オルテコーポレーション List of Products and Services

Key Points for Improving Image Recognition Accuracy through Brightness Adjustment - White and gray tones can adapt to various environmental conditions - Improved accuracy of object detection and recognition in response to changes in environmental lighting conditions - Improved accuracy of object detection and recognition in response to changes in contrast - Overall improvement in image recognition accuracy is expected

• Other semiconductor manufacturing equipment

The classical design The conical collet is a product widely known for its classical design. This collet features a pyramid-shaped recess that supports the chip on the sloped part, allowing for suction and pickup. This enables precise positioning and stable holding of semiconductor chips. Main features Limited contact surface: It only makes contact with the four edges of the chip's upper surface, preventing scratches and dirt on the chip's upper surface. Prevention of corner chipping: The corners are designed with chamfers to prevent chipping. Shifting from metal to resin to reduce chipping of semiconductor chips Development of resin conical collets Orte Corporation has successfully manufactured conical collets using resin materials such as Bespell SP1 and PEEK. These resin collets significantly reduce chipping and cracking of chips compared to traditional carbide collets.

• Bonding Equipment

■Materials for Collets that Can Be Manufactured - Carbide Die Collets - Resin Collets - Rubber Collets (Nitrile Rubber, Fluoro Rubber, Silicone Rubber) - Ceramic Collets - Porous Material Collets - Next-Generation Resin New Materials ■Available Shapes - Pointed Tip - Square - Special Shapes - 3D Printed Nozzles

• Other industrial robots

"Sizes" We offer a wide range of sizes. We also design heat-resistant trays with special shapes that do not fit existing shapes. We have a rich lineup of existing 2-inch and 4-inch chip trays.

• Other semiconductor manufacturing equipment

"Semiconductor Backend Nozzles" Our company handles epoxy material nozzles. We will design the optimal solution to address issues such as tailing, bridging, voids, and unstable epoxy application amounts. "Other Precision Nozzles" These are resin nozzles designed using a 3D printer. They can be fabricated in sizes up to several tens of millimeters, with printing done at the micrometer level to create precision nozzles. You can also request the design of the drawings from our company.

• Contract manufacturing
• Other industrial robots
• Other semiconductor manufacturing equipment

■Product Information Compatible with manufacturers such as K&S, ASM, KAIJO, and SHINKAWA. Using platinum electrodes with excellent electrical characteristics allows for good current density. Additionally, we can provide Ir (iridium), Cu (copper), and Ag (silver). Typically, Pt (platinum) is used, but high-lifetime, high-performance Ir (iridium) products are also available. ■Cost-effectiveness Platinum has a high heat resistance and experiences less wear due to oxidation, making it cost-effective with an extended product lifespan.

• Bonding Equipment
• Other semiconductor manufacturing equipment

We have been providing overwhelming cost advantages compared to overseas for several years since we started handling this product. We also offer EFO torch assemblies. Especially when manufacturer support has ended and obtaining replacement parts is difficult, we will consider design options in-house. At that time, we can also make custom changes such as the tip materials Pt/Ir and wire diameter.

• Other semiconductor manufacturing equipment

We can accommodate manufacturers such as ASM, K&S, Shinkawa, and Kaijo. Please download the materials to view the shape of the representative bonder's EFO torch. We also support manufacturers like K&S, ASM, Kaijo, and Shinkawa. Typically, Pt (platinum) is used, but we also offer high-lifetime, high-performance Ir (iridium) products.

• Other semiconductor manufacturing equipment
• Bonding Equipment

In the post-processing of semiconductor manufacturing, we provide optimal pickup tools and more based on years of design and improvement experience. A device just for you will be born.

• Other semiconductor manufacturing equipment

In addition to standard patterns such as pin type, star type, and grid type, we can also manufacture in special shapes. We will provide advice on the optimal shape based on our extensive design experience for the applicable die size.

