大船企業日本 List of Products and Services

【Bargain】Taiwan-made Tool Post ■We have a variety available.

• Other machine elements

【Bargain】Taiwan-made tool post 　■Various types are available.

• Other machine elements

【Bargain】Taiwan-made Tool Post 　■Various types are available.

• Other machine elements

【Bargain】Taiwan-made tool post 　■Various types are available.

• Other machine elements

【Bargain】Taiwan-made tool post 　■Various types are available.

• Other machine elements

【Bargain】Taiwan-made Tool Post 　■Various types are available.

• Other machine elements

[For those having trouble with procurement of spare parts] ■ We sell interfaces for hole drilling machines and contour processing machines with linear scales. ■ We also accept replacement work.

• Other machine elements

Full hole inspection with laser beer is possible! - Dual CCD, no alignment required, fastest in the industry with the same resolution: 25 seconds per sheet (5um) - Uses telecentric telephoto lens, no misrecognition issues due to angles - Usable for multiple processes, conformal, and DLD - For high resolution of 2um, minimum measurable diameter is 20um - Original one-touch minimalist operation mode - Full substrate inspection, blind hole defect statistical analysis, group check function for defective detection holes, improved re-inspection efficiency - Customer sales record: 417 units, top market share

• Visual Inspection Equipment

【Inexpensive】 ■Made in Japan, high reliability ■Linear scale for hole drilling machines and contour processing machines ■We also accept replacement work

• Other machine elements

【Inexpensive】 ■Made in Japan, high reliability ■Linear scale for hole drilling machines and shape processing machines ■We also accept replacement work

• Other machine elements

【Inexpensive】 ■Made in Japan, high reliability ■Linear scale for hole drilling machines and contour processing machines ■Exchange work is also accepted

• Other machine elements

Low-cost linear scale

• Other machine elements

Low-cost amplifier for tool sensors ■Various types are available.

• Other machine elements

Affordable tool sensor amplifiers We have a variety available.

• Other machine elements

Affordable optical fiber for tool sensors ■Various types are available.

• Other machine elements

Affordable optical fiber for tool sensors We have a variety available.

• Other machine elements

【Bargain】 BDD Sensors 　■We have a variety available.

• Other machine elements

【Affordable】 BDD Sensors 　■We have a variety available.

• Other machine elements

【Affordable】CCD Sensors 　■We have a variety available.

• Other machine elements

【Affordable】CCD Sensors 　■We have a variety available.

• Other machine elements

【Bargain】Taiwan-made Floating Joint 　■Various types are available.

• Other machine elements

Affordable bush changer cylinder We have a variety available.

• Other machine elements

Low-cost bush changer cylinder We have a variety available.

• Other machine elements

Low-cost cylinder for bush changers We have a variety available.

• Other machine elements

Low-cost cylinder for bush changers We have a variety available.

• Other machine elements

Low-cost bush changer cylinder ■Various types are available.

• Other machine elements

1. High-frequency and 5G compatible substrate processing ■No.1-1: Example of φ100um blind hole and through hole processing on fluororesin substrate (Rogers RO3003) ■No.1-2: Example of φ100um blind hole and through hole processing, as well as router processing on liquid crystal polymer substrate (Panasonic FELIOS LCP) ■No.1-3: Example of φ20um to φ50um blind hole processing on liquid crystal polymer substrate ■No.1-4: Example of φ150um blind hole processing on Panasonic R5515, MEGTRON6, and MEGTRON7 substrates

• Circuit board processing machine

2. Direct Processing of ABF Material Resin ■No.2-1: Example of blind hole processing with a diameter of φ10um to φ30um (t10um) ■No.2-2: Example of blind hole processing with a diameter of φ20um to φ40um (t25um) ■No.2-3: Example of square hole processing 20x20um, 30x30um, 40x40um, and 60x20um (t25um) ■No.2-4: Example of blind hole processing with a diameter of φ20um to φ50um, and an example of quality control for the bottom of φ50um blind holes (t23um)

• Circuit board processing machine

3. Copper foil removal processing ■No.3-1: Example of punching processing with a diameter of φ10um to φ30um (t1.5um copper foil) ■No.3-2: Example of trepanning processing with a diameter of φ25um to φ100um (t5um copper foil)

• Circuit board processing machine

4. Flexible substrate processing ■No.4-1: Example of blind hole processing for single-sided flexible substrates with diameters from φ20um to φ50um ■No.4-2: Example of blind hole processing for double-sided flexible substrates with diameters from φ25um to φ100um

• Circuit board processing machine

5. Router (External Shape) Processing ■No.5-1: Example of irregular shape cutting processing of flexible printed circuit boards ■No.5-2: Example of cutting processing of Cu + prepreg multilayer boards

• Circuit board processing machine

6. UV & CO2 Composite Laser Processing ■ No. 6-1: Example of φ100um blind hole processing on fluororesin substrate (Rogers RO3003) ■ No. 6-2: Example of φ100um blind hole processing on Cu + prepreg substrate

• Circuit board processing machine

1. Cu Direct BH Processing Results ■No.1: Example of untreated substrate Cu direct micro-diameter processing Hole diameter φ30–60μm ■No.2-1: Improvement in quality and productivity of Cu direct φ70μm processing ■No.2-2: Improvement in quality and productivity of Cu direct φ100μm processing

• Circuit board processing machine

TH (Through Hole) Processing Results ■No.1: Example of processing untreated substrate Cu direct board thickness 200μm 　　Hole diameter φ70μm ■No.2: Example of processing untreated substrate Cu direct thin board Board thickness 40μm to 100μm 　　 Hole diameter φ40μm to φ70μm

