日之出水道機器 Product Lineup

In semiconductor manufacturing equipment, where precision at the nanometer level is required, designers are troubled by the "insufficient rigidity" of the structure. If the rigidity of the structure is lacking, it can lead to vibrations of the entire device due to shifts in the center of gravity during operation, directly impacting the device's cycle time and yield. The root cause lies in the mismatch of cross-sectional design, material, and support methods. Simply increasing the thickness of components can lead to adverse effects due to the influence of increased weight and inertia. An effective solution is Hinode's analysis technology and topology optimization. ■ Hinode's Proposed Steps for Rigidity Optimization 1) Current Situation Analysis: Identify weak points through rigidity analysis of structural proposals. 2) Condition Setting: Establish load conditions, constraint conditions, spatial constraints, and target values for mass/displacement. 3) Topology Analysis: Calculate the structure with maximum rigidity according to the set conditions. 4) Casting Analysis: Remodelling considering mass production feasibility. 5) Verification Analysis: Simulate the performance of the optimized structure. 6) Prototype Verification: Performance evaluation through actual machine assessment. The Hinode Group will maximize your equipment performance by combining structural design and material properties. Please feel free to consult us from the development stage.