コネクテックジャパン Product Lineup

We would like to introduce our philosophy of connecting companies, technology, and people to pave the way for the future of IoT implementation. Based in the semiconductor "back-end" hub that spans from the Joetsu region of Niigata Prefecture to Nagano Prefecture, we aim to create the world's first and best technologies. With our low-temperature packaging technology "MONSTER PAC" and fine wiring technology "FSNIP" as our weapons, we respond to various packaging needs. Together with like-minded colleagues, our mission is to contribute to society through job creation. *For more details on Connectec Japan's corporate philosophy and business overview, you can download it here.

With the advancement of IoT, new challenges of "heat" and "precision" are being presented in semiconductor packaging. The number of IoT devices, which was about 25 billion in 2020, is expected to reach approximately 64 billion by 2030. Many of these devices are composed of chips and substrates that are sensitive to heat, making it difficult to address them with conventional high-temperature packaging. To realize the virtual world with physical hardware, innovative technologies that operate at low temperatures and low thermal stress are essential. *Data summarizing the market forecasts and packaging challenges for IoT can be obtained here.*

We provide total support for special projects that are impossible on existing mass production lines, from the conceptual stage to mass production. OSRDA (Outsourced Semiconductor R&D Assembly) is a business model that distinguishes itself from mere assembly specialists (OSAT). We can handle any process related to implementation, from substrate design, process development, and prototyping to reliability testing, at any stage and from any point. We offer flexible solutions tailored to our customers' preferences, such as multi-variety variable production and the development of special applications. *Please take a look at the materials that explain the specific service flow of OSRDA.

We have achieved high-precision mounting on thermally fragile chips and film substrates, which was impossible with conventional solder mounting. Standard solder joints require high temperatures of 260°C, but MONSTER PAC enables low-temperature bonding at 80°C to 170°C using conductive paste. This suppresses thermal expansion of materials and allows for narrow pitches of less than 40μm and high-precision mounting of less than 3μm. It is a suitable method for mounting advanced devices sensitive to heat, such as magnetic sensors and MEMS. *You can download the technical details and specifications of MONSTER PAC from here.*

How to integrate heat-sensitive image sensors with high-speed processing LSI. We solved this challenge with our unique 3D stacking technology. By 3D stacking heat-sensitive X-ray image sensors and TSV-forming LSI at low temperatures, we achieved direct bonding of the sensor pixel signal terminals. By arranging 144 sensors, each measuring 10mm on a side, with a minimal gap of 50µm, we enable large-area and high-sensitivity sensing. This is a case that condenses our know-how in utilizing silicon interposers to maximize high-speed measurement processing. *For specific processes of advanced 3D stacking technology, please refer to the materials.

The realization of high-sensitivity sensors requires extremely precise wafer processing technology to expand the light-receiving area. We conducted a special processing to form 1 million square holes with a 100µm pitch on a Φ200mm photodiode wafer. By maintaining square holes of 90µm and a thin wall structure of 10µm, we achieved an overwhelming large aperture ratio and successfully enhanced sensitivity. This is a fine processing solution unique to Connectec Japan, utilizing deep dry etching (DRIE) on silicon wafers. *The accuracy of wafer processing and detailed specifications are available in the downloadable materials.

We directly bonded memory chips and SOCs (COC) and responded to the advanced requirements of flip chip mounting onto package substrates. By coordinating the networks of four companies and ten processes, we successfully achieved bonding between heterogeneous chips of varying heights. Utilizing 40µm pitch copper pillar bonding and 90µm copper balls as spacers, we realized the shortest connections between chips and substrates. This structure, which maximizes signal transmission efficiency, provides a significant advantage in high-speed processing devices. *Details of the network that successfully integrates heterogeneous chips are illustrated in the accompanying materials.*

We have developed a three-layer coplanar RDL substrate using low-loss insulating materials and simultaneously achieved high-precision bonding of millimeter-wave chips. We overcame technical challenges such as wrinkles and warping due to thermal expansion, as well as deposits during via processing, through thorough process improvements. By utilizing landless vias and three-layer impedance matching RDL, we ensured transmission characteristics over a wide bandwidth of 70 GHz. This is a top-tier example of realizing customer desires by managing 24 complex processes through the amoeba-like collaboration of 15 partner companies. *For detailed information on the millimeter-wave compatible implementation process and verification results, please refer to the downloadable materials.*

In the early stages of development, a necessary "few to several dozen" prototypes. It is difficult for large companies to respond to this need, which is where our value lies. In large-scale companies like major foundries and OSATs that require significant investment recovery, mismatches in supply and demand for small-scale development projects tend to occur. "CADN" has established a decentralized production division model with small investments by organically connecting domestic legacy lines and research institutions. While hedging against regional risks such as earthquakes and floods, we have set up a system that can flexibly respond to a wide variety of structural and construction method requests. *For more details on the new business model "CADN," which consolidates Japan's manufacturing capabilities, please download here.