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  2. Ceramics
  3. モメンティブ・テクノロジーズ・ジャパン
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Ceramics
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モメンティブ・テクノロジーズ・ジャパン

addressTokyo/Shinjuku-ku/10th floor, Park West, 6-12-1 Nishi-Shinjuku
phone03-6721-1910
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last updated:Jan 20, 2023
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モメンティブ・テクノロジーズ・ジャパン List of Products and Services

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Thermal management products "thermal filler" and "heat sink"

Solving the issue of 'heat accumulation' and contributing to thermal management, such as MIL-spec heat sinks.

Our company manufactures and develops thermal management products such as the 'TMP-EX Heat Sink,' which achieves a thermal conductivity exceeding 1000 W/m·K in material property comparisons, and the BN filler 'PolarTherm,' which offers excellent thermal conductivity and low dielectric properties. We address the challenge of "heat buildup" to extend the lifespan of electronic components and printed circuit boards and contribute to stable operation of devices. Features of the 'TMP-EX Heat Sink': - Provided in a composite structure with a core material of thermal conductivity 1500 W/m·K and a capsule material with a thermal expansion rate suitable for semiconductor chips. - Passed tests in accordance with MIL-STD-883. Features of 'PolarTherm': - Provides high thermal conductivity through addition to polymer materials. - Thermal conductivity: 250–300 W/m·K, dielectric constant: 3.9. - Suitable for addition to rubber-based resins and engineering plastics. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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High thermal conductivity laminate

Flexible thermal conductive material coated with various materials on TPG with a thermal conductivity of 1500 W/mK.

A unique high thermal conductivity laminate with a core material TPG that has a thermal conductivity of 1500 W/mK, coated with various materials. It is suitable for heat dissipation in high-power modules and mobile devices.

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Composite heat sink

Composite heat sink optimized for thermal expansion with thermal conductivity of 1000 W/mK.

This is a super high thermal conductivity heat sink that combines core material TPG with a thermal conductivity of 1500 W/mK and capsule material optimized for thermal expansion. It is suitable for packaging high-power, high-frequency semiconductor chips.

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Heat-resistant BN coating agent for non-ferrous metal processes

High-temperature process lubricants and release coatings that extend the lifespan of refractory materials and molds, and improve product quality.

BN coating suitable for high-temperature processes of non-ferrous metals such as aluminum, copper, and magnesium. It protects refractories and molds from corrosion, extending their lifespan. For casting, extrusion, die casting, and forging of non-ferrous metals. - Excellent adhesion - Water-based and environmentally friendly - Withstands high temperatures of 800°C in the atmosphere - White

  • Non-ferrous metals

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Functional components for GaN semiconductor MOCVD.

Components that are resistant to high-temperature ammonia and can easily achieve high temperatures, high-temperature heaters, and structural materials. Support from single crystal growth of nitrides to wafer processing.

Momentive's "Ultra High Temperature Heaters," "Boron Nitride Product Line," and "Graphite Protective Coatings" are resistant to corrosive gas atmospheres at high temperatures and have a proven track record as functional components in nitride single crystal growth and epitaxial equipment. ■ Ultra High Temperature Heaters - Usable at ultra high temperatures (over 1500°C) - Resistant to corrosive gas atmospheres - Capable of various shapes, offering high design flexibility ■ Other Functional Components - Compatible with high-temperature processes such as MOCVD and HVPE - Custom designs according to customer specifications *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • CVD Equipment

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Functional components for SiC semiconductor manufacturing

Components for single crystal growth and CVD that can handle SiC processes above 2000℃. Electrostatic chucks compatible with sputtering and ion implantation at high temperatures.

Momentive's "Tantalum Carbide Coating" has a proven track record as a component in SiC single crystal growth furnaces and epitaxial equipment, while the "Electrostatic Chuck" is used in high-temperature ion implantation and sputtering processes for Si and SiC semiconductor processes. 【Features】 ■ Tantalum Carbide - Usable at ultra-high temperatures (over 2000°C) - Excellent coating capability that accommodates complex shapes ■ Electrostatic Chuck - Compatible with processes up to 1000°C - High design flexibility according to specifications *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Sputtering Equipment

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High-temperature graphite protective coating

Coating that protects graphite in high-temperature corrosive atmospheres. Effective for MOCVD of SiC and GaN.

This is a product coated with PBN (pyrolytic boron nitride), PG (pyrolytic graphite), TaC (tantalum carbide), and other materials on graphite components. It can accommodate various products and shapes such as wafer trays, heaters, gears, tubes, and crucibles. 【Features】 1) Protects graphite in corrosive atmospheres at high temperatures, such as NH3 and H2. 2) Available in both electrically insulating and conductive coatings. 3) Protects components for high-temperature MOCVD applications. 4) Has excellent coating properties. *For more details, please refer to the catalog or feel free to contact us.

