日本エクシード List of Products and Services

This document introduces the polishing processes, cleaning, and processing technologies for various wafers from Japan Exceed, using photographs and analysis examples. Through years of experience in polishing processing and repeated unique research and development, we have achieved high-level technical capabilities in handling various materials known as single crystals, and we have now become a provider of polishing for over several hundred types of semiconductor materials. We include the polishing process of the polishing processing, special Si processing using thinning technology, and processing materials. Our company responds to the polishing needs of various processing materials. 【List of Processing Materials】 ■ Oxide materials: LiTaO3 (LT), LiNbO3 (LN), ZnO, quartz, sapphire, regenerated sapphire, etc. ■ Compound materials: GaN, SiC, GaP, GaAs, GaSb, ZnS, ZnTe, etc. ■ Metal materials: SUS, Au, Ag, Cu, W, Ti, Al, etc. ■ Others: Ge, C, MnZn ferrite, TeO2, resin materials, etc. 【Contents Included (Excerpt)】 ■ Polishing processing process (representative examples) ■ Introduction to the polishing process ■ Introduction to the cleaning process ■ Special Si processing *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Wafer
• Other metal materials

This document introduces the processing materials and technologies of Japan Exceed. It includes special processing of Si using thinning processing technology, processing material "Si wafer," and micro shape evaluation technology using laser microscopy. Our company meets various polishing needs for processing materials. [Contents (excerpt)] ■ Special processing of Si ■ 6H-SiC single crystal (Si surface) ■ Metal materials and metal films ■ Micro shape evaluation technology using laser microscopy *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Nihon Exceed specializes in precision grinding and cleaning of oxide materials and other substances. Supported sizes range from Φ63mm to Φ150mm and 3mm×3mm to 100mm×100mm. Our company possesses the technology to thin the backside of patterned wafers to a specified Ra value through lapping (back lapping). 【Oxide Wafers】 ■Supported sizes: Φ63mm to Φ150mm, 3mm×3mm to 100mm×100mm ■Thickness: 20μm and above ■TTV: 5μm or less ■LTV (5mm×5mm): 0.4μm or less ■Surface roughness: 0.2nm or less ■Back surface roughness: 0.1μm to 4.0μm *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Nihon Exceed conducts precision grinding and cleaning of metal materials and more. We perform prototype processing using optical grinding technology, which is utilized in various fields such as vacuum devices and gas-related equipment. Additionally, we challenge ourselves to grind all types of materials, including magnetic materials, superconducting materials, and new materials. 【Features】 ■ Technology applying optical grinding techniques ■ Engaged in prototype processing ■ Used in various fields such as vacuum devices *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

At Japan Exceed, we perform polishing processing of various compound semiconductor crystals such as SiC, GaN, and GaP. We can also finish patterned compound wafers to a thin specification and accommodate delivery methods to our customers. Our company responds to polishing needs for various processing materials. 【Features】 ■ Polishing processing of various compound semiconductor crystals is possible ■ Can accommodate delivery methods to customers ■ Thickness: from 20μm ■ Surface roughness performance value GaP surface roughness: 0.1nm *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Nihon Exceed conducts precision polishing processing using smoothing technology. In addition, we possess microstructure measurement techniques using laser microscopes, such as fine structure measurement with laser confocal functionality. Our company meets the polishing needs of various processing materials. 【Features】 ■ Precision polishing processing using smoothing technology ■ Surface roughness at the semiconductor level ■ Cu: Ra 0.16nm ■ Al: Ra 0.20nm ■ Nb: Ra 0.74nm *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract

We would like to introduce the polishing and cleaning processes of Japan Exceed, which performs precision polishing and cleaning of semiconductor materials and metal materials. In the polishing process, we achieve an ultra-smooth surface without haze by dividing the polishing into three stages: primary polishing, secondary polishing, and tertiary polishing. In the cleaning process, we maintain cleanliness by performing cleaning without human intervention, removing contaminants such as particles. 【Polishing Process】 ■ Incoming Inspection ■ Adhesive Application Process ■ Primary Polishing Process ■ Secondary and Tertiary Polishing Processes ■ Cleaning Process ■ Measurement Process ■ Inspection Process *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Nihon Exceed conducts special processing of Si using thinning processing technology and high-purity technology. We can also handle Si wafers, SOI wafers, and other single-crystal and polycrystalline silicon component materials (such as electrodes for dry etching equipment and focus rings). Our company meets various polishing needs for processing materials. 【Special Si Processing】 ■ Thinning Processing Technology ■ Small Diameter High-Precision Processing Technology ■ High-Purity Technology *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Size reduction processing achievements - 6 inches → 4 inches - 6 inches → 2 inches (4 pieces), etc. Please feel free to contact us for hole drilling and counterboring processing as well.

