松和産業 List of Products and Services

Recently, the specifications for substrates have diversified, and at Matsuwa Industries, we are trying various special substrates. The substrates listed all started from customer requests. We have been working together with customers who have said, "Other companies have turned us down, but perhaps Matsuwa Industries can make it happen?" Thick copper substrates ⇒ MAX 500μ * foil thickness 400μ in stock, inner layer core material foil thickness 140μ Copper inlays ⇒ round and square shapes * board thickness t1.0 to t3.0mm, round: φ1.0 to φ8.0mm, square: please consult Rigid FPC (build structure) ⇒ available in 1-layer and 2-layer Matsuwa Industries has established a prototype development room, so please contact us at the following for inquiries. TEL: 0598-52-1855

• Circuit board design and manufacturing
• EMS
• Printed Circuit Board

The year 2024 is about to come to an end in the blink of an eye. Are there any circuit boards you are about to give up on arranging for delivery by the end of the year? If you consult with Matsuwa Sangyo, known for its ultra-short delivery times, we can accommodate your desired schedule even with tight timelines. Common year-end and New Year’s issues can be resolved with Matsuwa, making us a strong ally for your company! - Through-hole boards ⇒ as fast as 1.05 days! - Through-hole resin-filled boards ⇒ as fast as 2.1 days! - 1-2-1 build-up boards ⇒ as fast as 3 days! - FPC boards ⇒ as fast as 2 days! - 4-layer rigid FPC boards ⇒ as fast as 5 days! Furthermore… with our unbeatable <Limit Break Course>, - 4-layer through-hole boards ⇒ 17 hours - 6-layer through-hole resin-filled boards ⇒ 24 hours - 1-2-1 build-up ⇒ 48 hours - 6-layer 2-2-2 build-up ⇒ 72 hours to complete the boards! Our impressive delivery capabilities are made possible by Matsuwa Sangyo’s fully in-house manufacturing and 24-hour factory operations. Additionally, our compliance rate of 99.94% is another attractive feature. We guarantee delivery by the promised deadline. For more details, please refer to our catalog or feel free to contact us through our website.

• Printed Circuit Board

Matsuwa's high-frequency substrates are very speedy! We always have low Dk and low Df materials in stock. We can accommodate everything from multilayer boards to hybrid laminated structures and back drilling, even for small quantities and short delivery times. We are also actively working on new materials and welcome inquiries not only for regular projects but also for various research and development purposes. Matsuwa Industries is here for high-frequency substrates! Thank you.

• Printed Circuit Board

Build-up substrates, high-frequency substrates, FPC and rigid FPC substrates... All of these are manufactured in-house at our own factory, with a fully integrated production process! The ultra-short delivery times achieved by eliminating outsourcing are astonishingly fast! Since surface treatment, such as gold flash, is also handled in-house, there are no fluctuations in delivery times! Not only the delivery times but also the wide range of materials we handle is one of the attractions of Matsuwa Sangyo. Even if the material has no processing track record, we are flexible in accommodating your needs! We accept orders for any type of substrate, even in small quantities, so if you have even a slight desire to "want to make a substrate," why not start with a light consultation? - 2024 International Aerospace Exhibition ⇒ 10/16 (Wed) - 10/18 (Fri) @ Tokyo Big Sight Please be sure to stop by the Matsuwa Sangyo booth on the day!

• Printed Circuit Board

Our company is one of Japan's leading ultra-fast printed circuit board manufacturers. We possess top-level equipment and specialize in the production of high-difficulty circuit boards. With over 30 years of industry experience, we currently have business dealings with more than 2,200 companies in Japan. Of course, in addition to circuit board manufacturing, we can also accommodate customer requests for AW design and component mounting. 【Build-up Boards】⇒ We can handle narrow pitch BGA mounting, multi-layer builds, and any layer configurations. 【Heat Dissipation】⇒ We can accommodate aluminum base boards, high thermal conductivity CEM-3, and copper inlay boards. 【Thick Copper Boards】⇒ We can handle high current boards, thicker plating in through holes, and automotive boards. 【Flexible Boards】⇒ We can accommodate FPC, multi-layer FPC, rigid FPC, and transparent polyimide FPC. 【High Frequency】⇒ We have standard stock of Megtron 6 (manufactured by Panasonic) and have processing experience with many low dielectric constant materials. 【Special Processing】⇒ We can also accommodate bump formation and back drilling. ↓ Please also visit our website https://www.showanet.jp/ We look forward to hearing from you.

