ゼストロンジャパン List of Products and Services

"ATRON DC" is a water-based cleaning agent specially developed to maximize peeling power while ensuring safety for operators. It reliably removes various coating materials such as acrylic, polyurethane, epoxy, UV-curable types, or parylene from coated frames, pallets, and jigs. It is suitable for all maintenance cleaning machines, especially for immersion and ultrasonic processes. [Advantages] ■ Water-based formulation ■ High safety for operators ■ Excellent peeling performance ■ Gentle peeling on materials *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

The "ATRON AC 207" is a cleaning agent developed based on FAST technology for processing at particularly low concentrations. It improves the cleaning ability and liquid lifespan of conventional surfactant-based cleaners, and has been developed to be effective on metals with high sensitization. Due to its mild formulation and low concentration specifications, this product demonstrates excellent material compatibility with highly sensitizing metals such as aluminum, brass, and nickel. 【Features】 - Excellent cleaning ability even at low concentrations and low temperatures - Rapid removal of advanced lead-free and eutectic fluxes across a wide variety - Maintains the gloss of solder joints and pads due to its mild formulation - Removes adhesive flux and maintains void-free underfill - Improves wire bonding quality in power modules - Long lifespan and low VOC values *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

The "ATRON AC 205" is a cleaning agent designed with FAST technology to remove flux residues from circuit boards. This product offers shorter processing times and a longer lifespan. It is particularly suitable for high-pressure inline cleaning equipment that requires very short processing times. Additionally, it is effective on power LEDs, flip chip packages, CMOS, and BGA. 【Features】 ■ Quickly removes advanced lead-free and eutectic solder flux residues ■ Mild composition preserves the shine of solder joints and pads ■ Improves light conversion and lifespan of power LEDs, as well as the quality of wire bonding ■ Does not contain harmful substances such as ethanolamine ■ Very low VOC values *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

"ZESTRON SD 301" is a solvent-based cleaning agent for removing cream solder, SMT adhesives, and thick film pastes using explosion-proof spray cleaning machines from metal masks and screens. It has quick-drying properties, allowing for a reduction in the cleaning process time. It is also effective for cleaning printed circuit boards with printing errors. Due to its high flash point, it can be used for hand wipe cleaning and backside wiping on printing machines. 【Features】 ■ Capable of removing flux residues ■ Long lifespan and reduced cleaning costs due to high contamination retention capability ■ Very fast drying time, enabling a reduction in the cleaning process ■ Usable at room temperature *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

"ZESTRON SD 100" is a solvent-based cleaning agent specially designed for removing cream solder from metal masks, using an explosion-proof spray-type cleaning machine. Depending on the type of flux, it can also be used on misprinted circuit boards. Furthermore, it can be used for back wiping in printing machines and for manual wiping cleaning. Additionally, this product has been approved for use by major manufacturers worldwide in metal mask printers. 【Features】 ■ High contamination retention, leading to long life and reduced maintenance time ■ Excellent drying properties, contributing to shorter cleaning times ■ Low odor, suitable for use at room temperature ■ Suitable for manual wiping cleaning of metal masks and back wiping in printing machines *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

The "ZESTRON Resin Test" is a test kit for visualizing resin-based residues on printed circuit boards. By using this product, it is possible to detect residues during the production process and remove them during the cleaning process. Therefore, a resin amount below 40μg/cm2 (258.06μg/sq in) meets the J-STD001 standard. Please feel free to contact us if you have any inquiries. 【Advantages】 ■ Highly accurate measurement: Detects the distribution of resin-based contamination on electronic boards ■ Residue distribution helps measure the climatic reliability of electronic boards ■ Quick and simple testing method that does not require special training ■ Sampling inspections can be conducted on the production floor ■ Low cost per test *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

