大船企業日本 List of Products and Services

In a case where through-hole processing was performed on a double-sided plate with a thickness of φ2μm using a CO2 laser processing machine, we control the cross-sectional shape of the through-holes according to the customer's needs using our unique technology.

• Processing Contract

This is an example of using our equipment's unique features to ensure high-quality hole shapes and aim for a reduction in the number of shots. In this document, we have achieved a reduction from the usual 4 shots to 3 shots by utilizing these unique features.

• Processing Contract

Our company has two types of processing technologies, UV and CO2, and by combining the advantages of lasers, we achieve optimal drilling processing for newly developed substrate materials. This document includes processing examples of fluororesins, liquid crystal polymers, PPE resins, and more.

• Processing Contract

Our company has two types of processing technologies, UV and CO2, and by combining the advantages of these lasers, we are able to achieve high-quality laser drilling that reduces the burden of subsequent processes. This document discusses the processing of multilayer boards, and to avoid damaging the inner copper foil, we perform resin processing with CO2 after drilling, followed by UV processing to remove residues at the bottom of the holes.

• Processing Contract

Our company sells in-house developed laser processing machines (from CO2 lasers to nanosecond, picosecond, and femtosecond UV lasers), and we accept contract processing from test processing for product machining technology development to small-scale production sales during our customers' initial development stages. This document includes processing examples of SI wafers, ceramics, multilayer boards, and double-sided boards using picosecond lasers.

• Processing Contract

Using the top-hat beam with a minimum beam diameter of φ10μm or less from our UV laser processing machine, we achieve high-quality drilling with a steep taper. This document includes processing examples with a minimum diameter of φ20μm for package material with a thickness of t25μm and a minimum diameter of φ10μm for package material with a thickness of t10μm.

• Processing Contract

In the processing of polyimide and liquid crystal polymer materials, we achieve high-quality drilling by using a Gaussian beam with a minimum spot diameter of φ10μm for copper foil removal processing and a top-hat beam for resin processing.

• Processing Contract

Using our UV laser processing machine for high-speed routing, we achieve high-quality contour processing, cavity processing, singulation processing, and engraving processing for various substrates. This document includes examples of routing processing for multilayer boards of Cu/PP, double-sided boards of Cu/LCP, flexible substrates, and FR-4, among others.

• Processing Contract

The laser processing machine [Multi-purpose 1-axis laser processing machine] is a new product from the Japanese company Ofuna, which was first exhibited at 'JPCA 2022'. You can choose the laser oscillator and table specifications according to your processing needs, and we will customize it for you. [Please consult us if you have the following requests] - I have a laser oscillator I want to use, but I can't turn it into a device. → We can accommodate laser oscillators such as CO2, UV, Green, and IR, so please consult us. - I want a low-cost laser processing machine for development purposes. → We will discuss your budget and propose equipment specifications. - I need a high-precision laser processing machine for the development of cutting-edge products. → We will consult on the specifications and customize it for you. - I want to conduct laser routing processing tests. → We have a demo machine equipped with a UV laser oscillator, so please consult us. *For more details, please refer to the PDF materials or feel free to contact us. We also have photos of processing examples for printed circuit boards (1mm thick) for 5G applications.

• Other machine tools

This is experimental data for a multipurpose one-axis laser currently under development, intended for fields such as semiconductors and automotive components that require high-precision processing. It is a very expensive piece of equipment and is still in the development stage, but if you absolutely need high-precision processing despite the cost, please feel free to consult with us.

• Other machine tools

The "CO2 Laser Processing Machine" achieves low power consumption through a design that eliminates waste. It supports various surface treatments such as blackening, browning, and untreated, as well as various processing methods like DLD and Conformal Mask. It offers comfortable operability with our in-house developed CNC. 【Features】 ■ Achieves low power consumption through a design that eliminates waste ■ Supports various surface treatments (blackening, browning, untreated) ■ Supports various processing methods (DLD, Conformal Mask, Resin Direct) ■ Comfortable operability with our in-house developed CNC ■ Contract processing and equipment sales *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

Our company sells laser processing machines developed in-house, and we also accept contract processing from prototypes to mass-produced products. We specialize in technological development, so we can handle everything from the development of processing methods for new materials and products to contract processing and manufacturing sales of mass-produced items. Please feel free to consult with us.