• Other semiconductor manufacturing equipment

Our company offers a wide range of collets, including flat collets, round-shaped collets, and collets with extremely pointed tips. The basic materials are as follows: - Carbide die collets - Resin collets - Rubber collets - Other collets

• Other semiconductor manufacturing equipment

- It excels in coating stability and nozzle maintenance, receiving high praise compared to genuine products. - Our company offers a lineup starting from a minimum inner diameter of φ0.08mm.

• Other semiconductor manufacturing equipment
• Bonding Equipment

Orte's collet helps improve chip defects. By selecting appropriate materials and designs based on chip quality, we achieve the complete elimination of carryover errors and scratches! Customizations and designs tailored to your manufacturing equipment are also available upon request.

• Other semiconductor manufacturing equipment

Our carbide / metal die collets are used in applications that require strength, temperature resistance, and wear resistance. By combining a SUS body with a carbide tip, we can propose cost-cutting solutions from the design stage. Our die collets are designed so that half the thickness of the chip fits into the pocket, ensuring that the chip is securely held in place. Additionally, we have processed corner reliefs to prevent chipping of the chip edges. If there are no specifications for the shape or size of the corner reliefs, please leave the design to us. Our die collets can minimize the spacing between chips, and the flat width on all four sides can be machined down to 20μ to avoid contact with adjacent chips. If you have any questions or would like to place an order, please feel free to contact us.

• Other semiconductor manufacturing equipment

Currently providing a complete set of tools for semiconductor backend processes. We offer unique designs tailored to applications such as collets, needles, and bonding devices. There are numerous cases where we have assisted companies in producing high-quality products without damaging the semiconductors. We have received satisfaction feedback from 98% of the companies using our products.

• Bonding Equipment
• Other semiconductor manufacturing equipment

The following are our representative types of collets. Interchangeable Rubber Collets These are pickup tools that contribute to preventing scratches on devices and enhancing adhesion. We offer three types: NBR, FKM, and silicone rubber, each with different characteristics. Additionally, leveraging our design know-how, we can create custom designs tailored to your applications and objectives. Resin Collets These provide solutions for demands that cannot be met by metal or rubber collets. They allow for the machining of complex tip shapes and can accommodate devices with three-dimensional mounting. We also offer a service to reuse metal shanks and replace only the resin tip with a new one. Carbide/Metal Die Collets Carbide and other metal collets are used in scenarios that require strength, temperature resistance, and wear resistance. We can propose cost-cutting solutions from the design stage, such as combining a SUS body with a carbide tip. Collets Made from Other Materials In addition to rubber, resin, and metal, we can provide collets made from materials such as ceramics and porous materials. We also manufacture collets using cutting-edge processing methods and materials, such as 3D printed nozzles and next-generation resin materials.

• Other semiconductor manufacturing equipment

The transfer of semiconductors requires precise pickup tools. Interchangeable rubber collets are pickup tools that can accommodate a wide variety of applications and contribute to preventing damage to devices and enhancing suction power. Additionally, resin collets can process complex shapes and are compatible with three-dimensional mounted devices. Furthermore, carbide or metal die collets are used in scenarios where strength, temperature, and wear resistance are required. These collets can be selected to match collet holders and have become indispensable tools for semiconductor transfer.

• Other semiconductor manufacturing equipment

Our 3D printer brings evolution to the next-generation manufacturing of microfluidic devices. By adopting the innovative "PµSL" technology, it enables the easy production of ultra-fine microfluidic devices ideal for applications such as cell culture, drug development, and drug delivery. Complex structures can also be easily realized, contributing to the introduction of active ingredients into cells with three-dimensional designs. It is also utilized in the development of medical devices, bringing us one step closer to achieving more innovative medical solutions. Explore the new possibilities of microfluidic devices using our 3D printer!

• Other industrial robots

The suction collet accommodates a variety of materials and shapes and is used as a pickup tool. You can choose materials according to your requirements, such as rubber, resin, metal, and ceramic. It contributes to preventing scratches on devices and enhancing suction power, and it is easy to replace and economical. Furthermore, our design expertise allows for custom designs as well.