"ZESTRON HC" is an improved alcohol-based cleaning agent developed for the removal of SMT adhesive from tools such as dispenser nozzles. It can also be used for the removal of solder particles and dust from mounter nozzles. To facilitate easy use for manual cleaning, it is provided in an aerosol can. 【Features】 ■ Effectively removes SMT adhesive from dispenser nozzles and tools ■ Quick-drying and leaves no residue ■ Halogen-free organic solvent ■ Capable of removing solder particles and dust from mounter nozzles *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

The "ZESTRON Coating Layer Test" is a test kit that visually indicates coating defects through a black reaction, even in the case of micron coatings. By rapidly detecting defects in closed or high-density coatings, it enables the standardization of coating thickness measurements. The indicator can also be used to verify the solderability of components before soldering. Additionally, both applications can be used during the production process, allowing for cost-effective sampling. 【Advantages】 ■ Quick, simple, and cost-effective testing method ■ More accurate than black light/UV inspection → can detect thin coating layers ■ Can be used as a tool to verify coating performance ■ No complicated pretreatment required for confirming coating defects ■ Usable for solderability testing (especially for through-hole components) *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

The "ZESTRON Bath Analyzer 20" is a concentration measurement kit for pH neutral cleaning solutions. It comes in a portable case that can be used anywhere, requiring minimal equipment and space. It is simple and easy to use, and can accurately measure concentrations even in solutions containing contaminants. 【Features】 ■ Accurate concentration measurement - Can measure even with increased contaminant levels - Can be used accurately with both new solutions and those containing contaminants ■ Simple and quick usage procedure ■ Comes in a portable case that can be used anywhere ■ Requires minimal equipment and space *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments

The "ZESTRON Bath Analyzer 10" is a concentration measurement kit for alkaline cleaning solutions. It is simple and easy to use, and can accurately measure concentrations even in solutions containing contaminant components. It can be used with minimal equipment and requires only a small amount of space. Please feel free to contact us if you have any requests. 【Features】 ■ Accurate concentration measurement - Measures accurately even with increased contaminant components - Can be used accurately with both new solutions and those containing contaminant components ■ Indicates alkalinity through color change ■ Simple and quick usage procedure ■ Portable case for use anywhere *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments

"ZESTRON CO 150" is a solvent-based cleaning agent specifically designed for ultrasonic immersion processes. It can be used for pre-cleaning in combination with HFE-based cleaning agents without dilution, or as a co-solvent. It is particularly suitable for cleaning flux residues from eutectic and lead-free no-clean solder on electronic components, power modules, and lead frame-based discrete components. 【Features】 ■ Excellent cleaning performance for eutectic and lead-free solder ■ Improved quality in wire bonding and molding ■ Provides a stable cleaning process due to its composition that is less prone to boiling ■ Allows for a wide range of concentration management in process control ■ Stabilizes the cooling process and contributes to minimizing HFE consumption ■ Since it does not use water, it is possible to keep ion contamination levels low *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

We would like to introduce our water-based cleaning agent for conductive paste, 'VIGON TC 150'. This product is specially designed to remove silicone-based and silicone-free conductive pastes, as well as silver and aluminum conductive pastes, from metal masks and screen plates. It can also be used for the removal of silver sintered paste. 【Features】 ■ Excellent cleaning performance for conductive pastes ■ Capable of removing silver sintered paste from metal masks and screen plates ■ A water-based cleaning agent that can replace traditional solvent-based cleaners ■ Improves health and safety for operators due to being water-based ■ Can be used in spray equipment without explosion-proof specifications as it has no flash point *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

The "VIGON SC 210" is a water-based cleaning agent specifically designed for cleaning SMT adhesives and metal masks. Based on MPC technology, it can reliably remove cream solder and SMT adhesives in a single process even at a low temperature of 18°C. Depending on the type of flux, it can also be used to clean misprinted circuit boards. Furthermore, it can remove adhesives from fixtures (especially dispenser nozzles) and is designed for spray cleaning and ultrasonic cleaning applications. 【Features】 - Stable and excellent cleaning performance in the temperature range of 18-40°C - Contains no surfactants, leaving no residue on circuit boards or inside equipment - Excellent material compatibility - Non-foaming, low odor, with no organic residue left in the rinsing process - Can also be used to remove adhesives from fixtures and dispenser nozzles *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

