effective in removing oxide films from copper substrates. 【Features】 ■ Excellent for cleaning flux from power electronics and power modules ■ Provides activated copper substrates for applications such as adhesive bonding ■ pH neutral, with excellent material compatibility with dies, and does not damage passivation ■ No flash point or foaming, making it suitable for spray cleaning machines without explosion-proof specifications *For more details, please refer to the PDF document or feel free to contact us.

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Flux cleaner VIGON PE180 for power semiconductors and PCBs

No flash point! Neutral water-based cleaner is also excellent for removing oxide films from copper surfaces.

"VIGON PE 180" is a neutral water-based cleaning agent developed for the removal of flux from power electronics and printed circuit boards using spray equipment. It effectively removes flux and is a product with excellent material compatibility. It is used for flux removal from lead frames, discrete components, power modules, power LEDs, and printed circuit boards. Additionally, it excels in removing oxide films from copper surfaces to improve wire bonding/adhesive bonding in the next process and molding properties. 【Features】 ■ Exhibits excellent effectiveness in flux removal ■ Activates copper surfaces without staining ■ Shows excellent material compatibility due to its neutrality ■ Good rinsability due to MPC composition ■ Does not require explosion-proof equipment as it has no flash point *For more details, please refer to the PDF document or feel free to contact us.

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Neutral flux cleaner for semiconductors - HYDRON SE 220

Excellent material compatibility! It is possible to remove flux residues generated during die attachment and finish the subsequent processes to an optimal surface condition.

"HYDRON SE 220" is a one-phase type water-based cleaning agent for immersion processes. It removes flux residues generated during die attach and other processes from various semiconductor packages such as lead frames, discrete components, power modules, power LEDs, flip chips, and CMOS. Due to its one-phase structure, it demonstrates excellent process manageability and good rinsability, allowing for a suitable surface condition for subsequent processes like wire bonding and molding. 【Features】 ■ Exhibits excellent performance in immersion processes ■ Good rinsability with ion-exchanged water, leaving no residues ■ No attack on chip passivation ■ Maintains activated surfaces for a certain period ■ No flash point and low odor, allowing for introduction into immersion cleaning tanks without explosion-proof specifications *For more details, please refer to the PDF document or feel free to contact us.

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Cleaning agent for power electronics VIGON PE 305N

Simultaneous removal of flux and oxide film is possible! Suitable for use in complex power module manufacturing.

"VIGON PE 305N" is a neutral aqueous cleaning agent (MPC) developed for power electronics. It effectively removes flux residues from high-reliability, high-temperature solder pastes and excels in removing copper oxide films. It is suitable for cleaning power modules after soldering (such as die attach and heat sink soldering). 【Features】 ■ Excellent effectiveness in flux removal ■ Suitable for cleaning after sintering ■ Activates copper surfaces without staining ■ Well-suited for use in complex power module manufacturing ■ Does not affect passivation ■ Does not require explosion-proof equipment due to having no flash point *For more details, please refer to the PDF materials or feel free to contact us.

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Flux cleaner ZESTRON FA+

Cleaning agent for printed circuit boards, power modules, and lead frames. Excellent cleaning power and long lifespan, suitable for a wide range of applications!

ZESTRON FA+ is a solvent-based cleaner developed to wash away all types of flux residues from electronic components, ceramic composite substrates, power modules, and lead frames. It features excellent cleaning performance and a high contamination tolerance, resulting in an exceptionally long liquid lifespan. 【Features】 ■ Excellent cleaning power and long cleaning liquid lifespan ■ Halogen-free and biodegradable ■ Improves the quality of wire bonding/molding for power modules, lead frame-based discretes, and power LEDs ■ Achieves void-free underfill by completely removing sticky flux from flip chips and CMOS, enhancing image resolution *For more details, please refer to the PDF document or feel free to contact us.

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Flux cleaner for vapor cleaning ZESTRON VD

For electronic components, ceramic composite substrates, and lead frame-based discretes. Cleaning and rinsing can be done with a single solution, making process management easy!

ZESTRON VD is a solvent-based cleaning agent. It can remove flux residues from electronic components, ceramic composite substrates, and lead frame-based discretes in a closed-system single-chamber vacuum cleaning machine. 【Features】 ■ Excellent cleaning performance for a wide variety of solvent-based fluxes ■ Distillation regeneration is possible, compatible with single-chamber vacuum distillation and steam rinse processes ■ Immersion cleaning and rinsing can be performed with a single solution ■ Free of surfactants ■ Contains no halogen compounds such as chlorine, fluorine, or bromine *For more details, please refer to the PDF document or feel free to contact us.

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Cleaning Test [Consistent support from cleaning to cleanliness analysis]

After the test is completed, a technical report detailing recommended processes and other information will be submitted!

We would like to introduce the "Cleaning Test" conducted by Zestron Japan Co., Ltd. From our technical center, you can choose a device that meets your requirements from our inline and batch-type spray, jet, and ultrasonic equipment, and try cleaning workpieces under conditions equivalent to those in a production environment using spray or immersion processes (ultrasonic or jet). Our engineers will propose suitable cleaning equipment, and while conducting the cleaning test, we will analyze the cleanliness at our analysis center. 【Test Flow (Partial)】 ■1. Hearing ■2. Cleaning Test ■3. Cleanliness Analysis ■4. Report Submission *The PDF document is a company brochure.

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