東朋テクノロジー Product Lineup

The "Stealth300V Series" is a device that captures the reflected/scattered light from the surface of substrates/membranes illuminated by an LED line using a super-sensitive camera, allowing for the analysis of their surface conditions. It enables high-speed inspection of overall trends in substrates that could not be detected by conventional localized (micro) inspections. It has a proven track record in inspecting film uniformity, exposure uniformity, and surface scratches in OLEDs and semiconductors. Additionally, by equipping a fine surface foreign matter inspection optical system option, it is also capable of detecting foreign matter equivalent to PSL 0.3um. 【Features】 ■ High-speed, comprehensive measurement ■ High-sensitivity imaging ■ Easy maintenance ■ Customizable inspection software to meet customer specifications

The "FLX Series" is a device that can measure thin film stress non-contact and non-destructively with high density and stability using laser beams. It automatically selects between two types of lasers with different wavelengths, accommodating various substrates and film types. In addition to the semiconductor industry and semiconductor/material manufacturers, it has recently been used extensively as a monitoring device in applications such as LEDs, solar cells, MEMS, power devices, and FPDs. 【Features】 ■ Simple and highly functional ■ Low cost, space-saving ■ Measurement settings (scan points, low reflection alarm, elastic modulus, substrate thickness, substrate size, stress units, substrate type, laser selection) *For more details, please download the PDF or feel free to contact us.

The Full Face device for measuring the thickness distribution of films is a system that rapidly measures the film thickness uniformly across the entire surface of wafers or glass substrates. Its advantage lies in the ability to detect film thickness anomalies that might be overlooked in point measurements. Using a line spectroscopic camera, it measures the interference light from the film pixel by pixel along the line width. By performing a line scan across the entire diameter of the wafer, it can calculate the film thickness for each position pixel without gaps. It can measure up to 4 million points of film thickness in a short time and is capable of multilayer film analysis. There is a Dual model for both full and local measurements, and there are three camera lineups depending on the thickness of the film.