"VIGON PE 215N" is a neutral water-based cleaning agent specifically designed for spray cleaning devices. Thanks to MPC technology, it can reliably remove flux residues from power electronics components, making it particularly suitable for cleaning power modules after die attachment and heat sink soldering. Additionally, it excels in material compatibility and the removal of copper oxide films, which enhances the subsequent processes of wire bonding/adhesive bonding and molding, as it is also effective in removing oxide films from copper substrates. 【Features】 ■ Excellent for cleaning flux from power electronics and power modules ■ Provides activated copper substrates for applications such as adhesive bonding ■ pH neutral, with excellent material compatibility with dies, and does not damage passivation ■ No flash point or foaming, making it suitable for spray cleaning machines without explosion-proof specifications *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

"VIGON PE 194A" is a water-based weak alkaline cleaning agent specially designed for spray and immersion equipment. It has excellent material compatibility with highly sensitizing metals, especially with die materials, and can remove copper oxide films in a short time. Based on MPC technology, it reliably removes flux residues from power semiconductors, lead frames, discrete components, power LEDs, and printed circuit boards. 【Features】 - Effectively removes flux residues from power semiconductors and printed circuit boards - Weakly alkaline, with excellent material compatibility, especially for die and highly sensitizing metals - Prepares copper surfaces in a clean state, activating them for bonding connections - Does not have a flash point, eliminating the need for explosion-proof equipment - Usable with various types of spray equipment *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

"VIGON PE 190A" is a water-based alkaline cleaner specifically designed for spray equipment. Based on MPC technology, it reliably removes flux residues from lead frames, discrete components, power modules, power LEDs, printed circuit boards, and especially from low stand components from below. It also demonstrates excellent effectiveness on severely oxidized or heavily soiled copper surfaces, ensuring superior material compatibility in subsequent processes such as wire bonding, adhesive bonding, and molding. 【Features】 ■ Reliably removes flux residues ■ Prepares copper surfaces in a clean state, activating them for bonding connections ■ Maintains an activated copper surface for an extended period without re-oxidation ■ Particularly excellent material compatibility with dies, without damaging passivation ■ Excellent rinsing properties, does not foam *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

"VIGON N 680" is a neutral cleaning agent specially designed for water-based spray cleaning (inline and batch). It effectively removes various flux residues from electronic circuit boards and can penetrate and clean even low stand-off components very well. Additionally, it has excellent material compatibility with metals that are highly sensitizing, such as copper. Please feel free to contact us if you have any inquiries. 【Features】 ■ Particularly excellent for cleaning under low stand-off components ■ High rinsability provides a wide range of applications ■ Superior material compatibility with highly sensitizing metals like copper and aluminum ■ Sufficient effectiveness even at low concentrations depending on the process ■ Can be sent to wastewater treatment without neutralization *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

"VIGON N 640" is a specially designed neutral cleaning agent for the removal of flux from printed circuit boards. It is suitable for use in batch spray cleaning machines. It offers excellent cleaning performance against advanced cream solder and fluxes that are generally difficult to remove. Additionally, it has excellent material compatibility with highly sensitizing metals such as copper and nickel. 【Features】 ■ Suitable for use in batch spray cleaning machines ■ Excellent operability, maintaining a constant concentration between the tank and chamber ■ Effective against difficult-to-remove cream solder ■ Can be easily rinsed with ion-exchanged water ■ High material compatibility due to its neutral nature *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

"VIGON A 201" is a flux cleaner that demonstrates excellent performance in spray cleaning in fine spaces such as under low stand-off components. This product, which is an MPC-based cleaner used at low concentrations, is particularly suitable for removing flux residues from no-clean solder that is eutectic and lead-free. It maintains a glossy solder joint surface without additives after cleaning. Additionally, it is suitable for removing tacky flux from flip chips and CMOS. 【Features】 ■ Cleans low stand-off components effectively ■ Particularly effective for lead-free no-clean solder ■ Maintains gloss on soldered areas of the substrate after cleaning ■ Long liquid life, low maintenance costs, and reduced cost per cleaned component ■ Easy rinsing, leaving no residues on the surface *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