• Printed Circuit Board

Build-up substrates, high-frequency substrates, FPC and rigid FPC substrates... All of these are manufactured in-house at our own factory with a fully integrated process! The ultra-short delivery times achieved by eliminating outsourcing are astonishingly fast! Through-hole substrates ⇒ as short as 1.05 days! Through-hole resin-filled substrates ⇒ as short as 2.1 days! 1-2-1 build-up substrates ⇒ as short as 3 days! FPC substrates ⇒ as short as 2 days! 4-layer rigid FPC substrates ⇒ as short as 5 days! Surface treatment with gold flash is also handled in-house, so there are no fluctuations in delivery times! Not only the delivery times but also the wide range of materials we handle is one of the attractions of Matsuwa Sangyo. Even for materials we have no processing experience with, we are flexible in our response! We accept orders for any type of substrate, even in small quantities, so if you have even a slight desire to "want to make a substrate..." Why not start with a light consultation? We will be exhibiting at the Nepcon Japan Autumn Exhibition held at Makuhari Messe from September 4 (Wed) to September 6 (Fri)! On the day, members who can consult on technology will be gathered at our booth, so please stop by the Matsuwa Sangyo booth [6-37]! Pre-registration for your visit can be done here↓!

• Printed Circuit Board

Matsuwa Industries, renowned for its top-notch short delivery times in domestic printed circuit board manufacturing, offers a variety of heat dissipation boards with quick turnaround times. We pride ourselves on our flexibility, with a minimum order quantity starting from just one piece. If you have any issues related to heat dissipation boards, please feel free to consult us. 【Examples of Heat Dissipation Board Manufacturing】 - Thick copper boards (maximum copper thickness of 500µm) - Aluminum and copper base boards - Copper core boards - Copper inlay boards - Conductive paste resin-filled boards - High thermal conductivity materials - Ceramic boards - Thick copper FPC 【Examples of Short Delivery Manufacturing】 - Aluminum base boards: as fast as 2 days (standard 4 days and up) *For detailed services, please refer to the catalog available for download below.

• Printed Circuit Board

Our company can provide various printed circuit boards with extremely short lead times due to our in-house integrated equipment available 24/7. We have the latest equipment in place, ensuring reliability in inspection and quality. Our track record of over 2,000 transactions is proof of this. 【Examples of Printed Circuit Board Manufacturing】 ◆ Build-up Boards By using non-through vias connected by laser vias, we can achieve thinner, smaller, and narrower pitch boards. ◆ Rigid-Flexible Boards These boards integrate rigid and flexible substrates. They are effective for use in very small spaces, such as in compact modules, or when component placement is limited. ◆ Heat Dissipation Boards These boards address thermal issues, featuring copper inlays and conductive paste resin-filled holes (φ0.6). ★ We are currently offering materials showcasing our printed circuit board manufacturing examples. Please take a look via the "PDF Download" link below.

• Printed Circuit Board

A leading domestic manufacturer in short delivery times for printed circuit board production, Matsuwa Sangyo offers astonishingly short delivery times for FPC boards and rigid FPC boards as well. 1-layer and 2-layer boards ⇒ as fast as 2 days Multilayer and rigid FPC boards ⇒ as fast as 5 days *Delivery times may vary depending on quantity, reinforcement locations, and specifications. "When you want it, you want it right away" and "When you're in trouble, you want it right away." Please feel free to reach out to us. ★Confirmed participation in COMNEXT2024 (June 24-28 at Tokyo Big Sight, South Exhibition Hall) We look forward to seeing you at booth number '13-31' in the 5G/6G Material World!

