ゼビオス（XEVIOS CORP.,） List of Products and Services

The "Chemical Liquid Scrub Spin Cleaning Device" is a cleaning machine that allows for various combinations of non-contact cleaning methods such as high-pressure spray, ultrasonic spray, and chemical liquids, as well as contact cleaning methods like brushes. It completes the cleaning process to spin drying within a single chamber, contributing to space-saving design that reduces installation space and costs. We can propose suitable device configurations based on various equipment configurations, chemical compositions, desired cleaning performance, and budget according to your needs. 【Features】 ■ Various cleaning methods and chemical liquids can be combined ■ Suitable for research and development applications and small to medium-sized sites ■ Ideal for sites developing and producing new materials such as SiC, GaN, and LT for small-diameter wafers and power semiconductors ■ Compatible wafer sizes: 3 inches to 6 inches (8 to 12 inches can also be accommodated upon separate consultation) *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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The "1-Chamber Type Liquid Spin Scrub Cleaning Machine" is a cleaning machine that allows for various combinations of non-contact cleaning methods such as high-pressure spray, ultrasonic spray, and chemical solutions, as well as contact cleaning methods like brushes. It completes the cleaning process and spin drying within a single chamber, contributing to space-saving design, which reduces installation space and costs. We can propose suitable equipment configurations based on various device configurations, chemical compositions, desired cleaning performance, and budget according to your needs. 【Features】 ■ Various cleaning methods and chemicals can be combined ■ Suitable for research and development applications and small to medium-sized sites ■ Ideal for sites developing and producing new materials such as SiC, GaN, and LT for small-diameter wafers and power semiconductors ■ Compatible wafer sizes: 3 inches to 6 inches (8 to 12 inches can be accommodated upon separate consultation) *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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■Device Overview A flat surface polishing device (edge polisher) that performs mirror polishing, rough polishing, and cleaning using filtered water and pure water as the medium, without using slurry or long polishing belts. The elimination of slurry and long polishing belts achieves low maintenance, space-saving, and a simple mechanism. ■Examples of Applications Mirror finishing processing, mirror finishing processing, end face foreign matter cleaning. ■Target Objects - Suitable for thin materials of 150 to 200 μm - Various wafers: compounds, oxides, glass, quartz, silicon, ceramics Please consider adopting the device after evaluation and confirmation with the actual machine. Compatible with Orifura (V-notches are not supported). Custom design and manufacturing are available through automation and specification discussions.

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This device is for degreasing and cleaning HDD motor components (HUB, case, etc.). Configuration: Detergent + Ultrasonic (degreasing) → Pure water rinse + Ultrasonic → Hot air drying → Vacuum drying. It will be manufactured according to the application.

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This device is designed for the cleaning of Si nuggets. The container containing the work (Si nuggets) is transferred to a dedicated cleaning basket within this device and is automatically transported to the cleaning facility. After that, the basket undergoes chemical polishing, acid etching, and high-quality water washing to clean the work. During this process, the cleaning basket is agitated to improve cleaning efficiency. After cleaning, it is moved to a dedicated drying basket and pre-dried with hot air at 150°C.

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<Equipment Overview> This device is used in the chemical polishing process after final polishing. Its feature is that it places 25 wafers in the gaps of 25 wafers, creating a half pitch, allowing for the simultaneous processing of 50 wafers. It achieves a high purity of 19nμm / 5 pieces.

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This is a cleaning device that performs cleaning of various boxes using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. 【Features】 ■ Cleaning tailored to complex shapes such as hoops ■ Automation of the cleaning process, ensuring stable cleaning effectiveness *For more details, please contact us or download the catalog to view.

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This is a cleaning device that performs cleaning of various FOSBs using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. *For more details, please contact us or download and view the catalog.*

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This is a cleaning device that performs the cleaning of various boxes using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling both the cleaning and drying processes. *For more details, please contact us or download the catalog to view it.*

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This is a cleaning device that performs cleaning of various carriers (cassettes) using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling processes from cleaning to drying. *For more details, please contact us or download the catalog to view.

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A cleaning nozzle unit that requires less water and is less likely to create a water film, which can also be retrofitted to existing equipment. A cleaning nozzle that operates at a maximum of 30Hz. A pump that generates high-pressure water of 5 to 10 MPa. A combination with a control unit. Conventional continuous spraying applies pressure over a self-created water film, leading to an increase in cleaning power = increase in pressure = increase in flow rate, resulting in a thicker water film. However, the DP-Gun uses intermittent spraying, which means that even at the same pressure (impact), the flow rate is lower, making it less likely to form a water film, and the sprayed water directly impacts the target object. By repeatedly applying intermittent spray impacts, it demonstrates excellent cleaning effects in removing foreign substances from the items being cleaned, cleaning masks, and cleaning three-dimensional objects such as cassettes (with narrow grooves and complex shapes). The pump unit achieves stable water pressure control with minimal waste water during pressure adjustment by performing feedback control that matches flow rate changes due to nozzle opening and closing. *Please consult us regarding spraying a fixed amount of liquid and measurement + spray application. *Nozzles and pumps require regular maintenance.

