大船企業日本 Product Lineup

Achieving ultra-high precision engraving processing! Using our self-developed high-precision touch sensor, processing accuracy is approximately ±0.010mm (conditions negotiable). ■ This is an optional feature of the Vela external processing machine. ■ Direct detection of contact between the tool and the inner layer copper foil. ■ No insulation required between the spindle and the housing. ■ High-precision detection of the minute current flowing through the tool.

In semi-flexible substrates, high precision depth accuracy is required from the inner layer copper foil. By using our touch-type engraving mechanism and accurately detecting the target copper foil position, we can achieve high-precision engraving processing.

【Stub Remainder Inspection Function】 【Back Drill】 ■ In back drilling, the inspection of stub remainder holes*1 becomes a significant burden. ■ By using our touch detection function, inspection of stub remainder holes becomes possible. ■ Since it allows for inspection of all holes, it is an effective function for improving quality control.

[New Feature] In addition to the conventional CCD camera, we have added a CCD camera that recognizes and corrects the shape of the product's end face. - Recognizes and corrects the shape of the product's end face - For each piece, the shape and position of the plated terminal face can be recognized by the CCD camera, allowing for individual position correction - Enables high-precision positioning processing for each piece

【Automatic PIN Insertion and Extraction Function (One and Only)】 ■ This is an optional feature for Vela's contour machining machines. ■ It automatically performs "internal PIN hole machining," "PIN insertion," "contour machining," and "PIN extraction." ■ The manual "PIN insertion" process is eliminated, allowing for high-precision automatic PIN insertion, which reduces the wobbling of manually inserted pins and improves contour machining accuracy. ■ By performing PIN insertion simultaneously on six axes, production efficiency is also increased.

Inner Layer Detection Back Drill Function ■ The demand for "back drilling" to remove stubs to the target depth has been rapidly increasing due to the high-speed data communication of printed circuit boards. ■ In conventional back drilling, controlling the depth accuracy during stub processing (how effectively the stub can be removed close to the signal wiring layer) has been a challenge. ■ Our newly developed "inner layer detection back drill function" makes it possible to solve these issues. ■ By detecting the target inner layer position with a machine and performing back drilling based on that position information, stable processing can be achieved while keeping the minimum stub remaining.

Our company specializes in contract processing of printed circuit boards used in 5G, IoT, automotive, HDI, Mini-LED, and base stations. We possess UV/CO2 laser processing machines capable of ultra-small diameter processing, as well as drilling machines and router processing machines. By combining these, we can propose processing technologies for printed circuit boards tailored to your needs. We also accept technical consultations and development regarding processing methods, and we handle various inspection devices (such as Hall AOI and circuit AOI). 【Examples of Processing Materials】 PTFE-based, FR-5-based, PPE/PPO-based, R-5515, R-1566, MEG6, MEG7, MEG8, RO4350B, RO3003G2, etc. 【If you have the following requests, please feel free to consult with us】 - I want to process using CO2/UV or other lasers (processing with CO2/UV or PICO/femtosecond lasers, etc.) - I want to process new materials or difficult-to-process materials (ABF materials, Rogers materials, MEGTRON materials, glass materials, etc.) ★ We are also conducting test processing! If you are interested, please apply through the inquiry form. *We are currently offering materials that introduce processing examples.