• Printed Circuit Board

Don't you have experience wanting a circuit board by tomorrow? The greatest strength of Matsuwa Industries is undoubtedly our ultra-short delivery times. We deliver everything from through-hole boards to build-up boards, FPC boards, and rigid FPC boards at the industry's fastest levels! 2-layer to 10-layer through-hole boards in as little as 1.05 days! Through-hole resin-filled boards in as little as 2.1 days! 1-2-1 build-up boards in as little as 3 days! 1-layer and 2-layer FPC boards in as little as 2 days! 4-layer rigid FPC in as little as 5 days! Not only are our delivery times fast, but we also ensure that we deliver on your requested deadline (with a compliance rate of 99.94%). Naturally, our inspection system is equipped with the latest facilities, so you can rest assured about quality. We will thoroughly promote the secrets of our delivery times and more at the exhibition. If you are attending, please stop by the Matsuwa Industries booth at [5F-23]! Register for the JPCA Show here ⇓

• Printed Circuit Board

"Oh no~ I can't reach the sales representative!" "I want the estimate as soon as possible!" "When will the estimate come?" Matsuwa Sangyo responds to such words. Matsuwa Sangyo prides itself on being the fastest in domestic circuit board manufacturing. Of course, we confidently respond with "Fast!" to various inquiries, including estimates, but we are also striving to further shorten the response time for estimates by providing the automatic estimate system "Saku! to SHOWA." Just enter the necessary items from the URL below and click! Now, let's get those estimates quickly! Saku! to SHOWA https://www.showanet.jp/estimate/

• Printed Circuit Board

In printed circuit boards, heat dissipation measures have become a very significant issue. Our company offers various heat dissipation substrates, including metal bases, thick copper, copper inlays, conductive paste filling, and thermal conductive materials such as ceramics. Please feel free to contact us.