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A cleaning nozzle unit that requires less water and is less likely to form a water film, which can be retrofitted to existing equipment. A cleaning nozzle that operates at a maximum of 30Hz. A pump that generates high-pressure water of 5 to 10 MPa. A combination of control units. Conventional continuous spraying applies pressure over a self-created water film, which tends to increase cleaning power = increase pressure = increase flow rate, resulting in a thicker water film. However, the DP-Gun uses intermittent spraying, which results in a lower flow rate at the same pressure (impact), making it less likely to form a water film and allowing the sprayed water to directly impact the target object. By repeatedly applying intermittent spray impacts, it demonstrates excellent cleaning effects for removing foreign substances from the items being cleaned, cleaning masks, and cleaning three-dimensional objects such as cassettes (with narrow grooves and intricate shapes). The pump unit achieves stable water pressure control with minimal water waste during pressure adjustments by performing feedback control in accordance with flow rate changes caused by the opening and closing of the nozzle. *Please consult us regarding the spraying of a fixed amount of liquid and spray application measurement. *Regular maintenance of the nozzle and pump is required.

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This is a dispersion and scattering device for particles that has developed a dry scattering technology for the spacer scattering process in liquid crystal displays, capable of handling nanoparticles as well. It controls the amount of scattering based on feedback control derived from the amount of charge during scattering. A fixed multiplexer nozzle is used, allowing for uniform particle scattering in all directions by simply switching the air without moving the nozzle. Additionally, by applying high voltage to the wall surfaces, it suppresses particle adhesion to the walls, improving particle utilization efficiency and ensuring uniform dispersion performance even for larger workpieces. This tabletop scattering machine is designed for research and development and prototyping, accommodating workpiece sizes of approximately 100mm×100mm to 300mm×300mm. (It is also possible to manufacture mass production equipment for large glass sizes such as 1500mm×1500mm and for inline applications.) *For more details, please contact us.

• LCD display

This is a dispersion and scattering device for particles that has developed a dry scattering technology for the spacer scattering process in liquid crystal displays, capable of handling nanoparticles as well. It controls the amount of scattering based on feedback control derived from the amount of charge during scattering. The device uses a fixed multiplexer nozzle, allowing for uniform particle dispersion in all directions by simply switching the air without moving the nozzle. Additionally, by applying high voltage to the wall surfaces, it suppresses particle adhesion to the walls, improving particle utilization efficiency and ensuring uniform dispersion performance even for larger workpieces. This tabletop scattering machine is suitable for workpiece sizes ranging from approximately 100mm×100mm to 300mm×300mm. (It is also possible to manufacture mass production devices for inline applications, accommodating large glass sizes such as 1500mm×1500mm.) *For more details, please contact us.*

• LCD display

This is a dispersion and scattering device for particles that has developed a dry scattering technology for the spacer application process in liquid crystal panel manufacturing, capable of handling nanoparticles as well. The control of the scattering amount is performed based on feedback control derived from the amount of charge during scattering. A fixed multiplexer nozzle is used, allowing for uniform particle scattering in all directions without moving the nozzle. Additionally, by applying high voltage to the walls, it suppresses particle adhesion to the wall surfaces, improving particle utilization efficiency and ensuring uniform dispersion performance even for larger-sized workpieces. It accommodates research and development applications of approximately 100 to 200 mm square, as well as mass production equipment such as G6 size. (We can also propose and manufacture inline devices combined with cluster cleaners, inspection equipment, etc.) It is capable of scattering large particle size spacers of 20 to 30 μm, as well as processes for dimming glass and smart glass. Please feel free to consult us regarding particle procurement and other inquiries. *For more details, please contact us.*

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A single-wafer device that performs the processes of surfactant and pure water scrub cleaning, chemical spraying, megasonic spot shower, and spin drying all in one chamber. ◇ Space-saving design that completes the process in a single chamber ◇ Compatible with various wafers including Si (silicon), LT (lithium tantalate), and SiC (silicon carbide) ◇ Removal of foreign substances (organic and inorganic) and metal ions ◇ Flexible response to changes in cleaning items and device configuration *For more details, please contact us or download the catalog to view.

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This is a single-wafer cleaning device that removes polishing slurry after polishing using disk scrub cleaning, and can perform chemical spraying, megasonic spot showering, and spin drying. It is capable of removing stubborn contaminants and metal contamination through chemical spraying, and can also accommodate simultaneous scrub cleaning of the edges as an option. ■ Simultaneous cleaning of both sides ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, thickness is negotiable ■ Compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

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A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog to view.

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A single-wafer device that performs polishing slurry cleaning with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for review.

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A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

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A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download and view the catalog.

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This is a single-chamber device that performs various sizes and types of wafers, including surfactants, pure water scrubbing, chemical spraying, megasonic spot showering, and spin drying. It is a space-saving model that allows for complete cleaning within a single cleaning layer, making it suitable for locations with limited space. Please consult us regarding single-function scrub cleaning devices. 【Features】 ■ Cleaning, rinsing, and drying can be done in one place ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, φ6” to φ8” *For more details, please contact us or download the catalog for more information.

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