• Processing Contract

Our company sells laser processing machines developed in-house, and we also accept contract processing from prototype to mass production. We specialize in technological development, so we can handle everything from the development of processing methods for new materials and products to contract processing of mass-produced items and the manufacturing and sales of equipment. Please feel free to consult with us.

• Processing Contract

[6-Axis Independently Driven Mechanical Processing Machine] Our company manufactures and sells 6-axis independently driven mechanical processing machines for drilling and contour processing applications of printed circuit boards. The 6-axis independently driven mechanical processing machine is widely used in processes requiring high precision alignment, such as BGA, FC-BGA, CSP boards, as well as methods like Blind Hole and Back Drill.

• Processing Contract

This is a high-torque, high-speed, high-precision spindle capable of 300,000 RPM. Due to its high torque, it can perform long hole machining, and thanks to its stable design at the maximum speed of 300,000 RPM, it is possible to machine at this speed without needing to reduce the RPM for safety margins.

• Drill press

This is a series of contour processing machines equipped with a rich variety of optional features. 【Example of optional features】 - 【Unique】 Automatic PIN insertion/extraction function - High-precision counterboring function - CCD alignment function - PIN-less function - Board push-up function And so on, we can propose optional features tailored to the customer's needs. If you have any inquiries, please feel free to contact us.

• Other machine tools

This is a high-torque, high-speed spindle, capable of handling a variety of machining processes that could not typically be achieved with a single spindle, including thick copper substrates, long hole processing, and large diameter machining with a diameter of φ6.35, as well as high multilayer substrates.

• Drill press

High-precision processing with alignment correction is possible by recognizing the shape of the substrate. 【Features】 - Position measurement is performed for each piece, allowing for high-precision processing against the substrate pattern. - By using our depth inspection sensor (DSFi sensor) in conjunction, high-precision counterboring is possible.

• Other machine tools

The high-precision height detection sensor "DSFi Sensor" developed by our company can be used for immediate drill break detection as well as for high-precision substrate height detection in precision counterboring processes. In traditional probe methods, height errors occur between the probe and the tool, making high-precision counterboring difficult. However, by using our height detection sensor, it is possible to detect when the tool contacts the work surface, thereby reducing height errors between the work surface and the measurement surface, as well as errors for each tool, allowing for high-precision machining.

• Other machine tools

Detect the target inner layer surface with the router bit and perform the counterboring process based on that position. It can also be used for high-precision exposure of the inner layer copper foil or for processing that leaves a specified amount of inner layer resin.

• Other machine tools

This is a 6-axis contour machining machine with individually driven XYZ axes. The standard model had a total of 8 axes, with 6 Z axes and only one X and one Y axis each. However, this equipment allows for the X and Y axes to be driven for a single Z axis, resulting in a total of 18 axes. Therefore, independent correction values can be input for each table, enabling improved machining precision.

• Other machine tools

This is a 6-axis hole machining machine with individually driven XYZ axes. In the standard model, there were a total of 8 axes driven, with 6 Z axes and only one X and one Y axis each. However, this equipment is designed to drive the X and Y axes for each Z axis, resulting in a total of 18 axes driven. Therefore, independent correction values can be input for each table, allowing for improved machining precision. After primary hole machining, it is capable of high-precision machining for secondary and tertiary holes by aligning them, as well as for back drilling processes where alignment of holes on both sides is required.

• Drill press

We manufacture and sell various spindles ranging from 60Krpm, 80Krpm, 125Krpm, 160Krpm, 200Krpm, 300Krpm, to 350Krpm. In particular, our spindles meet a wide range of customer demands with high torque and high precision!

• Other machine tools

This is a versatile machine equipped with a Vela-made high-torque, high-precision spindle. The spindle can be selected according to customer preferences at speeds of up to 80Krpm, 125Krpm, 160Krpm, 200Krpm, and 300Krpm, and if necessary, spindle replacement modifications can be made after equipment purchase (for a fee)! It is a cost-effective piece of equipment.

• Drill press

This is equipment designed for high-precision substrates that fully utilizes the performance of Vela's 300Krpm and 350Krpm spindles. The Z-axis features a linear drive specification, enabling high-speed operation of the Z-axis, making it suitable for high-speed and high-precision processing of high-precision substrates.

