澁谷工業 Product Lineup

This machine is a system that performs high-precision positioning using image processing to mount solder balls on PLP/BGA/CSP substrates. It supports not only bulk mounting by frame units but also simultaneous mounting of multiple individual substrates through optional features. It is also possible to propose a consistent line that includes the connection of inspection machines and peripheral devices such as mounters, reflow ovens, and cleaning machines. There is also a high demand for solder ball mounting on substrates with irregular shapes, such as connectors, and we provide system proposals from development to mass production.

This machine is a wafer ball mounter equipped with flux printing and ball mounting functions. With its unique non-contact ball mounting method, it can stably mount micro balls on the wafer without causing damage. It can also accommodate even smaller balls!!

This machine is a high-precision semi-automatic flip chip bonder suitable for experiments, development, and small-scale production. With a digitally adjustable pulse heat stage and various options, it can handle a wide range of assembly processes with just this one unit.

This machine is a high-precision bonder for the production of optical communication modules/optical devices suitable for mass production. It also supports flip-chip and mounting. There are two types: the FDB210 model, which supplies chips and substrates via trays, and the FDB211 model, which supplies with grip rings.

Features 1. By adopting a disk-type index unit, we have achieved high-speed work transportation. ▪ Classification Function It is possible to classify workpieces according to various inspection results such as optical and appearance inspections. (Up to 6 classifications) ▪ Automatic Repair Function The posture and appearance of workpieces stored on the tape are inspected, allowing for the automatic discharge of defective workpieces and re-insertion of good workpieces, eliminating the need for operator repair work and enhancing productivity.

<Overview> This machine is a high-speed inspection taping machine that performs various inspections on devices supplied by a parts feeder, classifies them, and stores them in tape and reel. <Features> 1. Device Inspection It can accommodate various inspections such as characteristic tests and appearance inspections using probes and conductive rubber suitable for high-frequency measurements. It also supports simultaneous measurements. 2. Classification Function (Optional) It is possible to classify workpieces based on the results of various inspections, including optical and appearance inspections. 3. Automatic Repair Function (Optional) The machine conducts posture and appearance inspections of workpieces stored in tape, automatically ejecting defective workpieces and reinserting good ones, eliminating the need for operator repair work and enhancing productivity. 4. Five-Sided Inspection (Optional) By adopting a detachable inspection unit, it can simultaneously conduct appearance inspections on five sides of the workpiece, including the side and bottom, at one station.

It has high versatility, and various types have been developed into a series based on the equipment, allowing users to select a model that meets their needs. The standard ETM460 adopts a nozzle-type transport system, which stably conveys the work supplied from the parts feeder and quickly stores it in the embossed tape. Additionally, the series product ETM465R features a sub-index in addition to the standard index, enabling measurement and inspection from the top.

This machine performs flux printing and ball mounting on the supplied substrate. By connecting inspection and repair machines, it enables higher quality production.

This machine is a high-precision bonder for the production of optical communication modules/optical devices suitable for mass production. It also supports flip-chip mounting. It enables ultra-high-precision mounting of microchips on supplied substrates using a two-point recognition method. It is a compact device that integrates chip/substrate supply and finished product storage. Shibuya Kogyo has many years of experience in optical communication modules and optical devices. The FDB210P is one of the devices that incorporates years of know-how.

<Overview> This machine is a taping machine that can accommodate various inspections by combining a nozzle-type first index and a disk-type second index. <Features> - Second Index The disk-type index allows for the processing of surface inspections of workpieces, such as precise optical inspections of LEDs, while maintaining processing speed. - Classification Function (Optional) It is possible to classify workpieces based on various inspection results, such as optical and appearance inspections (up to 6 classifications). - Automatic Repair Function The machine performs posture and appearance inspections of workpieces stored in the tape, automatically ejecting defective workpieces and reinserting good ones, eliminating the need for operator repair work and enhancing productivity. - 5-Surface Inspection (Optional) By adopting a detachable inspection unit, it can simultaneously conduct appearance inspections of five surfaces, including the side and bottom of the workpiece, at one station.

This is a ceiling-mounted nozzle-type taping machine with high versatility. The ETM465R features a sub-index in addition to the standard index, and it supports optical measurement, characteristic inspection, and appearance inspection mechanisms required for LEDs. Additionally, it is equipped with a repair function for appearance inspection after tape insertion, aimed at reducing labor.

■High-Speed Processing Stable high-speed processing has been achieved through index drive using servo motors and reducers, probe operation with direct motor drive, and direct drive in the sorting section. ■Support for Diverse Inspections Flexible support is provided for optical characteristic inspections, electrical characteristic inspections, appearance inspections, and more. ■Automatic Recovery Function from Work Jams By automatically discharging the work from the disk entry section without operator intervention, the system improves operational efficiency by recovering from work jams.

This is a taping machine that supports work sizes up to 15mm. By combining a ceiling-mounted index and a sub-index, it enables high-precision image inspection and shape inspection before packaging.