• Other semiconductor manufacturing equipment

We offer a wide range of products from die bonding to wire bonding. Even if production has ended at each manufacturer, we will design the products in-house. We also persistently solve issues such as electrical characteristic defects. Inquiries regarding product optimization and longevity are also welcome.

• Bonding Equipment

Our IC chip trays can meet the diverse needs of our customers thanks to a wide range of mold sizes. Even for special-shaped IC chip trays that do not conform to existing shapes, we will design and manufacture them according to the required sizes of our customers.

• Other physicochemical equipment

In semiconductor manufacturing lines, collets are used. It is recommended to replace the collet with a metal or resin pickup nozzle if there is a risk of scratching the chip surface during die attachment. We offer a wide variety of ultra-small sizes that accommodate shrinking collets. They can be used in conjunction with compatible holders, allowing for easy on-site replacement at a low cost, making them economical. In semiconductor manufacturing lines, it is said that the failure rate of chip movement with standard collets is about 60%. Our products focus on reducing the generation of static electricity when in contact with semiconductors and on the hardness of the materials. Customers who have adopted our products have significantly reduced their failure rate to 1.7%. As a result, we have received many requests for replacements from other materials in recent years. *For more details, please refer to the PDF document or feel free to contact us.*

• Other semiconductor manufacturing equipment
• others

We provide maintenance parts for equipment such as K&S, ASM, ESEC, KAIJO, and Shinkawa, incorporating improvement requests from the field and offering them as enhanced products. In addition to selling parts, we can also propose improvements. We have a strong track record, especially for K&S, and can provide added value. Compared to genuine parts, we can achieve significant cost reductions, and through the repair and adjustment of spare parts, we enable long-term use of the equipment. 【Features】 - Development and provision of high-quality products that surpass the quality of genuine parts - Significant cost reductions compared to genuine parts - Ability to propose improvements in addition to selling parts - Incorporation of improvement requests from the field and offering them as enhanced products - Particularly strong track record for K&S, providing added value *For more details, please refer to the PDF materials or feel free to contact us.

• Other contract services
• Contract manufacturing

This document is a collection of case studies addressing challenges in semiconductor manufacturing equipment proposed by Orte Corporation, Ltd. It introduces our specialty in consumable parts and presents numerous examples of issues frequently raised by users, such as chip damage, instability problems with dispensers and epoxy transfer, and cases related to torch electrodes for wire bonding. Our company offers a wide range of specifications with distinct features, even in cases where general-purpose parts recommended by equipment manufacturers may not suffice. ◆ We are currently offering a collection of case studies and a comprehensive catalog as a gift! You can view it via PDF download. 【Featured Cases (Excerpt)】 ■ Types of consumable parts ■ Causes and solutions for chip snagging scratches ■ Causes and solutions for cracking (microcracks) ■ Troubles and solutions due to dispenser clogging... ■ Causes and solutions for bonding errors (adhesion failures)... ■ Ultra-precise 3D printed model with a molding resolution of 2μm *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

We received a request from a semiconductor manufacturing company in Hiroshima Prefecture and would like to introduce a case where we implemented measures to prevent workpiece carry-back and ensure stable storage in chip trays. We recommend using flat collets made of carbide and heat-resistant resin for those who have issues with scratches on the chip surface and chipping. Being interchangeable, it is economical and can be easily replaced on the worksite, allowing for continuous use in top-class condition. The tip shapes are round, square, and rectangular, with a wide range of sizes available as standard specifications. 【Case Study】 ■Challenge There was no experience in transferring small workpieces with openings below 1mm, making it a difficult situation, and we had to decline inquiries from users. There were expectations for preventing workpiece carry-back and stable storage in chip trays. ■Result Approximately 100,000 chip sizes of 0.75mm opening and t=0.2mm were handled without any carry-back. This was an area where existing collets could not be used at all. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductors
• Other semiconductor manufacturing equipment

