日本ミクロン List of Products and Services

RFID is an automatic identification system that reads and writes individual information about people and objects stored in RFID/IC tags, labels, and cards through wireless communication. RFID tags are activated by a reader/writer, allowing for reading and writing of information in the tag's memory, and the data can be aggregated and analyzed using computers or tablets. The applications of RFID tags span various fields such as asset management, inventory management, and production management. While there may be cases where reading is difficult depending on the object to which the tag is attached, Japan Micron's original RFID tag "SmaCo series" addresses these challenges. [Differences from barcodes and QR codes] - Multiple readings possible instantly - Works from a distance - No need for line of sight *For detailed benefits and technical information, please refer to the PDF materials or feel free to contact us.

• IC tag

Traditionally, when RFID tags are attached to containers made of metal or containing water, communication at effective distances has been difficult due to reflection and absorption of radio waves. Japan Micron leverages its technology in printed circuit board manufacturing and development to provide reliable RFID tags that maintain a long communication distance while being compact, suitable for a variety of attachment environments including metal, water, non-metal, and metal plus non-metal. 【Specifications】 ■ Standard: ISO/IEC 18000-6 ■ IC Chip: IMPINJ MONZA4QT ■ EPC Memory: 128 bits ■ User Memory: 512 bits ■ PCT 300 hours: Test 20 units: OK 20 units ■ High-temperature exposure 180℃-300 hours: Test 20 units: OK 20 units ■ Temperature cycle 25℃-250℃ 500 cycles: Test 20 units: OK 20 units ■ Attachment: Double-sided tape possible *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductors
• Other electronic parts
• Communications

Our build-up substrates enable complex structures through a combination of proprietary technologies (such as milling technology and STH technology), meeting the demands for high density and high functionality. We have a proven track record of drilling holes using laser vias in various materials that possess characteristics such as high heat resistance, high Tg, and chemical resistance. Additionally, our unique vacuum hot press method ensures that there are no voids in the inner layers, allowing for highly reliable build-up substrates with excellent flatness and positional accuracy between inner layer patterns. 【Features】 ■ Capable of forming laser holes directly above through holes in combination with STH technology ■ Fill via method allows laser holes to be filled with Cu plating ■ Achieves even higher density *For more details, please refer to our catalog or feel free to contact us.

• Circuit board design and manufacturing
• Printed Circuit Board
• Other electronic parts

Nippon Micron Co., Ltd. offers products with heat dissipation properties by applying heat spreaders using its unique metal sheet bonding technology. By bonding rigid substrates with sealing frames and rigid substrates with copper foil, it is possible to create package structures that are difficult to achieve with conventional multilayer designs. It is easy to form dams of varying heights and dimensions within the same product, and high dams of approximately 0.1 to 0.6 mm, which cannot be formed with conventional printing inks, can be created using our unique special printing method. Additionally, it eliminates gaps on the bonding surfaces that are likely to occur with adhesive-type sealing frames, allowing for batch processing unlike dispensers. 【Features】 ■ Gaps on bonding surfaces can be eliminated ■ Batch processing is possible ■ High dams can be formed using a special printing method ■ It is easy to form dams of varying heights and dimensions within the same product *For more details, please refer to the catalog or feel free to contact us.

• Circuit board design and manufacturing
• Printed Circuit Board
• Other electronic parts

Nippon Micron Co., Ltd. offers products with heat dissipation properties by applying heat spreaders using our unique metal sheet bonding technology. By appropriately selecting materials and establishing proper bonding conditions with heat spreaders/Cu foils, we can achieve products with extremely low warpage. Additionally, by bonding rigid substrates with sealing frames and rigid substrates with Cu foils, we can realize package structures that are difficult to achieve with conventional multilayer designs. 【Features】 ■ Proven track record in bonding heat spreaders/Cu foils ■ Achieves high heat dissipation ■ High freedom in height and width, ensuring stable shapes *For more details, please refer to our catalog or feel free to contact us.