"VIGON A 200" is a water-based cleaning agent specially designed for use in high-pressure and medium-pressure spray equipment, such as inline and batch systems. Based on MPC technology, it is capable of removing various types of flux residues from electronic substrates, ceramic substrates, power modules, and lead frames. It meets high cleanliness requirements for subsequent processes such as wire bonding and coating. 【Features】 - Maintains high cleanliness for wire bonding and coating processes - Free of surfactants and excellent rinsability, leaving no residues on surfaces - Easily filterable, extending liquid life and reducing cleaning agent costs - No flash point, allowing for introduction into immersion tanks without explosion-proof specifications - Does not foam even in high-pressure spray applications - Halogen-free and low odor *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

"HYDRON SE 220" is a one-phase type water-based cleaning agent for immersion processes. It removes flux residues generated during die attach and other processes from various semiconductor packages such as lead frames, discrete components, power modules, power LEDs, flip chips, and CMOS. Due to its one-phase structure, it demonstrates excellent process manageability and good rinsability, allowing for a suitable surface condition for subsequent processes like wire bonding and molding. 【Features】 ■ Exhibits excellent performance in immersion processes ■ Good rinsability with ion-exchanged water, leaving no residues ■ No attack on chip passivation ■ Maintains activated surfaces for a certain period ■ No flash point and low odor, allowing for introduction into immersion cleaning tanks without explosion-proof specifications *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

"VIGON PE 180" is a neutral water-based cleaning agent developed for the removal of flux from power electronics and printed circuit boards using spray equipment. It effectively removes flux and is a product with excellent material compatibility. It is used for flux removal from lead frames, discrete components, power modules, power LEDs, and printed circuit boards. Additionally, it excels in removing oxide films from copper surfaces to improve wire bonding/adhesive bonding in the next process and molding properties. 【Features】 ■ Exhibits excellent effectiveness in flux removal ■ Activates copper surfaces without staining ■ Shows excellent material compatibility due to its neutrality ■ Good rinsability due to MPC composition ■ Does not require explosion-proof equipment as it has no flash point *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

"VIGON PE 305N" is a neutral aqueous cleaning agent (MPC) developed for power electronics. It effectively removes flux residues from high-reliability, high-temperature solder pastes and excels in removing copper oxide films. It is suitable for cleaning power modules after soldering (such as die attach and heat sink soldering). 【Features】 ■ Excellent effectiveness in flux removal ■ Suitable for cleaning after sintering ■ Activates copper surfaces without staining ■ Well-suited for use in complex power module manufacturing ■ Does not affect passivation ■ Does not require explosion-proof equipment due to having no flash point *For more details, please refer to the PDF materials or feel free to contact us.

• Chemicals

We would like to introduce our "Metal Mask Wipes for Hand Drying." These hand wipes excel in cleaning performance, usability, and safety. They can effectively clean hard-to-reach openings with wipes that are impregnated with VIGON SC 200. Additionally, they are characterized by their durability, resistance to tearing, and low linting, making them a highly safe product with no applicable GHS labeling. 【Features】 ■ Excellent cleaning performance, usability, and safety ■ No dripping, with superior drying properties ■ Durable, tear-resistant, and low linting ■ Cleanup involves simply disposing of the wipe *For more details, please refer to the PDF document or feel free to contact us.

• Wipers

This document explains the cleaning and post-cleaning analysis methods for advanced electronic components. Focusing on the contamination cleaning after joining, led by the flux cleaning process, it discusses the nature of "cleaning" that can ensure the performance of advanced electronic components, which are a collection of various technologies, as well as future prospects. Please take a moment to read it. 【Contents (partial)】 ■ Introduction ■ The role of no-clean technology in enhancing functionality ■ Why cases requiring cleaning can occur ■ The challenges of cleaning advanced electronic components ■ Post-cleaning analysis *For more details, please refer to the PDF document or feel free to contact us.

