新潟精密 List of Products and Services

We would like to introduce the technology of the emboss taping process at Niigata Seimitsu Co., Ltd. The emboss taping process can accommodate taping of products (such as wafers, devices, modules, etc.) attached to rings (ring to taping) as well as taping of products stored in chip trays and JEDEC trays (tray to taping). Additionally, an automatic visual inspection device mounted on the emboss taping machine allows for visual inspection to be conducted simultaneously with the taping process. 【Features】 ■ Supports taping of products attached to rings ■ Supports taping of products stored in chip trays and JEDEC trays ■ Equipped with an automatic visual inspection device ■ Allows for visual inspection simultaneously with taping *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing

Introducing the pickup process technology of Niigata Seimitsu Co., Ltd. In the pickup process, products that have been diced (such as wafers, devices, modules, etc.) and attached to a ring with UV tape are picked up using suction and repackaged into chip trays or JEDEC trays. 【Supported Specifications】 ■ Ring Size: 8-inch rectangular ring ■ Pickup Size Range: □1mm to □25mm ■ Tray Size: Chip tray, JEDEC tray *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing

We would like to introduce the dicing technology of Niigata Seimitsu Co., Ltd. In the dicing process, we can accommodate both wet dicing, which uses pure water to cut substrates and wafers, and dry dicing, which cuts substrates without using pure water. 【Supported Dicing】 ■ Wet Dicing (Substrate) ■ Wet Dicing (Wafer) ■ Dry Dicing (Substrate) *For more details, please refer to the PDF materials or feel free to contact us.

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing

We would like to introduce the cleaning process technology of Niigata Seimitsu Co., Ltd. In the cleaning process, we utilize a direct pass method with Pine α and pure water to remove flux. Additionally, we can accommodate suitable cleaning conditions and the design of dedicated cleaning jigs tailored to the products being cleaned. 【Features】 ■ Supports direct pass cleaning using Pine α and pure water ■ Capable of accommodating suitable cleaning, including the design of dedicated cleaning jigs *For more details, please refer to the PDF materials or feel free to contact us.

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing

We would like to introduce the mixed assembly technology of Niigata Seimitsu Co., Ltd. In mixed assembly, we can handle high-density and closely adjacent mixed assembly by combining multiple processes such as "SMT + COB," "FCB + solder ball assembly," and "SMT + FCB + solder ball assembly" all in-house. Additionally, we offer a wide range of other processes related to mixed assembly, including cleaning, dicing, pickup, and embossed stamping. 【Features】 ■ All mixed assembly processes that combine multiple steps can be handled in-house. ■ A wide range of processes related to mixed assembly can also be accommodated. *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing

We would like to introduce the solder ball mounting process technology of Niigata Seimitsu Co., Ltd. The solder ball mounting process supports both bulk mounting and single mounting types, and can also accommodate reballing. Additionally, we can comprehensively handle other processes related to the solder ball mounting process, such as PCB dicing and pickup, all in-house. 【Features】 ■ Flux is printed on the electrodes of the printed circuit board (PCB) surface. ■ Solder balls are directly mounted on the flux on the PCB surface electrodes. ■ Method for mounting solder balls. ■ Compatible with lead-free solder. ■ Capable of mounting ultra-small solder balls for pre-solder applications. *For more details, please refer to the PDF materials or feel free to contact us.

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing

We would like to introduce the FCB process technology of Niigata Seimitsu Co., Ltd. The FCB process can accommodate a variety of mounting methods and various substrates. Additionally, we can comprehensively handle other processes related to the FCB process, such as substrate cleaning, dicing, and pickup, all in-house. 【Features】 ■ Formation of bumps on the electrode part of semiconductor chips (ICs) ■ Direct mounting on electrodes on printed circuit boards (PCBs) ■ A method of connecting by applying heat ■ Can achieve an even smaller mounting area than COB methods, enabling miniaturization on PCBs ■ Can also be combined with SMT for module miniaturization *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing

We would like to introduce the COB process technology of Niigata Seimitsu Co., Ltd. The COB process can accommodate implementations such as a pad pitch of 0.07mm and a die size of □0.5mm. Additionally, we can comprehensively handle other processes related to the COB process, such as substrate cleaning, dicing, and pickup, all in-house. 【Features】 ■ Directly mounting semiconductor chips (ICs) onto printed circuit boards (PCBs) using die bonding material ■ A method of connecting the electrodes on the IC side to the electrodes on the PCB side using gold wire ■ Smaller mounting area compared to SMT methods, enabling miniaturization on the PCB ■ Implementation combined with SMT is also possible ■ Miniaturization of modules is achievable *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing

We would like to introduce the SMT process technology of Niigata Seimitsu Co., Ltd. In the SMT process, we accommodate high-density and closely spaced mounting, and we can also handle solder repair. Furthermore, we are capable of providing the necessary circuit board design for high-density and closely spaced mounting. Additionally, we can comprehensively handle other processes related to the SMT process, such as circuit board cleaning, dicing, and underfill, all in-house. 【Features】 ■ Printing paste solder on the electrodes of printed circuit boards (PCBs) ■ Directly mounting semiconductor components, etc., onto the solder on the PCB surface electrodes ■ Solder connection methods ■ Lead-free solder compatibility ■ Capability to mount chip components and irregular components on the PCB surface *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing
• Circuit board processing machine
• Circuit board design and manufacturing

"FCB&COF (Flip Chip Bonding) & COF (Chip on FPC)" is a method that forms bumps on the electrode part of a semiconductor chip and connects it by placing it directly on the electrodes of a printed circuit board (face down) while applying heat. It is also possible to implement it in combination with SMT, enabling miniaturization of the module. 【Features】 ■ Miniaturization on printed circuit boards is possible ■ Implementation in combination with SMT is also possible ■ Miniaturization of the module is possible *For more details, please download the PDF or feel free to contact us.

• Processing Contract
• Printed Circuit Board
• Contract manufacturing