大船企業日本 List of Products and Services

The manufacturing of electronic circuits for CPUs, which are becoming increasingly miniaturized, requires more precise processing. Therefore, the selection of processing machines is crucial, with quality and productivity being important factors. The "ECO-TL4C" from Ofuna Corporation Japan is a new type of CO2 laser processing machine that enhances the processing quality of substrate materials for packaging, including interlayer insulating film materials, through its unique functions, enabling efficient processing with two tables and four beams.

When high-quality processing is required for glass materials, printed circuit board materials, semiconductor-related materials, and others that are difficult to process in nanoseconds while minimizing thermal effects, using picosecond or femtosecond laser processing machines is effective. We have published examples of processing various materials with our picosecond UV laser machine.

Using our unique technology, we can ensure high-quality hole shapes and achieve the desired taper rate. This document details the processing of materials with a thickness of 32.5μm using a CO2 laser, down to a minimum diameter of φ30μm.

Using the top-hat beam with a minimum beam diameter of φ10μm or less from our UV laser processing machine, we achieve high-quality drilling with a steep taper. This document includes processing examples with a minimum diameter of φ20μm for package material with a thickness of t25μm and a minimum diameter of φ10μm for package material with a thickness of t10μm.

The laser processing machine [Multi-purpose 1-axis laser processing machine] is a new product from the Japanese company Ofuna, which was first exhibited at 'JPCA 2022'. You can choose the laser oscillator and table specifications according to your processing needs, and we will customize it for you. [Please consult us if you have the following requests] - I have a laser oscillator I want to use, but I can't turn it into a device. → We can accommodate laser oscillators such as CO2, UV, Green, and IR, so please consult us. - I want a low-cost laser processing machine for development purposes. → We will discuss your budget and propose equipment specifications. - I need a high-precision laser processing machine for the development of cutting-edge products. → We will consult on the specifications and customize it for you. - I want to conduct laser routing processing tests. → We have a demo machine equipped with a UV laser oscillator, so please consult us. *For more details, please refer to the PDF materials or feel free to contact us. We also have photos of processing examples for printed circuit boards (1mm thick) for 5G applications.

This is experimental data for a multipurpose one-axis laser currently under development, intended for fields such as semiconductors and automotive components that require high-precision processing. It is a very expensive piece of equipment and is still in the development stage, but if you absolutely need high-precision processing despite the cost, please feel free to consult with us.

Our company sells laser processing machines developed in-house, and we also accept contract processing from prototypes to mass-produced products. We specialize in technological development, so we can handle everything from the development of processing methods for new materials and products to contract processing and manufacturing sales of mass-produced items. Please feel free to consult with us.

In the processing of polyimide and liquid crystal polymer materials, we achieve high-quality drilling by using a Gaussian beam with a minimum spot diameter of φ10μm for copper foil removal processing and a top-hat beam for resin processing.

Our company sells in-house developed laser processing machines (from CO2 lasers to nanosecond, picosecond, and femtosecond UV lasers), and we accept contract processing from test processing for product machining technology development to small-scale production sales during our customers' initial development stages. This document includes processing examples of SI wafers, ceramics, multilayer boards, and double-sided boards using picosecond lasers.

Using our UV laser processing machine for high-speed routing, we achieve high-quality contour processing, cavity processing, singulation processing, and engraving processing for various substrates. This document includes examples of routing processing for multilayer boards of Cu/PP, double-sided boards of Cu/LCP, flexible substrates, and FR-4, among others.

Our company sells laser processing machines developed in-house, and we also accept contract processing from prototype to mass production. We specialize in technological development, so we can handle everything from the development of processing methods for new materials and products to contract processing of mass-produced items and the manufacturing and sales of equipment. Please feel free to consult with us.

In a case where through-hole processing was performed on a double-sided plate with a thickness of φ2μm using a CO2 laser processing machine, we control the cross-sectional shape of the through-holes according to the customer's needs using our unique technology.

This is an example of using our equipment's unique features to ensure high-quality hole shapes and aim for a reduction in the number of shots. In this document, we have achieved a reduction from the usual 4 shots to 3 shots by utilizing these unique features.

Our company has two types of processing technologies, UV and CO2, and by combining the advantages of lasers, we achieve optimal drilling processing for newly developed substrate materials. This document includes processing examples of fluororesins, liquid crystal polymers, PPE resins, and more.

Our company has two types of processing technologies, UV and CO2, and by combining the advantages of these lasers, we are able to achieve high-quality laser drilling that reduces the burden of subsequent processes. This document discusses the processing of multilayer boards, and to avoid damaging the inner copper foil, we perform resin processing with CO2 after drilling, followed by UV processing to remove residues at the bottom of the holes.