大船企業日本 Product Lineup

1. Cu Direct BH Processing Results ■No.1: Example of untreated substrate Cu direct micro-diameter processing Hole diameter φ30–60μm ■No.2-1: Improvement in quality and productivity of Cu direct φ70μm processing ■No.2-2: Improvement in quality and productivity of Cu direct φ100μm processing

TH (Through Hole) Processing Results ■No.1: Example of processing untreated substrate Cu direct board thickness 200μm 　　Hole diameter φ70μm ■No.2: Example of processing untreated substrate Cu direct thin board Board thickness 40μm to 100μm 　　 Hole diameter φ40μm to φ70μm

ABF Resin Direct Processing Results ■No.1-1: Resin Direct (ABF GZ41 t32.5μm) Hole diameter φ30–50μm ■No.1-2: Resin Direct (ABF GZ41 t32.5μm) Hole diameter φ60–120μm ■No.2-1: Resin Direct (ABF Development Product t32.5μm) Hole diameter φ30–50μm ■No.2-2: Resin Direct (ABF Development Product t32.5μm) Hole diameter φ60–120μm

Our company specializes in contract processing of printed circuit boards used in 5G, IoT, automotive, HDI, Mini-LED, and base stations. We possess UV/CO2 laser processing machines capable of ultra-small diameter processing, as well as drilling machines and router processing machines. By combining these, we can propose processing technologies for printed circuit boards tailored to your needs. We also accept technical consultations and development regarding processing methods, and we handle various inspection devices (such as Hall AOI and circuit AOI). 【Examples of Processing Materials】 PTFE-based, FR-5-based, PPE/PPO-based, R-5515, R-1566, MEG6, MEG7, MEG8, RO4350B, RO3003G2, etc. 【If you have the following requests, please feel free to consult with us】 - I want to process using CO2/UV or other lasers (processing with CO2/UV or PICO/femtosecond lasers, etc.) - I want to process new materials or difficult-to-process materials (ABF materials, Rogers materials, MEGTRON materials, glass materials, etc.) ★ We are also conducting test processing! If you are interested, please apply through the inquiry form. *We are currently offering materials that introduce processing examples.

The PKG material 4-beam CO2 laser processing machine 'ECO-TL4C' is a new product that enables efficient processing with 2 tables and 4 beams. Compared to our conventional machine with 1 table and 1 beam, processing is completed in about half the time. It is a machine that combines processing quality and productivity, capable of quickly processing various materials. We also offer services such as contract processing using this product. 【Other Services】 ■ Manufacturing and sales of laser processing machines (Pico UV, Nano UV, etc.) ■ Contract processing for R&D and small-scale production using our own processing machines ■ Contract processing of interlayer insulating films, MEG materials, RO materials, PI, PTFE, etc. ★ We will demonstrate processing with this machine at the "JPCA Show 2023" starting on May 31. Please visit our booth (East Exhibition Hall 2B-04). *Please refer to the accompanying materials. Feel free to contact us with any inquiries.