• Technical and Reference Books

This document explains the definition of water-based cleaning agents and the technical challenges of solvent-based cleaning agents. From the perspective of the technical trends in solder and flux, it focuses on "ionic residues" and introduces the technical relevance to "water-based cleaning agents." This technical document is recommended for those who want to learn about water-based cleaning agents or the recent compositions of solder and flux. [Contents (partial)] ■ Introduction ■ Challenges during cleaning from the perspective of solder and flux composition ■ Why can water-based cleaning agents be considered effective for removing ionic residues? ■ Examples of cleaning agent classifications - Issues in Japan ■ Effects of moisture content differences and technical challenges *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

What is substrate cleaning? Is substrate cleaning unnecessary? We provide a detailed explanation of areas where flux cleaning is necessary, among other topics. In Japan, many cases adopt no-clean paste, but to ensure high reliability, cleaning has become essential. We also address the latest cleaning challenges, such as the impact of ionic residues and metal salts on insulation resistance, in this column. Recommended for those who: * Want to investigate the causes of defects despite cleaning * Want to know the latest cleaning challenges and evaluation criteria * Want to explain and promote substrate cleaning within their company, etc. Please see the related links for more information. * You can view the detailed content of the column from the related links. For more information, feel free to contact us.

• Cleaning agents

In this column, we will introduce one of the key points to consider when examining flux cleaning methods: the types of "cleaning methods" and how to select them. Flux cleaning refers to the removal of flux residues (contaminants) while protecting components such as printed circuit boards, power modules, semiconductor packages, and lead frames. The presence of flux residues can lead to issues such as the occurrence of migration and poor adhesion in molding, making flux cleaning necessary in certain cases. *For more detailed information, please refer to the related links. Feel free to contact us for further inquiries.*

• Cleaning agents

Flux residue refers to the residue derived from flux that remains on the workpiece after soldering (contamination), and its components include ions, metal salts, and organic substances. Cleaning paste is formulated with the premise of cleaning, so if left as is, the likelihood of insulation failure due to migration and corrosion increases. Depending on the application, this can also affect human life and infrastructure, making cleaning necessary in some cases. On the other hand, in the case of no-clean paste, the flux residue stabilizes, but the number of cases requiring cleaning for reliability assurance is also increasing. *For detailed content of the column, please refer to the related link. For more information, feel free to contact us.*

• Cleaning agents

We would like to introduce our reflow furnace component and pallet cleaning agent, 'ATRON SP 300'. With just a 30-minute immersion, the cleaning power makes the pallets clean. The running costs can be reduced by about 20-30%, and with 50L of cleaning solution, you can clean over 10 lines of reflow furnace components or more than 1000 pallets. Additionally, using ultrasonic cleaning will further enhance the cleaning power. 【Features】 ■ Excellent cleaning performance ■ No need for rinsing or special drying ■ Excellent material compatibility ■ Low VOC content and low odor ■ Long lifespan and low cost ■ Manual concentration measurement *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

This document explains flux cleaning in high-performance products. When attempting to establish a cleaning process, we will introduce the issues that arise, taking into account the historical background. We have included images, diagrams, and detailed explanations regarding the ability to handle insoluble substances and the future of soldering cleaning, so please take a moment to read it. 【Contents (partial)】 ■ Introduction ■ Awareness of "Cleaning": Japan's Unique Environment ■ The Rise of Insoluble Substances ■ Ability to Handle Insoluble Substances (MPC Cleaning Agents) ■ The Future of Soldering Cleaning *For more details, please refer to the PDF document or feel free to contact us.

