コネクテックジャパン List of Products and Services

We would like to introduce a case study of our response to equipment manufacturers. When developing new process equipment, they faced challenges such as a lack of knowledge and development resources regarding the process, and the desire to sell the process and equipment as a package, but having processes that they do not own in-house. As a result, we conducted equipment development and low-temperature 80°C chip bonding for narrow-pitch PET substrates. [Case Overview] ■ Equipment Development - Equipment development tailored to specifications and budget requests. ■ Low-Temperature 80°C Chip Bonding for Narrow-Pitch PET Substrates - 27.5μm pitch wiring and bump formation (by Komori Corporation) - Low-temperature 80°C flip chip mounting *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

We would like to introduce a case study of our response to material manufacturers. We developed high-performance materials such as flexible, stretchable, and millimeter-wave materials. When being evaluated, they faced challenges such as forming wiring on films, low-temperature mounting on thermally fragile materials, and the desire to evaluate not just the materials alone but also with chips mounted. To address these issues, we conducted free-form wiring using a jet dispenser, developed optical transceiver methods, and evaluated millimeter-wave substrate materials compatible with 5G. [Case Overview] - Free-form wiring using a jet dispenser - Development of optical transceiver methods - Realization of compact AOC through FPC with integrated optical waveguides - Evaluation of 5G-compatible millimeter-wave substrate materials *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

We would like to introduce a case study of our response to chip manufacturers. Even though they developed high-performance and high-functionality chips for sensors, high-speed communication, processors, etc., they faced challenges such as not having a subcontractor for implementation to realize those functions, being unable to implement thermally fragile chips, and being unable to implement large-area chips. As a result, we carried out implementations for thermally fragile chips, low thermal stress implementations, and large chip implementations. [Case Overview (Excerpt)] ■ Implementation of thermally fragile chips - Achieved implementation of a 140°C heat-resistant magnetic sensor array ■ Low thermal stress implementation - Achieved implementation of a 40mm ultrasonic MEMS sensor chip *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

We would like to introduce a case study of our response to system and set manufacturers. Even if you have a concept for an IoT system or set, you may be facing challenges such as not knowing the implementation methods or materials to use, OSAT not being able to accommodate structures other than assembly line setups or small-scale production, and lacking a partner for process development that involves equipment development. As a result, we conducted narrow-pitch MEMS mounting on flexible substrates, flexible substrate mounting, and stress measurement for solder flip chips. [Case Summary (Excerpt)] ■ Narrow-pitch MEMS mounting on flexible substrates - Created flexible substrate design and implemented NCP/ACP mounting - Achieved miniaturization ■ Low-temperature 80℃ flexible substrate mounting *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

We would like to introduce our technology, 'FSNIP (Free Substrate material Narrow pitch Imprinted Process).' By transferring conductive paste onto a substrate using the imprinting method, we can simultaneously form wiring and bumps with a pitch of 40μm or less, with a minimum pitch of 10μm. Due to the transfer wiring method, it can be manufactured with low-cost equipment and in small area factories, and because wiring and bumps are formed simultaneously, it achieves an excellent method that does not result in alignment shifts. 【Features】 ■ Transfer of conductive paste onto the substrate using the imprinting method ■ Simultaneous formation of wiring and bumps with a pitch of 40μm or less, with a minimum pitch of 10μm ■ Can be manufactured with low-cost equipment and in small area factories ■ No alignment shifts occur *For more details, please refer to the PDF document or feel free to contact us.

• Special Processing Machinery

We would like to introduce our technology, "MONSTER PAC(R)." In the IoT sector, chips and film substrates, even if high-performance, have sometimes been unable to withstand solder mounting. Our technology achieves a mounting temperature of 80°C to 170°C through low-temperature bonding using conductive paste. This not only resolves the issue of bonding temperature but also frees materials from thermal expansion and contraction, enabling narrow pitches of 40μm or less and high-precision mounting of 3μm or less. 【Features】 ■ Low-temperature bonding using conductive paste ■ Achieves mounting temperatures of 80°C to 170°C ■ Frees materials from thermal expansion and contraction ■ Enables high-precision mounting *For more details, please refer to the PDF document or feel free to contact us.

• Soldering Equipment

The "Desktop Flip Chip Bonder" enables the construction of a compact semiconductor assembly line without the need for a clean room by combining local clean technology. Since it does not use special chemicals and produces no noise, factories can be established anywhere. With a building the size of a convenience store, it is possible to freely construct a multi-variety, variable production line, allowing for a rapid response to market needs and the establishment of necessary production systems. 【Features】 ○ No clean room required ○ Factory miniaturization is achievable ○ Capable of multi-variety, variable production ○ Realizes Industry 4.0 For more details, please contact us or download the catalog.

• Assembly Machine
• Other semiconductor manufacturing equipment