• Circuit board processing machine

ABF Resin Direct Processing Results ■No.1-1: Resin Direct (ABF GZ41 t32.5μm) Hole diameter φ30–50μm ■No.1-2: Resin Direct (ABF GZ41 t32.5μm) Hole diameter φ60–120μm ■No.2-1: Resin Direct (ABF Development Product t32.5μm) Hole diameter φ30–50μm ■No.2-2: Resin Direct (ABF Development Product t32.5μm) Hole diameter φ60–120μm

• Circuit board processing machine

Inner Layer Detection Back Drill Function ■ The demand for "back drilling" to remove stubs to the target depth has been rapidly increasing due to the high-speed data communication of printed circuit boards. ■ In conventional back drilling, controlling the depth accuracy during stub processing (how effectively the stub can be removed close to the signal wiring layer) has been a challenge. ■ Our newly developed "inner layer detection back drill function" makes it possible to solve these issues. ■ By detecting the target inner layer position with a machine and performing back drilling based on that position information, stable processing can be achieved while keeping the minimum stub remaining.

• Circuit board processing machine

Our company specializes in contract processing of printed circuit boards used in 5G, IoT, automotive, HDI, Mini-LED, and base stations. We possess UV/CO2 laser processing machines capable of ultra-small diameter processing, as well as drilling machines and router processing machines. By combining these, we can propose processing technologies for printed circuit boards tailored to your needs. We also accept technical consultations and development regarding processing methods, and we handle various inspection devices (such as Hall AOI and circuit AOI). 【Examples of Processing Materials】 PTFE-based, FR-5-based, PPE/PPO-based, R-5515, R-1566, MEG6, MEG7, MEG8, RO4350B, RO3003G2, etc. 【If you have the following requests, please feel free to consult with us】 - I want to process using CO2/UV or other lasers (processing with CO2/UV or PICO/femtosecond lasers, etc.) - I want to process new materials or difficult-to-process materials (ABF materials, Rogers materials, MEGTRON materials, glass materials, etc.) ★ We are also conducting test processing! If you are interested, please apply through the inquiry form. *We are currently offering materials that introduce processing examples.

• Processing Contract

The "ECO-RM Series" is a contour processing machine with individually driven axes that can perform high-precision contour machining for patterns. With axis alignment correction, it automatically compensates for the expansion and rotation of the substrate on a per-axis basis (when equipped with a CCD camera). The machine itself drills reference holes and sets inner pins for substrate fixation, enabling high-precision alignment processing for each piece when used in conjunction with the axis alignment correction function. 【Features】 ■ Axis Alignment Correction - Automatically compensates for substrate expansion and rotation on a per-axis basis - Enables high-precision contour machining for patterns ■ Automatic Pin Insertion Function (Optional) - The machine drills reference holes and sets inner pins for substrate fixation - Allows for high-precision alignment processing for each piece *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

The "ECO-DM Series" is a drilling machine with individually driven axes that can achieve high-precision hole drilling on patterns after plating. With the DFSi detection mechanism, it enables hole drilling for BH processing and BD processing through inner layer detection of the substrate. Additionally, high-speed hole drilling is possible with X, Y, Z linear motors and a Z-axis air housing guide. 【Features】 ■ Automatic alignment correction for each axis (when equipped with a CCD camera) - Achieves high-precision hole drilling on patterns after plating - Enables high-precision back drilling ■ High-speed and high-precision hole drilling is possible with X, Y, Z linear motors and a Z-axis air housing guide *For more details, please refer to the PDF materials or feel free to contact us.

• Other processing machines

X-ray inspection of 56-layer high multilayer boards is possible! 【Features】 - Supports inspection of inner layer patterns after lamination pressing and hole drilling - Utilizes unique image technology - Employs X-ray super mini focus tube - Simple and fast image acquisition - Functions for measuring diameter, distance, and accuracy - Immediate image editing, output/save functions

• X-ray inspection equipment

This is a device for visual inspection of circuit defects on printed circuit boards. 【Features】 - By scanning both sides of the board simultaneously, the production capacity is five times that of conventional inspection devices. - The FSD micro short-circuit detection system enables the detection of micro short-circuits between circuits. - Exceptional inspection results are provided through significantly enhanced SBD computational design. - Inspections are conducted simultaneously with continuous image acquisition of AOI. - It can be used inline.

• Visual Inspection Equipment

We offer a variety of inspection equipment for all manufacturing processes of printed circuit boards! 【Recent Best Sellers】 - World-leading LV AOI: Inspects all holes for laser blind hole via diameter and residue at the bottom of the holes. - World-leading hole AOI: Conducts full inspection of hole positions and diameters for laser through holes with a diameter of 40μm or less. - We also have many other inspection devices, including Circuit AOI.

• Circuit Board Inspection Equipment

World's top share, world standard Hole AOI! 【Features】 - Capable of inspecting hole diameters as small as 45μm - Usable for inspecting laser through-hole vias - Used for shipping inspections by many major equipment manufacturers - High-precision inspection possible through patented technology combining top light and backlight inspection - Equipped with numerous analysis functions

• Circuit Board Inspection Equipment

We conduct a full inspection of the hole diameter and residue at the bottom of the holes after laser processing. *We also have inspection equipment compatible with rigid substrates. 【Features】 - Dual CCD, the fastest in the industry with the same resolution - Uses telecentric lenses, eliminating misrecognition issues due to angles - Capable of measuring a minimum diameter of 20um - Sales performance with the world's top market share

• Circuit Board Inspection Equipment

Using our unique technology, we can ensure high-quality hole shapes and achieve the desired taper rate. This document details the processing of materials with a thickness of 32.5μm using a CO2 laser, down to a minimum diameter of φ30μm.

• Processing Contract