• Circuit board design and manufacturing
• Printed Circuit Board
• Other electronic parts

At Nippon Micron Co., Ltd., we provide a variety of assembly substrates that enhance assembly efficiency by enabling pressing of special materials that are typically difficult to work with, thanks to our advanced mold technology. Our expertise in mold materials and structures allows us to achieve punching processing of fragile special materials, such as low and high dielectric constant materials. Additionally, when the thickness of the sheet is thin, the cross-section has less burr, allowing for improved precision. 【Features】 ■ Advanced mold technology ■ Achieves punching processing of low and high dielectric constant materials ■ Improved precision possible for thin sheet thickness *For more details, please refer to our catalog or feel free to contact us.

• Circuit board design and manufacturing
• Printed Circuit Board
• Other electronic parts

The "Flat Pushback Technology" provides a superior substrate during component mounting by suppressing the curvature of the sheet through advanced mold technology and our unique flat pushback sheet shape. It ensures the necessary holding force during component mounting while also being easy to separate after installation. Additionally, defective products within the sheet can be removed and replaced with good ones. 【Features】 ■ Flat shape that suppresses curvature ■ Advantageous during component mounting ■ Processing of half-cut through holes in the pushback area is also possible *For more details, please refer to the catalog or feel free to contact us.

• Circuit board design and manufacturing
• Printed Circuit Board
• Other electronic parts

The "STH technology" is a technique that enables the mounting of components directly above the through-hole by filling the through-hole section. Since pads can be formed directly above the through-hole, it allows for chip component mounting, ball mounting, and wire bonding, making high-density mounting possible. Additionally, it excels in moisture resistance and chemical resistance compared to conventional S/R ink filling, thereby improving the reliability of the through-hole. 【Features】 ■ Enables component mounting directly above the through-hole ■ Allows for high-density mounting ■ Moisture resistance and chemical resistance ■ Improved reliability of the through-hole ■ Can form STH directly under the chip and be used as a thermal through-hole *For more details, please refer to the catalog or feel free to contact us.

• Circuit board design and manufacturing
• Printed Circuit Board

"Double-sided and multilayer PWB" is a double-sided and multilayer substrate required in various fields. By adopting our unique technology, we can manufacture high-density and highly reliable substrates. By filling through-holes with resin and applying a cover plating on top, it is possible to form pads on the through-holes as well. It is also possible to create semi-cut through-holes in the product outline, enabling miniaturization of the product. Additionally, our unique pin insertion technology allows for the insertion and fixation of lead pins into the substrate. 【Features】 ■ High density and high reliability ■ Pads can be formed on through-holes ■ Enables miniaturization of products ■ Selection of materials with high rigidity, low dielectric, high heat resistance, and halogen-free options ■ Allows for the insertion and fixation of lead pins into the substrate *For more details, please refer to the catalog or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

The "Metal Base Core PWB" is a substrate that combines a metal plate with good thermal conductivity to achieve the heat dissipation required when mounting LEDs and high-speed ICs. By laminating a resin substrate onto aluminum or copper plates, we manufacture high heat dissipation substrates with high-density wiring. By combining this with our unique cavity formation technology, we can achieve a more three-dimensional and high heat dissipation structure. 【Features】 ■ Base material is aluminum or copper plate ■ Copper foil laminated with insulating material that has excellent heat dissipation and voltage resistance ■ High heat-resistant substrate manufactured for the thermal conduction and dissipation of mounted components *For more details, please refer to the catalog or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

Our company manufactures high-brightness, high-heat-dissipation "PWB for LEDs" by combining high-precision processing technology with substrates, resist, plating, and more. We are capable of high-precision slit processing using routers, as well as slit processing with special presses and reflector-shaped hole processing. Additionally, by tenting one side of the through-hole with solder resist or copper foil, we prevent mold resin from flowing onto the backside during bulk molding after assembly. We create substrates with high heat dissipation structures by attaching thick copper foil or copper plates, or by processing copper plates using our high-precision machining technology. 【Features】 - Compatible with 0.1mm thick substrates and thin materials of 50 microns thickness - Gold plating, silver plating, and dual-color gold-silver plating available - Prevents mold resin overflow - Processes copper plates with high-precision cavity formation technology - High heat dissipation structure *For more details, please refer to our catalog or feel free to contact us.