• Technical and Reference Books

This document explains the evaluation methods for cleanliness after flux cleaning. As for existing mainstream evaluation methods, after passing reliability assessments, actual manufacturing processes determine product defects through appearance inspections using AOI. However, there is a growing trend of defects occurring after product inspections. We introduce the factors contributing to such occurrences and effective analytical methods other than appearance inspections, so please take a moment to read through it. [Contents] ■ An era where post-cleaning evaluation is questioned, just like cleaning technology ■ Diversification of flux residue components ■ Separation and analysis methods for complex components ■ Future prospects and added value of cleaning *For more details, please refer to the PDF document or feel free to contact us.

• Technical and Reference Books

This document explains the challenges of flux cleaning in 5G. It highlights the promising outlook of 5G and introduces "power semiconductors," which are essential for the future world. It includes the characteristics of power semiconductors required under 5G, the importance of the "cleaning process," and efforts to address cleaning challenges. We encourage you to read it. 【Contents (partial)】 ■ Introduction ■ Outlook for 5G ■ Characteristics of power semiconductors required under 5G ■ Importance of the "cleaning process" for power semiconductors ■ Efforts to address cleaning challenges in power semiconductors *For more details, please refer to the PDF document or feel free to contact us.

• Technical and Reference Books

This document explains the relationship between sintering bonding and cleaning, as well as the effects of cleaning. It introduces "sintering," which is gaining attention as a new bonding technology in the power semiconductor field. It discusses how sintering bonding and cleaning are related and what effects can be achieved through cleaning. Please take a moment to read it. 【Contents (partial)】 ■ What is "sintering" ■ Methods of sintering bonding ■ Why "sintering" is needed ■ Challenges in sintering bonding ■ An era where new considerations for cleaning methods are necessary *For more details, please refer to the PDF document or feel free to contact us.

• Technical and Reference Books

This document explains the issues and analysis methods related to ion residues. Focusing on the complex theme of "ions," it introduces the current challenges that exist. It includes factors contributing to ion residues, the significance of flux cleaning, and specific examples, along with diagrams and detailed explanations, so please feel free to download and take a look. 【Contents (partial)】 ■ Introduction ■ What are ions? ■ Factors of ion residues ■ Significance of flux cleaning ■ Specific examples ■ Cleaning primarily using organic solvents *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

This document explains the types and selection methods of cleaning agents and cleaning methods that are important when considering flux cleaning. It includes points to consider when examining flux cleaning methods, as well as discussions on the cleaning and rinsing processes and the drying process, providing a foundational understanding of flux cleaning. This is a useful resource for those who want to switch flux cleaning agents or are looking to start flux cleaning. 【Contents】 ■ What is flux cleaning? ■ Types and selection methods of cleaning agents - Water-based cleaning agents - Solvent-based cleaning agents *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

This document introduces case studies on root cause analysis of quality issues and support for the implementation of cleaning processes. It includes examples of quality troubles where foreign substances adhered to the workpieces after cleaning in the operational process, leading to requests for corrective actions from our customers' clients. Please note that the catalog provided is a sample version. If you would like the complete version, feel free to contact us. [Example of Contents] ■ Customer's Concerns ■ Background ■ Zestron's Support Details *The downloadable PDF document is a sample version. Please contact us if you would like the complete version.

• Cleaning agents

This document introduces the evolution of solder and cleaning. It explains why cleaning of products is necessary after soldering and discusses the challenges of cleaning no-clean solder. Additionally, it covers the metal composition of solder and the effectiveness of MPC cleaning agents on no-clean solder. We encourage you to read it. 【Contents (partial)】 ■ The trajectory of "solder," a key player in the development of civilization ■ Why was cleaning deemed essential? ■ The metal composition of solder ■ Why does the demand for cleaning no-clean solder arise? ■ Why is cleaning "no-clean solder" difficult? *For more details, please refer to the PDF document or feel free to contact us.

