函館電子 Product Lineup

Our company has a proven track record in semiconductor manufacturing and is engaged in assembly processing of semiconductors, including 'Au stud bump processing,' based on the technology cultivated through integrated circuit manufacturing. We have established a processing system that is accurate, high-quality, speedy, and reasonably priced, allowing us to accommodate small quantities after determining conditions tailored to specifications and applications. 【Features】 ■ The mounting area can be minimized, enabling product miniaturization. ■ Processing of extremely small diameters of 25μm is possible. ■ Fine processing with a bump pitch of 28μm is achievable. *We are currently offering materials that introduce the mechanism of bump processing. Please check it out from "PDF Download." Feel free to contact us as well.

• Processing Contract

The equipment is not compatible with the sheet state after dicing, making it impossible to pick up. We would like to change to tray specifications to use the necessary chips according to the production quantity. We can accept requests for die sorting only, tailored to your needs. We have sufficient mass production experience even with chip sizes under 1mm, so please feel free to contact us for inquiries or quotes. 【Overview】 ■ Wafer (Max 8 inches) ■ 2-inch, 3-inch trays *For more details, please refer to the PDF document or feel free to contact us.

• Wafer

Full cut and step cut compatible with dual spindles. Equipped with CO2 injectors and transport for ESD measures, as well as ionizers during cleaning. Additionally, please leave the blade selection and processing conditions to minimize chipping to us. 【Overview】 ■ LSI silicon wafers (Max 8 inches) ■ Quartz *For more details, please refer to the PDF document or feel free to contact us.

• Wafer

The bump shapes can be customized according to requirements, including pull cut, leveling, tamping, and multi-stage bumps. The wafer size can accommodate up to 8 inches. We can handle a wide range of processing, from mass production to small-batch prototypes and individual chip processing. Please feel free to contact us for inquiries or quotes regarding processing. 【Overview】 ■ Si, quartz, GaAs ■ Wafer size (Max 8 inches) ■ Bump size (Min 30μm) *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductors

Measurement of electrical characteristics, brightness, wavelength, and ESD. Depending on the supply form, inspections can be conducted in wafer or sheet state, accommodating various specifications such as top surface and upper and lower electrodes. Additionally, if probe testing is required from mass production to small quantities of prototypes, please feel free to consult us. 【Overview】 ■ Top surface and upper/lower electrodes: 2 to 4 inches ■ Back surface: 2 to 4 inches ■ Integrating sphere: 2 to 4 inches *For more details, please refer to the PDF document or feel free to contact us.

• Chip type LED

Sorting chips based on data classified by probe tests. We can sort only good products, set detailed specifications, and categorize them into ranks, accommodating up to 100 classifications according to your needs. Please feel free to consult us when you need assistance. 【Overview】 ■ Sheet ring arrangement: 100 classifications ■ 2 to 6 inches *For more details, please refer to the PDF document or feel free to contact us.

• Chip type LED

Hakodate Electronics Co., Ltd. is engaged in the development of fine-pitch gold stud bump processing technology and the development of mounting structures utilizing gold stud bumps through prototype development. By advancing the technology for miniaturization and fine-pitching of Au stud bumps, we achieve the world's smallest level of 25μm bonding diameter bumps. 【Bump Diameter Comparison】 ■ Bump Bonding Diameter (Bump Pitch) - 88μm (90μm) - 61μm (70μm) - 51μm (60μm) - 40μm (50μm) - 25μm (28μm) *For more details, please feel free to contact us.

• Other mounting machines