• Drill press

This is a high-precision back drill function using our company's high-precision height detection sensor (DSFi sensor). It detects the reference inner layer position with a drill, stores the reference position, and processes the depth data based on the reference inner layer position data.

• Drill press

This is an example of processing multilayer boards with copper plating for the military industry. Even for materials that include glass cloth, high-quality drilling is possible due to a highly stable spindle and a bushing mechanism that holds down the area near the processing hole.

• Drill press

The PKG material 4-beam CO2 laser processing machine 'ECO-TL4C' is a new product that enables efficient processing with 2 tables and 4 beams. Compared to our conventional machine with 1 table and 1 beam, processing is completed in about half the time. It is a machine that combines processing quality and productivity, capable of quickly processing various materials. We also offer services such as contract processing using this product. 【Other Services】 ■ Manufacturing and sales of laser processing machines (Pico UV, Nano UV, etc.) ■ Contract processing for R&D and small-scale production using our own processing machines ■ Contract processing of interlayer insulating films, MEG materials, RO materials, PI, PTFE, etc. ★ We will demonstrate processing with this machine at the "JPCA Show 2023" starting on May 31. Please visit our booth (East Exhibition Hall 2B-04). *Please refer to the accompanying materials. Feel free to contact us with any inquiries.

• Other processing machines

When high-quality processing is required for glass materials, printed circuit board materials, semiconductor-related materials, and others that are difficult to process in nanoseconds while minimizing thermal effects, using picosecond or femtosecond laser processing machines is effective. We have published examples of processing various materials with our picosecond UV laser machine.

• Other semiconductor manufacturing equipment

The manufacturing of electronic circuits for CPUs, which are becoming increasingly miniaturized, requires more precise processing. Therefore, the selection of processing machines is crucial, with quality and productivity being important factors. The "ECO-TL4C" from Ofuna Corporation Japan is a new type of CO2 laser processing machine that enhances the processing quality of substrate materials for packaging, including interlayer insulating film materials, through its unique functions, enabling efficient processing with two tables and four beams.

• Other semiconductor manufacturing equipment

This machine is equipment that has uniquely improved processing accuracy and quality for package substrates, and it is a high-precision drilling machine specialized for ultra-small diameters. It can also accommodate installation floor conditions, so please feel free to consult with us.

• Drill press

[New Feature] In addition to the conventional CCD camera, we have added a CCD camera that recognizes and corrects the shape of the product's end face. - Recognizes and corrects the shape of the product's end face - For each piece, the shape and position of the plated terminal face can be recognized by the CCD camera, allowing for individual position correction - Enables high-precision positioning processing for each piece

• Circuit board processing machine

【Stub Remainder Inspection Function】 【Back Drill】 ■ In back drilling, the inspection of stub remainder holes*1 becomes a significant burden. ■ By using our touch detection function, inspection of stub remainder holes becomes possible. ■ Since it allows for inspection of all holes, it is an effective function for improving quality control.

• Circuit board processing machine

In semi-flexible substrates, high precision depth accuracy is required from the inner layer copper foil. By using our touch-type engraving mechanism and accurately detecting the target copper foil position, we can achieve high-precision engraving processing.

• Circuit board processing machine

【Automatic PIN Insertion and Extraction Function (One and Only)】 ■ This is an optional feature for Vela's contour machining machines. ■ It automatically performs "internal PIN hole machining," "PIN insertion," "contour machining," and "PIN extraction." ■ The manual "PIN insertion" process is eliminated, allowing for high-precision automatic PIN insertion, which reduces the wobbling of manually inserted pins and improves contour machining accuracy. ■ By performing PIN insertion simultaneously on six axes, production efficiency is also increased.

• Circuit board processing machine

■Supports layered press and inner layer pattern inspection after hole drilling ■Adopts unique Image technology ■Uses X-ray super mini focus tube ■Image acquisition is simple and fast ■Functions for measuring diameter, distance, and angle ■Immediate image editing, output/save functions

• X-ray inspection equipment

【Inline circuit inspection is possible!!】 - Reduction of personnel/costs/management, automation, simultaneous measurement on two sides, production capacity equivalent to 6 standard AOI units. - Equipped with a color camera and patented high-resolution CCD, compatible with circuits of 1.4 mil, 1.8 mil, and 2.5 mil. - Patented vacuum suction conveyor and full-illumination LED design. - Usable both online and offline, AI support features, group review function, and a 50% reduction in re-inspection frequency and labor costs. - Customer sales record: 121 units (98 black and white + 23 color). - Certification/introduction from major PCB factories in the industry.

