大船企業日本 Product Lineup

1. High-frequency and 5G compatible substrate processing ■No.1-1: Example of φ100um blind hole and through hole processing on fluororesin substrate (Rogers RO3003) ■No.1-2: Example of φ100um blind hole and through hole processing, as well as router processing on liquid crystal polymer substrate (Panasonic FELIOS LCP) ■No.1-3: Example of φ20um to φ50um blind hole processing on liquid crystal polymer substrate ■No.1-4: Example of φ150um blind hole processing on Panasonic R5515, MEGTRON6, and MEGTRON7 substrates

2. Direct Processing of ABF Material Resin ■No.2-1: Example of blind hole processing with a diameter of φ10um to φ30um (t10um) ■No.2-2: Example of blind hole processing with a diameter of φ20um to φ40um (t25um) ■No.2-3: Example of square hole processing 20x20um, 30x30um, 40x40um, and 60x20um (t25um) ■No.2-4: Example of blind hole processing with a diameter of φ20um to φ50um, and an example of quality control for the bottom of φ50um blind holes (t23um)

3. Copper foil removal processing ■No.3-1: Example of punching processing with a diameter of φ10um to φ30um (t1.5um copper foil) ■No.3-2: Example of trepanning processing with a diameter of φ25um to φ100um (t5um copper foil)

4. Flexible substrate processing ■No.4-1: Example of blind hole processing for single-sided flexible substrates with diameters from φ20um to φ50um ■No.4-2: Example of blind hole processing for double-sided flexible substrates with diameters from φ25um to φ100um

5. Router (External Shape) Processing ■No.5-1: Example of irregular shape cutting processing of flexible printed circuit boards ■No.5-2: Example of cutting processing of Cu + prepreg multilayer boards

6. UV & CO2 Composite Laser Processing ■ No. 6-1: Example of φ100um blind hole processing on fluororesin substrate (Rogers RO3003) ■ No. 6-2: Example of φ100um blind hole processing on Cu + prepreg substrate

Our company specializes in contract processing of printed circuit boards used in 5G, IoT, automotive, HDI, Mini-LED, and base stations. We possess UV/CO2 laser processing machines capable of ultra-small diameter processing, as well as drilling machines and router processing machines. By combining these, we can propose processing technologies for printed circuit boards tailored to your needs. We also accept technical consultations and development regarding processing methods, and we handle various inspection devices (such as Hall AOI and circuit AOI). 【Examples of Processing Materials】 PTFE-based, FR-5-based, PPE/PPO-based, R-5515, R-1566, MEG6, MEG7, MEG8, RO4350B, RO3003G2, etc. 【If you have the following requests, please feel free to consult with us】 - I want to process using CO2/UV or other lasers (processing with CO2/UV or PICO/femtosecond lasers, etc.) - I want to process new materials or difficult-to-process materials (ABF materials, Rogers materials, MEGTRON materials, glass materials, etc.) ★ We are also conducting test processing! If you are interested, please apply through the inquiry form. *We are currently offering materials that introduce processing examples.