• Circuit board design and manufacturing
• others

Processing results - Si 4 inches 25um～ - Si 6 inches 50um～ - GaAs 3 inches 20um～ - LT (Lithium Tantalate) 2 inches 25um～

• Circuit board design and manufacturing
• others

- Thickness control of films such as SiO2 and SiN - Thickness variation after processing: less than 50 nm

• Circuit board design and manufacturing
• others

Processing Material Achievements - Ge - C - MnZn - Ferrite - TeO2 - SrTiO3 - LaGaO4 - LaSrGaO4 - NGO - Y2Fe5O12 - Y3Al5O12 - BGO - Resin Materials

• Circuit board design and manufacturing
• others

Processed material achievements: - SUS - Au - Ag - Cu - W - Ti - Al

• Circuit board design and manufacturing
• others

Regarding SOI wafers, the transition to larger diameters (12"φ) is steadily progressing, and currently, the latest technologies that cannot be achieved with smaller diameters are being developed with these materials. However, the subsequent processes (device processes) are limited to smaller diameters (8"φ or less), which means that the latest technologies available in large-diameter materials cannot be utilized. Japan Exceed is constantly striving to improve technology to meet these needs and has established a production system based on mass production. Additionally, size reduction of SOI wafers is also possible. 【Processing Details】 ■ Material Names: Various diameter Si wafers, SOI wafers, single crystal and polycrystalline silicon component materials (electrodes for dry etching equipment, focus rings, etc.) ■ Compatible Sizes - Φ12.5mm to Φ200mm - 3mm×3mm to 156mm×156mm - Rectangular shapes are also supported - Finished Thickness: 25μm and above - Flatness: TTV 1μm or less - Particles: 20 or fewer at 0.2μm - Surface Roughness: 0.3nm or less - Film Thickness Control: Possible *For more details, please download the materials or contact us.

• Wafer
• diode
• Contract manufacturing

Our company possesses the capability to handle processing technology for mass production. Additionally, we also perform polishing processes for substrates used in blue light-emitting diodes and laser diodes. We carry out lapping and polishing processes on a mass production basis to meet the processing specifications required for various applications. 【Processing Details】 ■ Material Names: LiTaO3 (LT), LiNbO3 (LN), ZnO, Quartz, Sapphire, Sapphire Reclaimed, etc. ■ Processing Materials: LiNbO3 (LN), LiTaO3 (LT), ZnO, Quartz, Al2O3 (Sapphire) Backside processing of patterned wafers, reclamation processing, etc. ■ Supported Sizes ・Φ63mm to Φ150mm ・3mm×3mm to 100mm×100mm ■ Finished Thickness: 20μm and above ■ Flatness: TTV: 5μm or less *For more details, please download the materials or contact us.

• Wafer
• diode
• Processing Contract

In the case of compounds, unlike silicon oxides, they are very soft materials, and it is said to be difficult to thin them out. However, at Japan Exceed, we have made it possible to finish thinned compound wafers that have already been patterned, and we can accommodate delivery methods for our customers. We obtained a patent in 1996 for the "development of mirror polishing using abrasives that do not contain bromine." We cater to a wide range of needs, from small quantities to mass production, not limited to standard products. We perform ultra-smooth polishing of SiC single crystals used in power devices, as well as GaN single crystals used in laser diodes and high electron mobility transistors (HEMT) to achieve high recording density. We also process the backside of patterned wafers to thin them out. 【Processing Details】 ■ Processing Materials - SiC - GaN - GaP - GaAs - GaSb - ZnS - ZnSe - ZnTe - Backside processing of patterned wafers, etc. ■ Finished Thickness: 20μm and above ■ Surface Roughness Performance Value: GaP Surface Roughness: 0.1nm *For more details, please download the materials or contact us.

• Wafer
• diode
• Contract manufacturing

Our company provides unparalleled precision and quality using unique processing technologies for each material. Since our establishment in 1961, we have repeatedly engaged in independent research and development based on years of experience in polishing processing, achieving high-level technical capabilities in handling various single crystal materials. We support research and development with our five super polishing technologies (super smoothing, super flattening, super thinning, super distortion-free, and super cleaning). 【Features】 ■ Surface roughness at the nanometer (nm) level ■ Flatness and thickness variation at the micrometer (μm) level ■ Thickness and film thickness from a few μm to several tens of μm ■ Elimination of surface distortion layers ■ Removal of atomic-level metal contamination ■ Removal of submicron-level particles *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

Nihon Exceed Co., Ltd. is a company that primarily engages in precision polishing and cleaning of semiconductor materials, oxide materials, compound materials, and metal materials. We possess five advanced polishing technologies: ultra-flatness technology, ultra-thinning technology, ultra-distortion-free technology, ultra-cleaning technology, and ultra-smoothness technology, enabling us to polish all types of crystalline materials. With unparalleled precision and quality achieved through unique processing techniques tailored to each material, we meet polishing needs for all types of materials. 【Business Description】 ■ Precision polishing and cleaning of semiconductor materials, oxide materials, compound materials, and metal materials. *For more details, please refer to our catalog or feel free to contact us.

• Processing Contract
• Other semiconductors
• Composite Materials