• Visual Inspection Equipment

"Laser Beer (Stop Hole) Full Hole Inspection is Possible!" - Dual CCD, no alignment required, fastest in the industry at the same resolution: 25 sec/frame (5um) - Uses telecentric telephoto lens, no misrecognition issues due to angle - Usable for multiple processes, conformal, and DLD - For high resolution of 2um, minimum measurable diameter is 20um - Original one-touch minimalist operation mode - Full substrate inspection, blind hole defect statistical analysis, group check function for defective detection holes, improved re-inspection efficiency - Customer sales record: 417 units, top market share

• Visual Inspection Equipment

Achieving ultra-high precision engraving processing! Using our self-developed high-precision touch sensor, processing accuracy is approximately ±0.010mm (conditions negotiable). ■ This is an optional feature of the Vela external processing machine. ■ Direct detection of contact between the tool and the inner layer copper foil. ■ No insulation required between the spindle and the housing. ■ High-precision detection of the minute current flowing through the tool.

• Circuit board processing machine

The "Vela UV" is a laser processing machine equipped with a high-speed UV oscillator operating at a wavelength of 355nm. It performs high-speed, high-precision micro-diameter processing of printed circuit boards and other materials. Additionally, it allows for the selection of suitable laser sources based on materials and purposes. The two-axis configuration enables high-speed processing of two workpieces simultaneously. 【Features】 ■ Ability to select suitable laser sources based on materials and purposes ■ High-speed processing of two workpieces simultaneously due to the two-axis configuration ■ Capable of micro-diameter processing from 10μm to 30μm ■ Comfortable operability with in-house developed CNC ■ Support for test processing ■ Contract processing and equipment sales *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

Introducing optical lenses for Japanese-made CO2 laser processing machines. 【Product Lineup】 ● 2149134 Homogenizer Lens L2 BS LENS for LC_2F and earlier LAS25.4_CT4(9.4) ● 2149133 Homogenizer Lens L1 BS LENS for LC_2F and earlier LAS38.1_CT7(9.4) * For more details, please download the PDF or contact us. * If you need any other necessary parts not listed, please contact us.

• Other processing machines

The "ECO-DE Series" is a drilling machine that allows for operational service (maintenance) through simple operations. It can be equipped with spindles that rotate at 160,000, 200,000, or 300,000 RPM, enabling the processing of various diameters with high torque and high efficiency. Additionally, the new cooling system achieves high precision, long lifespan, and high stability in processing. 【Features】 ■ User-friendly interface design ■ Diversification and high performance ■ High rigidity and thermal balance design ■ Compatible with large substrates ■ Back drilling processing capability *For more details, please download the PDF or feel free to contact us.

• Other processing machines

The "ECO-DL1LE" is a new model of a single-axis drilling machine from VELA, which has achieved improved machining accuracy and stabilized alignment through significant enhancements in the rigidity and thermal balance of the machine body. It realizes increased machining speed through the use of linear motors on the X, Y, and Z axes. Spindle selection is possible based on application requirements (flexible reconfiguration). 【Features】 ■ Improved machining accuracy ■ Stabilized alignment ■ Increased machining speed ■ Spindle selection available based on application *For more details, please refer to the PDF materials or feel free to contact us.

• Other processing machines

The "ECO-R Series" is an energy-saving device that focuses on running costs. We offer compatible models based on substrate size, number of axes, and with counterbore functions. 【Features】 ■ A lineup of compatible models based on substrate size, number of axes, and with counterbore functions ■ Emphasis on running costs ■ Easy maintenance: Concentrated arrangement of CNC, control systems, air equipment, etc., by model ■ Equipped with comprehensive features *For more details, please download the PDF or feel free to contact us.

• Other processing machines

The "ECO-RZ Series" is an energy-efficient outer shape processing machine that focuses on running costs. We offer compatible models for various board sizes and types, and it comes standard with an automatic pin lifting function. Additionally, it is equipped with the latest CNC Sieb & Meyer (Ver. 82.00). 【Features】 ■ Emphasis on running costs ■ Proposed by application-specific series ■ User-friendly operating system *For more details, please download the PDF or feel free to contact us.

• Other processing machines