  • Surface treatment contract service

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Tantalum carbide coating

Tantalum carbide coating technology that reduces backside particles in high-temperature wafer processes for SiC semiconductors and nitride semiconductor manufacturing, while protecting graphite.

"Tantalum carbide coating" has corrosion resistance against ammonia, hydrogen, hydrochloric acid, and molten metals at ultra-high temperatures. By coating graphite components, it helps reduce particle generation and extend lifespan. We also offer other coatings such as pyrolytic boron nitride (PBN) coating and pyrolytic graphite (PG) coating. 【Features】 ■ High dimensional accuracy due to uniform coating ■ Excellent coverage that can accommodate complex shapes ■ Conductivity ■ Superior wear resistance *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Surface treatment contract service

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Thermal Leveler (Temperature Distribution Improvement Technology)

Temperature distribution improvement technology using thermal conductive graphite TPG with a thermal conductivity of 1500 W/mK. It improves the temperature distribution of the heater and extends the heater's lifespan.

We improve the temperature distribution of various components using heat-conducting graphite with a thermal conductivity of 1500 W/mK and metallization technology. This resolves issues caused by heat spots and extends the lifespan of components. 【Applications】 ■ Improvement of heater temperature distribution and lifespan ■ Thin and lightweight heaters ■ High-performance susceptors ■ Elimination of heat spots *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Other heaters

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High-temperature vacuum heat treatment of components used in vacuum devices and semiconductor manufacturing equipment.

High-temperature treatment of components used in vacuum devices and semiconductor manufacturing equipment is performed in a vacuum. This contributes to process startup and reduces processing time.

In a clean room, a vacuum chamber is used for degassing graphite, ceramics, metal parts, and more. It can remove not only gases adhered to the surface but also moisture that has penetrated internally. 【Applications】 ■ Degassing of vacuum equipment, semiconductor manufacturing parts, etc. ■ Degassing of graphite, ceramics, etc. ■ Baking after parts cleaning *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Processing Contract

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High thermal conductivity products exceeding 1000 W/m-K, solving efficiency issues!

Introducing high thermal conductivity products that can address heat dissipation under severe conditions and eliminate hotspots in high heat generation areas!

Our company has developed a range of high thermal conductivity products using highly oriented graphite TPG and sealing/metallization technology. These products can be used in various applications such as heat dissipation/cooling for electronic substrates, LEDs/LDs, semiconductor chips, molds, high-performance heat sinks, medical devices, thermal straps, and high-performance heat spreaders to eliminate heat spots and control temperature. We maximize the performance of each product under harsh conditions and contribute to longer lifespans! 【Features】 ■ High thermal conductivity products exceeding 1000 W/m-K ■ Highly oriented graphite TPG and sealing/metallization technology ■ Solutions for temperature control and efficiency issues under severe conditions *For more details, please refer to the PDF materials or feel free to contact us.

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[Attention Aerospace Industry Professionals!] High Thermal Conductivity Product 'TC-1050ALY'

Amazing thermal conductivity of 1,000 W/mK! A high thermal conductivity product with three times the thermal conductivity characteristics of copper.

The "TC-1050ALY" is a unique product that combines our excellent high thermal conductivity material, TPG, with various other materials using our CVD technology. It possesses thermal conductivity characteristics three times that of copper and is lighter than aluminum. It can be adapted to various sizes and shapes. It can be used in a variety of applications, including the aerospace industry, display thermal diffusion materials, PCB thermal conductive core materials, and improving the performance of heat sinks. 【Features】 ■ High heat dissipation characteristics with thermal conductivity exceeding 1000W/mK ■ Can be handled like metal with surface treatment, soldering, and brazing ■ Lightweight and compact ■ Thermal conductivity three times that of copper ■ Lighter than aluminum ■ Thermal expansion adjustment with sealing materials ■ Low thermal resistance ■ Reliability through passive thermal control unaffected by gravity *For more details, please refer to the catalog or feel free to contact us.

  • Fine Ceramics
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Metalizing deposition source. High-temperature ceramic "PBN evaporator."

Deposition source using a combination of PBN ceramics and graphite. Suitable for vacuum deposition such as aluminum deposition.

"PBN" is an anisotropic high-temperature ceramic that combines high electrical resistance with excellent thermal conductivity. Non-toxic and non-porous, PBN is manufactured through a thermal CVD process, resulting in very high purity. It is used as a deposition source in the metallization process. 【Features】 ● High purity and long lifespan ● Very low outgassing ● Easy replacement with existing ceramic evaporators ● Stabilization of the quality and thickness of aluminum deposition films ● No change in electrical resistance values over time *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Other heaters

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High-temperature heaters for semiconductor manufacturing, electrostatic chucks, and thermal shock-resistant ceramics.