• LED Module
• Printed Circuit Board
• Circuit board design and manufacturing

"Build-Up PWB" mounts components on the connection via pads. Due to fewer restrictions on through holes, it significantly increases circuit density. By combining our unique machining technology, we have achieved a more three-dimensional and high-density configuration. Filled vias with copper plating are also available (subject to separate consultation). 【Features】 ■ Components mounted on connection via pads ■ Fewer restrictions on through holes ■ Significantly increases circuit density ■ Three-dimensional and high-density configuration *For more details, please refer to the catalog or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

"COB-compatible PWB" is a high-density substrate that directly mounts bare chips onto the board, achieving miniaturization and thinness of devices. It supports both electrolytic gold plating and electroless gold plating, providing stable bonding properties. By combining this with our unique cavity formation technology, it becomes possible to mount chips within the cavity, further reducing the thickness and size of the product. Additionally, for the sealing process after chip mounting, it is also possible to form a high sealing dam on the substrate that cannot be achieved with conventional printing inks. 【Features】 ■ Chips mounted within the cavity ■ Achieves miniaturization and thinness of devices ■ Supports electrolytic gold plating and electroless gold plating ■ Stable bonding properties ■ Unique mold design reduces dust generation from the edges after exterior pressing *For more details, please refer to the catalog or feel free to contact us.

• Circuit board design and manufacturing
• Printed Circuit Board

Our "Semiconductor Package (EBGA)" responds to miniaturization and high density through the adoption of unique cavity structure formation technology, fine pattern formation technology, and electroless gold plating technology. Using our proprietary method, we manufacture packages with a three-dimensional cavity structure. It is also possible to directly replace the cavity structure of a ceramic substrate with a glass-epoxy substrate. Furthermore, by implementing functional components in the cavity section, internal component embedding is possible. This allows for shorter signal propagation distances, making it effective for high-speed processing. 【Features】 ■ Unique cavity formation technology ■ Supports miniaturization and high density ■ Effective for high-speed processing ■ Can use the substrate surface as the mounting surface in combination with build-up ■ Produces high-speed processing packages by bonding metal heat spreaders *For more details, please refer to the catalog or feel free to contact us.

• Other electronic parts
• Circuit board design and manufacturing
• Other semiconductors

The "CSP/module PWB" is a chip size package that further miniaturizes standard BGA. Using our unique technology, we manufacture packages with a three-dimensional cavity structure. By adopting electroless gold plating, it eliminates the need for plated leads, allowing for high-density wiring. The sheet structure can accommodate various forms of assembly substrates, including dicing cut method, hanging method, and push-back method. 【Features】 ■ Selection of materials with high rigidity, low dielectric constant, high heat resistance, and halogen-free options ■ High-density wiring capability ■ Sheet structure allows for various forms of assembly substrates *For more details, please refer to the catalog or feel free to contact us.

• Printed Circuit Board
• Other electronic parts
• Circuit board design and manufacturing

As the core of electronics, ICs continue to grow in high-density multifunctionality. Japan Micron Corporation, as a technology development-oriented company, is always striving for technological innovation, establishing original technology development and high-density, high-precision processing techniques. We have provided reliable printed circuit boards and IC package substrates, as well as various micro-package substrates. Under the philosophy that "Electronics brings dreams and a bright future to all people, realizing a rich environment and a peaceful society," we will continue to challenge cutting-edge technologies to further enhance the development of new products and processing techniques. For more details, please contact us or download the catalog.

• Circuit board design and manufacturing
• Printed Circuit Board
• Other electronic parts