"There are frequent errors with chip retrieval, but the cause is unknown." "I want to know how to increase the operating speed of the device and improve production efficiency." Is your company also struggling with such issues? The "rubber collet" handled by Orte Corporation will solve your problems. Please feel free to consult us. 【We can solve the following issues】 ■ I have an idea for a collet, but there are no manufacturers to produce it. ■ Is there a collet for MEMS? ■ I am looking for a collet with suction holes smaller than 0.1 millimeters. ■ There are many defects due to device damage, resulting in poor yield. ■ I am struggling with the pickup of solder balls and bump chips. ■ I cannot find a place that can make collets with special shapes. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment
• others

Orte Corporation is a company that handles consumable parts for semiconductor manufacturing equipment. We would like to introduce a case study on improving defects in the sensor chip transfer process that we proposed. ■Customer's Concerns - Defects due to cracks and micro-cracks are occurring at a rate of 50%. - Due to the fragility of the material, a pickup collet with minimal damage is needed. - The transfer device's transport speed was set to the slowest speed, but there was no improvement. ↓ ■Proposal "Replace the hard alloy collet with a rubber collet." As a result, the occurrence of cracks and micro-cracks was eliminated, and defects became "zero." *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment
• others

We would like to introduce a case of defect improvement in the transfer process of sensor chips that we proposed. In the process of transferring indium phosphide and gallium arsenide sensor chips to the inspection stage, defects due to cracks and micro-cracks were occurring. Due to the fragility of the material, the challenge was to create a pickup collet that would minimize damage. When we replaced the conventional very hard carbide collet with a rubber collet, the occurrence of cracks and micro-cracks was eliminated, resulting in zero defects. [Case Study] ■ Issues - Defects due to cracks and micro-cracks were occurring at a rate of 50%. - A damage-minimizing pickup collet was needed due to the fragility of the material. - The transport speed of the transfer device was set to the slowest speed, but no improvement was observed. ■ Proposal - Replaced the carbide collet with a rubber collet. - The occurrence of cracks and micro-cracks was eliminated, resulting in zero defects. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment
• others

Our company offers "rubber collets" that are less likely to cause semiconductor chip carry-out errors due to their low adhesion and are easy to replace. We have a wide range of standard sizes available and can also accommodate customizations according to your needs. Additionally, we strive for reasonable pricing. Currently, we are giving away product samples to 10 people through a lottery. If you are interested, please feel free to apply via the [Contact Form]. [Features] ■ Available in round, square, and rectangular tip shapes ■ We generally cover the mold costs for custom tip sizes ■ Made of rubber to avoid scratches on chip surfaces ■ Compliant with RoHS directives <Please consider adopting ORUTE as your partner!> (1) We have unique products with excellent functionality and extensive experience and track record. (2) We provide products that can address and solve your company's challenges. (3) We comply with regulations on chemical substances contained in products, such as RoHS. *For more details, please refer to the comprehensive catalog of our products available for download. *Our company will be exhibiting at the "1st Semiconductor Industry Exhibition" held at Marine Messe Fukuoka B Hall on September 25 (Wednesday) to 26 (Thursday).

• Other semiconductor manufacturing equipment

Orte Corporation manufactures low-impact resin collets and pickup tools for chip pickup, where even the slightest chip is unacceptable. For resource conservation and cost reduction, we offer a service to reuse metal shanks and replace only the resin tips with new ones. 【Features】 Material: Shank part - SUS Tip part: Can be processed with various engineering plastics such as polyimide, Teflon, and Duracon Minimum hole diameter: 70μm～ *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

It is recommended when using metal or resin pickup nozzles, as there is a risk of scratching the chip surface during die attachment. There is a wide variety of ultra-small sizes that are compatible with shrinking collets. They can be easily replaced on-site when used with the corresponding holder, and they are economical due to their low price. In recent years, there has been a shift from other materials. 【Features】 ■ Tip shapes: Three types - round, rectangular, square ■ Minimum sizes: Round OD=0.21mm ID=0.076mm Square L=0.152 W=0.152 ID=0.076 Rectangular L=0.15 W=0.38 ID=0.25 (Minimum hole diameter possible is 0.076mm) We also process holders for rubber tip attachments. *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment
• others