Supports manufacturing processes for silicon semiconductors, SiC, and GaN power semiconductors. Exhibits excellent performance in high temperatures, vacuum, and corrosive gas environments.

Pyrolytic Boron Nitride (PBN) and Tantalum Carbide possess high heat resistance and corrosion resistance, making them ceramics that can easily achieve rapid temperature rise and ultra-high temperatures. PBN can be deposited or processed into various shapes. There are also ultra-high temperature heaters, high-temperature electrostatic chucks, and graphite protective coatings available. PBN functional components contribute to improvements in the manufacturing processes of organic EL, semiconductor single crystal growth processes, and other high-temperature vacuum processes. 【Features】 ■ Compatible with 12-inch wafers (300mm wafers) ■ Usable under ultra-high vacuum and high temperature (1700℃*) ■ Maintains high electrical insulation even at high temperatures ■ Tough and resistant to breaking ■ Chemically stable *For more details, please download the PDF or feel free to contact us.

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"BN Coating" *Exhibits excellent lubrication even at high temperatures!

This is a solid lubricant certified by the NSF in the United States. We offer various types, including paint and powder types.

"BN Coating" has excellent adhesion and coverage, demonstrating outstanding lubrication and release properties even at high temperatures. By using this product, not only can the lifespan of molds and forming tools be extended, but the surface finish of products can also be significantly improved. It is an environmentally friendly product that does not use any ozone-depleting substances in organic solvents. 【Features】 ■ Heat resistance (in the atmosphere: <850℃) ■ High electrical low efficiency and insulation (>1×10^15Ωcm) ■ High thermal conductivity (300+w/mk) ■ Slipperiness, lubricity ■ Chemically inert ■ Moisture resistance *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Coating Agent

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【A must-see for those struggling with heat dissipation!】High thermal conductivity product 'TC-1050ALY'

Incredible thermal conductivity of 1,000 W/mK! A high thermal conductivity product with three times the thermal conductivity characteristics of copper.

The "TC-1050ALY" is a unique product that combines our excellent high thermal conductivity material TPG with various materials using our CVD technology. It possesses thermal conductivity characteristics three times that of copper and is lighter than aluminum. It can accommodate various sizes and shapes. It can be used for various applications, including thermal diffusion materials, improving the performance of PCB thermal conductive core materials, and heat sinks. 【Features】 ■ Thermal conductivity characteristics three times that of copper ■ Lighter than aluminum ■ Thermal expansion adjustment with sealing materials ■ Low thermal resistance ■ Reliability through passive conduction *For more details, please refer to the catalog or feel free to contact us.

  • Fine Ceramics
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Thermal Conductive BN (Boron Nitride) Filler 'PolarTherm'

Low dielectric constant, excellent electrical insulation, and thermal conductivity thermal conductive BN filler! Improves the lifespan of electronic components and is compatible with 5G and next-generation high-frequency devices.

"PolarTherm" is a thermal conductive filler (discharge filler) that extends the lifespan of electronic components and printed circuit boards through its heat dissipation effect, enhancing reliability. This product is chemically stable and moisture-resistant, featuring high electrical insulation and low dielectric constant. 【Features】 - Contributes to the increased lifespan of electronic components and printed circuit boards - Dielectric constant of 3.9 with low dielectric loss - Choose from over 70 different grades to match your application - High electrical insulation and low dielectric constant - Suitable for heat dissipation materials for EVs and HEVs *For more details, please refer to the PDF catalog. Feel free to contact us with any inquiries.

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Metal carbide coating

Metal carbide coating technology that protects graphite in high-temperature wafer processes in corrosive atmospheres! It demonstrates an effect of extending the lifespan of components.

"Metal carbide coating" has corrosion resistance against ammonia, hydrogen, hydrochloric acid, and molten metals at ultra-high temperatures. By coating graphite components, it helps reduce particle generation and extend lifespan. We also offer other coatings such as pyrolytic boron nitride (PBN) coating and pyrolytic graphite (PG) coating. 【Features】 ■ High dimensional accuracy due to uniform coating ■ Excellent coverage capable of accommodating complex shapes ■ Conductivity ■ Superior wear resistance *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Processing Contract

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PBN heater & electrostatic chuck

Achieves excellent dimensional stability and temperature reproducibility even at ultra-high temperatures above 1000℃! A composite of PBN and PG using advanced technology.

Momentive's "PBN Heater" and "High-Temperature Electrostatic Chuck (ESC)" are composites that utilize advanced technologies of electrically insulating pyrolytic boron nitride (PBN) and conductive pyrolytic graphite (PG). Their characteristics of high purity and very low outgassing even at high temperatures are derived from chemical vapor deposition at elevated temperatures. High thermal conductivity and anisotropy provide excellent in-plane uniformity. 【Features】 ■ Ultra-high temperature compatibility (1500°C) ■ Dimensional stability and electrical stability ■ Ability to create temperature gradients on the heater surface ■ Capable of rapid heating and cooling *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Other heaters

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High Thermal Conductivity Product Series

Solve the problems of strict temperature control and high efficiency! A range of high thermal conductivity products exceeding 1000 W/m-K.