• Printed Circuit Board

We would like to introduce the "Flash Conductor Substrate" handled by Matsuwa Sangyo Co., Ltd. By embedding resist or insulating resin between the patterns (conductors), the surface of the substrate can be smoothed. Please feel free to contact us when you need assistance. 【Structure of Flash Conductor (Resist Specification)】 ■ Copper foil ■ Copper plating ■ Resist ■ Base material *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce the "End Face Through Hole Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This product accommodates hole diameters of ≧Φ0.5mm, land diameters of ≧0.8mm, and hole pitches of ≧1.0mm. The slit through hole circuit board can accommodate a slit width of 1.0mm and a maximum slit length of 30mm (with connections added every 30mm). 【End Face Through Hole Circuit Board Manufacturing Specifications Example】 ■TH Diameter: φ0.5mm ■Land Diameter: φ0.8mm ■Hole Pitch: 1.0mm *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce the "copper bump substrate" handled by Matsuwa Sangyo Co., Ltd. Thanks to a special plating method, it is possible to form bumps of approximately 30 to 100 μm in the necessary areas of the pattern. This is effective in cases where it is required to make contact between the substrate pad and mounted components at a high position. 【Copper Bump Substrate Manufacturing Specifications Example】 ■Bump Diameter/Bump Size: φ0.4mm/0.3mm×0.25mm ■Bump Height: 100μm *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce the "Copper Inlay Substrate" handled by Matsuwa Sangyo Co., Ltd. This substrate is designed to partially improve heat dissipation characteristics by using copper pins pressed directly under heat-generating components. By making direct contact with heat-generating components, it achieves high heat dissipation due to the high thermal conductivity of copper. Compared to metal-based substrates, it can reduce weight, and it is also advantageous that the existing layer structure of substrates can be applied as is. 【Features】 ■ A substrate aimed at partially improving heat dissipation characteristics ■ Achieves high heat dissipation by making direct contact with heat-generating components using high thermal conductivity copper ■ Reduces weight compared to metal-based substrates ■ Existing layer structures of substrates can be applied as is *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce the "Through-Hole (TH) Thick Plated Board" handled by Matsuwa Sangyo Co., Ltd. The typical copper plating thickness required for Through-Holes (TH) is generally around 15 to 20 μm. However, to enhance reliability, there has been an increasing demand for a certain thickness (TH plating ≧ 25 μm) even for applications outside of automotive use. Please feel free to contact us when you need assistance. 【Manufacturing Specifications Example for Through-Hole (TH) Thick Plated Board】 ■ TH plating thickness: Capable of supporting TH thickness ≧ 25 μm *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce the "thick copper substrate" handled by Matsuwa Sangyo Co., Ltd. The typical copper foil thickness for printed circuit boards is 18μm or 35μm, but by increasing the finished copper thickness to about 210μm, it can accommodate high current circuits. In recent years, thick copper substrates (high current substrates) have been increasingly required, particularly for automotive and power electronics applications, and the demand is growing. [Example of Thick Copper Substrate Manufacturing Specifications] ■ Copper foil thickness: 70μm, 105μm, 140μm, 175μm (excluding copper foil thickness below 35μm) ■ Finished copper thickness after plating: can be 210μm or more *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce the "Aluminum Base Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This printed circuit board has high thermal conductivity and excellent heat dissipation, making it suitable for components that require high heat dissipation, such as high-brightness LEDs and power devices. In recent years, the demand for high thermal conductivity materials has significantly increased due to the spread of LED lighting, and there has been a growing trend to adopt high-brightness LEDs for automotive headlights. 【Example Manufacturing Specifications for Aluminum Base Circuit Boards (Excerpt)】 ■ Maximum outer dimensions: 210×460mm ■ Copper foil thickness: 35μm ■ Insulation layer thickness: 80μm ■ Aluminum base thickness: 1.0mm, 1.5mm, 2.0mm ■ Thermal conductivity: 3W/m·K, 10W/m·K *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce the "Rigid Flexible Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This board integrates rigid and flexible circuit boards and is also referred to as rigid flex or rigid FPC. Our product not only combines the features of rigid and flexible circuit boards but also eliminates the need for connectors in the interconnection between boards, making it effective for lightweight, compact, and three-dimensional assembly and wiring. 【Example Specifications for Flexible Circuit Board Manufacturing (Excerpt)】 ■ Base Material Thickness: 25μm, 50μm ■ Copper Foil Thickness: 18μm, 35μm ■ Copper Foil Types: Rolled Copper Foil, Special Electrolytic Copper Foil ■ Coverlay Color: Amber ■ Resist Color: Amber, Green, Black, White *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce the "Single-Sided/Dual-Sided Flexible Printed Circuit Boards" handled by Matsuwa Sangyo Co., Ltd. The single-sided (1 layer) type is a common specification for flexible printed circuit boards and is often used as a substitute for FFC. There are types with and without an adhesive layer between the base material and copper foil, and we can accommodate both at our company. The dual-sided (2 layers) type allows for more flexible wiring by incorporating through-holes (TH) into the flexible printed circuit board. Please feel free to consult us about multilayer flexible printed circuit boards with three layers or more. 【Shortest Delivery Record Examples】 ■ 1 layer ⇒ Shortest 2 days (AM data ⇒ shipped the next day) ■ 2 layers ⇒ Shortest 2 days (8 AM data ⇒ shipped the next day) *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce the "fluororesin substrate" handled by Matsuwa Sangyo Co., Ltd. This is a printed circuit board with a fluororesin insulation layer. It has low dielectric constant and low dielectric loss tangent, resulting in minimal loss of high-frequency currents. Leveraging this characteristic, it is used for high-speed communication applications (such as GPS, satellite communication, millimeter-wave radar, and mobile phones). 