【Issue】 There have been frequent issues with the return of semiconductor chips in the diamond process, and we were looking for ways to reduce these return defects. 【Improvement Results】 We achieved a reduction in chip return defects, and specifically observed the following improvements: 1) Cost reduction due to the extended lifespan of the rubber nozzle 2) Unlike other companies' nozzles, we no longer needed to perform hardening before use 3) Reduction in hardening labor hours By discussing the product specifications with our customers and striving for prompt responses, we were able to demonstrate our technical capabilities regarding the surface condition of the rubber nozzle, which was also attractive. Customers appreciated that our products are competitively priced compared to others and have a longer lifespan. *For more details, please download the PDF or feel free to contact us.

• EMS
• Other semiconductor manufacturing equipment
• Other semiconductors

Orte Corporation offers productivity improvement proposals with pickup collets optimized for each semiconductor manufacturing device. 【No need for new mold production! Custom sizes starting from a minimum of 150μm on one side】 As industrial products become smaller, semiconductor chips are also increasingly required to be smaller. However, there have been instances of defects due to collet sizes not matching the chips. Traditionally, changing rubber collets required the production of new molds and associated costs. However, our unique technology allows us to produce rubber collets in the desired size at a low cost without the need for new mold production. *For more details, please download the PDF or feel free to contact us.

• EMS
• Other semiconductor manufacturing equipment
• Other semiconductors

Orte Corporation offers productivity improvement proposals with pickup collets optimized for each semiconductor manufacturing equipment. 【Unique technology to achieve zero pickup errors】 Pickup errors are caused by the stickiness of rubber collets, leading some to seek alternatives using metal or resin (plastic) collets. However, using metal or resin collets can result in defects due to collet scratches, which may not yield the expected benefits. Therefore, our unique technology enables us to manufacture special rubber collets with low stickiness, effectively reducing pickup errors to nearly zero. *For more details, please download the PDF or feel free to contact us.

• Other semiconductors
• EMS
• Other semiconductor manufacturing equipment

Orte Corporation offers pickup collets optimized for each semiconductor manufacturing equipment, contributing to your company's productivity improvement. In the "Comprehensive Product Catalog," we introduce the products handled by Orte Corporation. [Contents] Various tools for semiconductor manufacturing equipment Spare parts for chip component mounting machines Spare parts for SMT surface mount machines IC chip trays Products from Pico Parts (Israel) Examples of manufacturing carbide machine parts Winding nozzles *For details, please check the PDF download. If you are unsure about how to choose a collet, looking for a custom collet, or do not understand the cause of carry-back errors, please feel free to consult with us.

• others
• EMS

The EFO (Electric Torch) provided by our company is manufactured and supplied after confirming the specifications in the drawings to be applicable to various types of donut ring makers. Customizations are possible to meet purposes and budgets, such as "changing the thickness of the electrode tip" and "changing materials for longer lifespan"! Additionally, we provide products with overwhelming cost advantages from overseas, contributing to cost reductions for the companies we supply. 【Our Advantages】 - Stable ball formation - Excellent cost proposals - Customization according to purpose *For more details, please contact us or download the PDF.

• Other semiconductor manufacturing equipment
• others

**Introducing User Feedback** This small component is not only crucial in directly influencing the quality and productivity of the products we manufacture, but it also has the potential to become a bottleneck in our customers' order capacity. We have been at the forefront of recognizing its importance in the industry. We are continuously studying to recommend the optimal collet for the increasingly diverse semiconductor chips and their production environments. Fortunately, we are now recognized as more than just a manufacturer and supplier; we have become acknowledged as specialists in the pickup process. Many semiconductor manufacturers and equipment manufacturers seek our advice during the startup of new product manufacturing lines and request solutions for various challenges that arise on-site. We are very grateful for this, as it is thanks to our customers, partners, employees, and their families. We aim to support the manufacturing sites from behind the scenes and want our customers to produce products that are competitive on a global scale. With this aspiration, we continue to pay attention to global trends and the latest products, making it our mission to deliver valuable items to our customers. *Please download the user feedback.*