• Other cleaning machines

This document introduces the key points for reducing organic solvents in the cleaning field and specific case studies of initiatives. It explains the progress of organic solvent reduction, points for substituting organic solvents, and the potential of MPC cleaning agents. Additionally, it includes examples of successful organic solvent substitutions using MPC cleaning agents. We encourage you to read it. 【Contents】 ■ Progress of organic solvent reduction ■ Regulations surrounding organic solvents ■ Points for substituting organic solvents - cost and drying properties - ■ Potential of MPC cleaning agents ■ Examples of organic solvent substitution using MPC cleaning agents ■ Summary *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

In this document, we propose our cleaning process as a solution to the increasingly challenging cleaning requirements, using "low stand-off" as an example. In recent times, with technological innovations occurring in various fields, electronics cleaning has progressed to a new stage and is becoming more "challenging." We provide explanations regarding the background and key points of cleaning demand, as well as the importance of cleaning methods, so please take a moment to read through it. 【Contents (partial)】 ■ Introduction – Changes in cleaning demand trends ■ The challenges of cleaning – High performance of products ■ Background and key points of cleaning demand for low stand-off ■ Ensuring wettability and cleaning performance for low stand-off cleaning ■ Benefits of cleaning using MPC *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

We provide a wide range of cleaning process solutions for high-end industries such as aerospace, military, automotive, telecommunications, and medical, where reliability is essential. Additionally, leveraging our unique comprehensive cleaning capabilities, we contribute to the entire electronics manufacturing industry for cleaning applications in SMT and semiconductor packaging products. Through our global network, local process engineers offer comprehensive cleaning support to help you achieve your business goals. 【Solutions】 ■ Cleaning Tests ■ Analytical Services ■ Process Services ■ Zestron Academy *For more details, please refer to the PDF materials or feel free to contact us.

• Cleaning agents

This catalog introduces the product lineup of Zestron Japan Co., Ltd. It includes examples of products suitable for situations such as "printed circuit board cleaning" and "package and wafer cleaning," as well as applications and features. We also provide explanations of each product's technology and brand, along with the lineup. Please make use of this information when selecting products. [Contents (partial)] ■ Cleaning process introduction flow ■ Printed circuit board cleaning ■ Flux removal for power electronics ■ Package and wafer cleaning ■ Cleaning of metal masks, screens, and misprinted circuit boards *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

"VIGON EFM" is a hand-wipe cleaning agent that effectively cleans and dries quickly. It significantly reduces the working time for hand-wipe cleaning, with some cases showing a reduction to less than half the time. It is also effective on no-clean solder. It can be used for rework and repair cleaning as well. It is a halogen-free organic solvent that dries quickly and leaves no residue. Furthermore, it is non-corrosive and compatible with most polymers. Please feel free to contact us for inquiries. *For more details, please refer to the PDF document or feel free to reach out to us.

• Cleaning agents

VIGON RC 303 is a spray bottle type water-based flux cleaner designed for non-removable areas (such as the fracas chain, around internal devices like transport claws, inside reflow/flow ovens (walls), and fracas boxes). By switching from a solvent to VIGON RC 303, the maintenance frequency has decreased from once a week to once a month, and the amount of maintenance work has been reduced to one-fourth. Additionally, being water-based, it is non-flammable and not subject to applicable regulations. Please feel free to consult us when needed. 【Features】 ■ High cleaning performance and long lifespan ■ Time-saving as it can be cleaned before the equipment cools down ■ Difficult to volatilize due to being water-based *For more details, please refer to the PDF document or feel free to contact us.

• Cleaning agents

VIGON SC 200 is a room temperature water-based cleaning agent developed for cleaning metal masks. It is suitable for spray and ultrasonic cleaning machines and can also be used for cleaning test print circuit boards. Depending on the type of flux, it can be used on printed circuit boards that have already been soldered on one side due to printing errors. 【Features】 - It can separate and remove flux from the cleaning solution, extending the life of the cleaning solution and reducing costs. - No need to replace the cleaning solution, which simplifies maintenance. - Improved workability and environmental conservation achieved through low odor, low VOC, and environmentally friendly components. - Safe line management due to no flash point. - Excellent cleaning performance at room temperature (25°C). - Superior cleaning ability for Pb-free, halogen-free, and eutectic solders. *For more details, please refer to the PDF document or feel free to contact us.

• Chemicals