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Daibune Corporation Japan Co., Ltd. offers a variety of specifications for "spindles." In addition to spindles for external processing machines with rotational speeds ranging from 60,000 to 20,000 RPM, we also handle spindles for drilling machines with rotational speeds of 160,000 to 30,000 RPM. 【Lineup】 ■ FR06: Rotational speed 60,000 to 10,000 RPM, spindle for external processing machines ■ F80P: Rotational speed 80,000 to 20,000 RPM, spindle for external processing machines ■ F16P: Rotational speed 160,000 to 20,000 RPM, spindle for drilling machines ■ F20P: Rotational speed 200,000 to 20,000 RPM, spindle for drilling machines ■ F30P: Rotational speed 300,000 to 30,000 RPM, spindle for drilling machines *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registration"Hole AOI" inspects and measures the hole positions, hole diameters, and hole accuracy of substrates or films, as well as shrinkage and expansion rates. In addition, it is equipped with a high-performance image acquisition system, allowing for the inspection and measurement of a thousand holes within a few seconds. Furthermore, it achieves high precision of 5 micrometers, with the capability to inspect and measure up to one million holes per panel. We also offer "Hole AOI Express." 【Features】 ■ High-performance image acquisition system ■ Capable of inspecting and measuring a thousand holes within a few seconds ■ Capable of inspecting and measuring up to one million holes per panel *For more details, please refer to the PDF materials or feel free to contact us.
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Free membership registrationThe Daifune Group is engaged in the manufacturing and sales of drilling machines and profile processing machines, as well as contract processing using various laser processing machines. At the "Total Solutions for Electronic Devices Exhibition 2019," starting on June 5, we will introduce our unique processing technologies and drilling/profile processing machines. We will also display actual models of fully automatic AOI and X-ray inspection equipment, and provide detailed explanations of the features of each product. [Exhibition Content] ■ CO2 and UV laser processing (we also accept prototypes for 5G laser processing) ■ Drilling machines and profile processing machines (processing technology for base stations, communications, and automotive substrates) ■ Fully automatic AOI (also for labor-saving, IoT, inline, and cloud applications) ■ X-ray inspection equipment (for multilayer boards) *You can view related product materials from the "PDF Download" section.
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