【Features】 ■ Printed circuit board with a fluororesin insulation layer ■ Minimal loss of high-frequency currents ■ Treatment to improve the wettability of plating and resist (plasma desmear treatment) We have introduced equipment for this, enabling in-house integrated manufacturing of fluororesin substrates. *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce "MEGTRON6," handled by Matsuwa Sangyo Co., Ltd. This product is a low transmission loss material that supports high capacity and high-speed transmission for 5G and ICT infrastructure equipment, and it is kept in stock as a regular inventory. Even for sudden requests, we can respond with short lead times just like with our standard circuit boards. Please feel free to contact us when you need assistance. 【Features】 ■ Low transmission loss material that supports high capacity and high-speed transmission for 5G and ICT infrastructure equipment ■ Kept in stock as a regular inventory ■ Able to respond with short lead times even for sudden requests, just like with standard circuit boards *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce the "Faradflex-compatible substrate" handled by Matsuwa Sangyo Co., Ltd. Unlike capacitor materials that are built into components, this substrate-integrated capacitor material does not require the creation of cavities within the substrate and is characterized by the ability to form patterned capacitor circuits using standard printed circuit board manufacturing processes. By reducing surface-mounted components, it enhances reliability through fewer connections and enables miniaturization of printed circuit boards. 【Features】 ■ Substrate-integrated capacitor material characterized by the formation of patterned capacitor circuits ■ Enhances reliability through fewer connections by reducing surface-mounted components and enables miniaturization of printed circuit boards ■ Mainly used for high-layer, high-performance routers, server equipment, supercomputers, and MEMS microphones and RF filters aimed at miniaturization *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce the "Impedance Control Compatible Boards" handled by Matsuwa Sangyo Co., Ltd. In recent years, there has been a significant increase in the demand for boards that require impedance control for the purpose of stabilizing signal quality and reducing noise due to high-speed communication in circuits. With our extensive manufacturing experience and achievements cultivated over many years, we support various impedance simulations such as characteristic, differential, common, and coplanar, as well as TDR measurements, and we propose appropriate line widths, clearances, and layer configurations during pattern design. 【Features】 ■ Supports various impedance simulations including characteristic, differential, common, and coplanar, as well as TDR measurements ■ Proposes appropriate line widths, clearances, and layer configurations during pattern design *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce the "Any Layer PCB" handled by Matsuwa Sangyo Co., Ltd. It has a slightly different structure from build-up PCBs, utilizing laser vias even in the inner core section, enabling the thinning of the PCB through full-layer laser vias and filled via plating. The freedom of wiring has further increased, and it is adopted in many products such as IoT devices, wearable products, and communication equipment (5G). 【Any Layer PCB Manufacturing Specifications Example】 ■ 6-layer 2-2-2 build-up PCB with 0.3mm pitch BGA - Board thickness: t0.6mm - BGA pad diameter: φ0.24mm - Resist opening: φ0.17mm - Laser hole diameter: φ0.1mm *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce the "IVH substrate" handled by Matsuwa Sangyo Co., Ltd. This is a multilayer printed circuit board that connects only the necessary interlayers (non-through vias) instead of using through vias. Unlike build-up substrates, it does not use laser vias and features the use of NC drills for all interlayer connections. By connecting multiple non-through holes in a multilayer board, it achieves greater freedom in wiring and increased wiring density. 【Example of IVH substrate manufacturing specifications】 ■ 0.4mm pitch BGA mounted 8-layer 6-stage continuous IVH substrate ・ IVH specifications: L1-2/1-3/1-4/1-5/1-6/1-7 IVH + L1-8 through ・ BGA pad diameter: φ0.3mm ・ Hole wall pattern spacing: 0.175mm ・ IVH drill diameter: L1-2/L1-3 = φ0.1mm, L1-4 to L1-7 = φ0.15mm * For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce the "Through Resin Filled Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This printed circuit board is mainly used for boards that mount narrow pitch BGA components (such as 0.5 to 0.3 mm pitch) and for the purpose of filling through holes (TH). After filling the holes (primary TH) that need to be resin-filled with a permanent hole-filling ink (epoxy resin), through holes (secondary TH) are formed, and it is also possible to create a cover plating on the primary TH section that has been resin-filled. 【Example of Manufacturing Specifications for Through Resin Filled Circuit Board】 ■ 12-layer through resin filled circuit board with 0.4 mm pitch BGA - Board thickness: t1.6 mm - BGA pad diameter: φ0.32 mm - Resist opening: φ0.25 mm - Resin filled TH drill: φ0.2 mm *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce the "Build-Up Substrate" handled by Matsuwa Sangyo Co., Ltd. After forming the core layer (2-layer through to multi-layer through), we sequentially laminate insulation layers and conductor layers one by one from the core layer to the surface layer, and perform interlayer connections using lasers to create a multilayer printed circuit board. By using laser vias (non-through vias) for interlayer connections, flexible wiring design is possible, and in recent years, the demand and applications for this have been increasingly expanding. 【Shortest Delivery Record】 ■ 4 layers (1-2-1) ⇒ Shipped on the 3rd day ■ 6 layers (2-2-2) ⇒ Shipped on the 4th day *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce the "multilayer circuit boards" handled by Matsuwa Sangyo Co., Ltd. These are formed by stacking multiple layers of insulation and conductor layers, resulting in printed circuit boards with three or more conductor patterns. The interlayer connections are formed by through-holes (TH) just like in double-sided boards, and we offer a variety of substrates including FR-4, halogen-free materials, high heat-resistant materials, and low dielectric materials. 【Shortest Delivery Record】 ■ 4 to 10 layers ⇒ Shipped on the 1.05th day (data by 8 PM ⇒ shipped the next day) ■ 12 to 14 layers ⇒ Shipped on the 1.1th working day (data by 4 PM ⇒ shipped the next day) ■ 16 to 18 layers ⇒ Shipped on the 2.1th working day (data by 4 PM ⇒ shipped the day after next) *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