• EMS

The "IC Chip Tray" is a product of Ortec Corporation, which develops and manufactures consumable parts and pickup tools for semiconductor manufacturing equipment. We have a wide variety of molds available in different sizes. For special shapes that do not fit existing designs, we can design them to meet your required specifications. 【Features】 ■ Wide range of sizes ■ Material: PS resin ■ Usable temperature range: 70℃ to 90℃ *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment
• others

The "Vacuum Wand Suction Cup" is a product used for picking up lead frames and packages. Please choose according to the application and size. Holders and wands can also be manufactured. 【Features】 ■ Used for picking up lead frames and packages ■ Selectable according to application and size ■ Suction cup material: NBR rubber *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

The "Epoxy Dispensing Nozzle" is a product of Ortec Corporation, which develops and manufactures consumable parts for semiconductor manufacturing equipment and pickup tools. We design the optimal solution to address issues such as tailing, bridging, and unstable epoxy application amounts. 【Features】 ■ Design of optimal solutions ■ Three patterns: MATRIX, STAR, INTERLOCKING ■ Minimum pin pitch can be as small as 0.76mm (for a 25G 2-pin multi-nozzle) *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

The "Spark Electrode for Wire Bonders" is a product of Ortec Corporation, which develops and manufactures consumable parts and pickup tools for semiconductor manufacturing equipment. By using platinum electrodes with excellent electrical characteristics, a good current density can be achieved. Additionally, iridium (Ir), copper (Cu), and silver (Ag) are also used, and platinum has a high heat resistance and low wear due to oxidation, making it cost-effective and extending its lifespan. 【Features】 ■ Excellent electrical characteristics of platinum electrodes ■ Good current density ■ High heat resistance and low wear due to oxidation *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment
• others

The "Super Hard Die Colet" is a product of Orte Corporation, which develops and manufactures consumable parts for semiconductor manufacturing equipment and pickup tools. The inner dimensions of the cone are set so that half the thickness of the chip fits into the pocket of the die colet, ensuring that the die is securely held. Additionally, as an option, corner reliefs are processed to prevent chipping of the chip edges. 【Features】 ■ Dimension settings that allow half the thickness of the chip to fit into the pocket ■ Securely holds the die ■ Flat width on all four sides can be processed down to 20μ ■ Corner reliefs can also be processed (optional) *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment
• others

The "Stamping Tool (Transfer Pin)" is a product of Ortec Corporation, which develops and manufactures consumable parts for semiconductor manufacturing equipment and pickup tools. The material used is SUS303, and the Pin Type is available in a die size range from 0.2mm to 1mm, while the Star Type ranges from 0.75mm to 5mm. 【Features】 ■ Material: SUS303 ■ Pin Type: Die size from 0.2mm to 1mm ■ Bar Type: Die size from 0.2mm to 1mm ■ Star Type: Die size from 0.75mm to 5mm ■ Grid Type: Die size from 1.5mm and above *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements
• others

Orte Corporation is a company that handles consumable parts for semiconductor manufacturing equipment. We offer various parts used in the post-process, such as "epoxy dispensing nozzles" and "replaceable rubber collets (replaceable rubber tips)," and we can recommend the optimal collet based on our extensive case studies spanning several decades. If you have any issues related to semiconductors, please feel free to consult with us. 【Products We Handle】Excerpt ■ Replaceable rubber collets (replaceable rubber tips) ■ Carbide die collets ■ Resin collets ■ Stamping tools (transfer pins) ■ Spark electrodes for wire bonders, among others <Please consider ORUTE as your partner!> (1) We have unique products with excellent functionality and a wealth of experience and achievements. (2) We provide products that can address and solve your company's challenges. (3) We comply with regulations on chemical substances contained in products, such as RoHS. *For more details, please download the PDF or feel free to contact us.

• Other semiconductor manufacturing equipment
• Other machine elements