The "High Thermal Conductivity Product Series" consists of products developed using highly oriented graphite TPG and sealing/metallization technology, with thermal conductivity exceeding 1000 W/m-K. These products are ideal for heat dissipation and cooling of control boards and semiconductor devices, as well as for eliminating heat spots. 【Product Examples】 ■ Heat spreader for substrate cooling: TC-1050 ■ Thin laminate: TMP-FX ■ Heat sink for chip cooling: TMP-EX *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

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Pyrolitic Boron Nitride (PBN)

High purity, high thermal conductivity, lightweight and tough, exhibiting high thermal shock resistance high-temperature ceramics! Active in a wide range of industries, including semiconductor manufacturing.

"Pyrolytic Boron Nitride (PBN)" is an anisotropic thermally decomposed boron nitride that possesses high electrical insulation and excellent thermal conductivity. It can be manufactured through deposition in various shapes or processed into thin sheets. Due to its lightweight nature, chemical resistance, and excellent thermal shock resistance, it is suitable for high-temperature applications. It is widely used in vacuum, semiconductors, electronics, metallurgy, thin film formation, and phosphors. 【Features】 ■ Non-toxic (harmless to the human body) ■ High purity (proven in semiconductor manufacturing) ■ Low density (weight reduction possible) ■ Chemically inert (proven in corrosive environments) *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Other semiconductor manufacturing equipment

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Graphite monochromator 'HOPG'

A graphite monochromator that exhibits excellent spectral performance! Suitable for X-ray and neutron diffraction devices, etc.

"HOPG" is a high-purity, highly oriented pyrolytic graphite that possesses excellent X-ray and neutron diffraction capabilities. In X-ray diffraction, it shows about 3 to 5 times the performance of conventional crystals, and a single-bent focusing monochromator demonstrates about 3 times the spectral resolution of lithium fluoride at the same quantity. HOPG plates come in various shapes, including flat, single-bent, and double-bent. [Applications] ■ Monochromator for X-ray diffraction equipment ■ Neutron scattering and diffraction ■ Standard materials for STM (Scanning Tunneling Microscopy) and AFM (Atomic Force Microscopy) ■ Anode materials, graphene materials *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • X-ray fluorescence analyzer

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BN Ceramics

Ceramics that can also accommodate shape customization! Widely used in industrial applications.

"BN Ceramics" is a high-density, high-strength ceramic produced by hot pressing. It is easy to process and can accommodate special shapes. Due to its unique properties, it is widely used in various industrial applications. [Typical Applications] ■ Thermal management of electronic devices Used as a heat dissipation material with excellent electrical insulation properties. ■ High-temperature applications Suitable for plasma arc welding and other applications due to its stability and excellent thermal shock resistance at high temperatures. ■ Handling of molten metals Used in areas that come into contact with molten metals. *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Ceramics

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"BN Paint, Spray" exhibits excellent lubrication even at high temperatures.

BN paint and spray that exhibits excellent lubrication even at high temperatures! Superior adhesion improves the finish of product surfaces.

"BN Paint, Spray" has excellent adhesion and coverage, demonstrating outstanding lubricity and release properties even at high temperatures. By using this product, not only can you extend the lifespan of molds and forming tools, but you can also significantly improve the finish of product surfaces. The paint is water-based, and the spray is an environmentally friendly product that does not use any ozone-depleting substances. 【Features】 ■ Heat resistance (in the atmosphere: <850℃) ■ High electrical low efficiency and insulation (>1×10^15Ωcm) ■ High thermal conductivity (300+w/mk) ■ Slipperiness, lubricity ■ Chemically inert ■ Moisture resistance *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Coating Agent

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High thermal conductivity product 'TC-1050ALY'

Incredible thermal conductivity of 1,000 W/mK! A high thermal conductivity product with three times the thermal conductivity characteristics of copper.

The "TC-1050ALY" is a unique product that combines our excellent high thermal conductivity material TPG, manufactured using our CVD technology, with various other materials. It possesses thermal conductivity characteristics three times that of copper and is lighter than aluminum. It can accommodate various sizes and shapes. It can be used for a variety of applications, including thermal diffusion materials, PCB thermal conduction core materials, and high-performance heat sinks. 【Features】 ■ Thermal conductivity characteristics three times that of copper ■ Lighter than aluminum ■ Adjustment of thermal expansion rate with sealing materials ■ Low thermal resistance ■ Reliability through passive conduction *For more details, please refer to the catalog or feel free to contact us.

  • Fine Ceramics

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