We would like to introduce the "single-sided and double-sided PCBs" handled by Matsuwa Sangyo Co., Ltd. These printed circuit boards have conductor patterns formed on one or both sides of an insulating board. They are widely used in various fields as general-purpose substrates, and the interlayer connections of double-sided boards are formed by TH (through-hole) technology. We offer materials such as FR-4, CEM-3, FR-1, halogen-free materials, high heat-resistant materials, aluminum materials, and low dielectric constant materials, with board thicknesses ranging from t0.1mm to t3.2mm. We also accommodate various copper foil thicknesses from 9μm to 175μm. 【Fastest Delivery Record】 ■ 1 layer ⇒ 1 day (data by 8 AM ⇒ same-day shipment) ■ 2 layers ⇒ 1.05 days (data by 8 PM ⇒ shipment the next day) *For more details, please refer to the related links or feel free to contact us.

• Printed Circuit Board

This document lists the materials used for handling high-frequency substrates. We also have materials in stock, so please feel free to inquire. Additionally, we can accommodate materials not listed, so do not hesitate to consult with us. Furthermore, please consider our company as your lab for prototyping and sample production of new materials. [Contents] ■ Low dielectric constant and low transmission loss materials ■ High dielectric constant and low transmission loss materials ■ Low transmission loss bonding films for multilayer fluoropolymer substrates *For more details, please refer to the PDF document or feel free to contact us.

• Other metal materials

We would like to introduce an example of the manufacturing process for "hybrid structure substrates." Specific interlayers are made of high-frequency materials, while other interlayers use different materials (such as FR-4). Please feel free to contact us when you need assistance. 【Composition Example】 ■ High-frequency material (core material) ■ FR-4 (PP) ■ FR-4 (core material) *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

We would like to introduce an example of manufacturing and processing of the "Long Slit TH substrate." By providing a pattern on the edge of the substrate, a guard pattern is formed. Please feel free to contact us when you need assistance. 【Overview】 ■ Long Slit TH substrate ■ Similar processing technology (edge TH) *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

We would like to introduce an example of manufacturing and processing using the "Back Drill Method." This method involves the removal of TH stubs, minimizing noise and signal degradation that can hinder high-speed transmission. It is effective in equalizing signal propagation speed, reducing reflections in transmission lines, and minimizing attenuation. Please feel free to contact us when you need assistance. 【Components】 ■ TH Stub ■ Back Drill ■ TH Stub Removal *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

We would like to introduce examples of our "heat dissipation countermeasure boards." These are boards designed to address thermal issues, such as copper inlays and conductive paste resin filled boards (φ0.6). Please feel free to contact us when you need assistance. 【Overview】 ■ Copper Inlay ■ Conductive Paste Resin Filled Board (φ0.6) *For more details, please refer to the PDF materials or feel free to contact us.

• Printed Circuit Board

We would like to introduce an example of our "Rigid-Flexible Printed Circuit Board" manufacturing. This board integrates rigid and flexible substrates. It is effective for use in compact spaces, such as small modules, or in cases where component placement is limited. Please feel free to contact us when you need assistance. 【Overview】 ■ 6-layer IVH structure (FPC layers L4-5) ■ 4-layer 1-2-1 build-up structure (FPC layers L2-3) *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

We would like to introduce an example of our "build-up substrate" manufacturing. By using non-through vias connected by laser, it is advantageous for achieving thinner, smaller, and narrower pitch substrates. Please feel free to contact us when you need assistance. 【Overview】 ■ 3-layer build-up (full stack) ■ Any layer (core via file) *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

We would like to introduce some of our equipment. We have a "Multi-Bonding Device" that achieves improved adhesion reliability with inner layer patterns through integrated in-house manufacturing of all processes, as well as a "Plasma Device" that enhances the wettability of PTFE materials through various pre-treatment processes. Please feel free to contact us when you need our services. 【Equipment Available】 ■ High-Temperature Lamination Press ■ Multi-Bonding Device ■ Plasma Device *For more details, please refer to the PDF document or feel free to contact us.

• Other clean room equipment and facilities

As we entered the 2020s, we have been focusing on "impedance control compatible boards," "any-layer boards," and "Faradflex compatible boards" to address the features of 5G, such as "high speed and large capacity," "low latency," "energy saving," and "multi-connection." To keep up with the times and meet our customers' needs at every moment, Matsuwa Industries has been steadily evolving for 30 years. As a result, we have gained overwhelming customer support, with over 2,000 partner companies. We look forward to doing business with your company next. 【Features】 ■ We are in tune with our customers' needs at every moment. ■ We have been steadily evolving for 30 years. ■ We have gained overwhelming customer support. ■ We have over 2,000 partner companies. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

Japan's top-class short lead-time manufacturer, Matsuwa Sangyo, achieves even shorter lead times! We introduce the 'Breakthrough Course' that can start anytime, 24 hours a day, shaking the industry to its core. By reviewing each process, we break through the previous limits (short lead times). Please make use of this course that shatters the walls of common sense. Reservations are required by noon the day before. 【Features】 ■ All processes are manufactured in-house ■ The factory operates 24 hours ■ All equipment is owned in-house ■ Start anytime, 24 hours a day ■ Reservations are required by noon the day before 【Examples of Breakthroughs】 - 4-layer through-hole boards… 17 hours - 6-layer through-hole resin-filled boards… 24 hours - 4-layer 1-2-1 build-up… 48 hours - 6-layer 2-2-2 build-up… 72 hours *For more details, please refer to the PDF document or feel free to contact us.

• Prototype Services

At Matsuhosangyo, we carry out integrated in-house manufacturing of all processes using advanced equipment. We are fully equipped not only for copper plating and gold plating but also for laser drilling machines and filled plating lines for build-up substrates. Additionally, we can handle both rigid and flexible substrates through integrated in-house manufacturing. To deliver better products faster to our customers, we actively introduce equipment that always looks one step ahead. 【New Equipment Owned (Partial)】 ■ Horizontal Desmear + Electroless Copper Plating Line ■ 5-Axis NC Drill with Alignment Function ■ Direct Imager (DI) (Photoresist) ■ CO2 Gas Laser Drilling Machine & YAG Laser *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

We would like to introduce our "High Reliability Boards." Pattern formation and resist exposure utilize the new DI (Direct Imager) method, achieving L/S = 40/40μm and resist position accuracy of 15μm. We have also quickly adopted inkjet for silk printing, successfully achieving a character height of 500μm, a character width of 90μm, and a position accuracy of 20μm. Our company is a manufacturer that thoroughly manages a wide variety of new equipment and chemicals, delivering high reliability boards faster than anyone else. We ensure high reliability and long lifespan, comply with delivery deadlines, and provide rapid analysis in case of troubles. 【Features】 ■ Pattern formation and resist exposure use the new DI method ■ Early adoption of inkjet for silk printing ■ Thorough management of a wide variety of new equipment and chemicals ■ High reliability and long lifespan, compliance with delivery deadlines, and rapid analysis in case of troubles *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

We would like to introduce our "Build-Up Circuit Boards." At Matsuwa Industries, we have also introduced equipment such as CO2 gas laser drilling machines, via-fill copper plating lines, and vacuum hole filling machines. We handle all processes in-house at our factory, even for high-density wiring boards like build-up boards and through resin-filled boards. Of course, just like with other boards, we guarantee ultra-short delivery times and high quality. 【Features】 ■ All processes are manufactured in-house ■ Delivery through 24-hour operations ■ Continuous introduction of new equipment ■ Realization of high-spec boards ■ No fluctuations in gold flash delivery times *For more details, please refer to the PDF materials or feel free to contact us.

• Printed Circuit Board

Our company implements a "two-person system" where a sales representative and an operations representative work together for each client, ensuring "the fastest and most courteous response anywhere." Our in-house business LAN system, "showanet," centrally manages various operations such as estimate creation, manufacturing instructions, process input, and order management through a computer system. Our unique "AMRI" fully manages quality, equipment, and training in accordance with ISO standards. To meet customer development demands, we actively introduce advanced equipment that always looks one step ahead. This equipment is utilized by a cutting-edge team of talented individuals that Matsuwa Industries takes pride in. 【Three Secrets Supporting Quality】 ■ Two-person system ■ Enhanced management system ■ Introduction of new high-performance equipment *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board