型システム Product Lineup

The use of diffusion bonding allows for the configuration of cooling circuits that are typically not possible in product components, which is expected to lead to a reduction in cycle time due to improved cooling efficiency. In the hot runner block, eliminating corners can reduce resin retention, thereby improving color changeability. If you want to shorten cycle time, improve color changeability, or are struggling with partial heat retention, please feel free to consult with us.

By combining microfabrication and diffusion bonding, it is possible to create precision components with cooling effects and microchannels. This is expected to be effective in the precision field. If you have any concerns, please feel free to contact us. Our development and design departments will work together to help solve your challenges.

Would you consider using diffusion bonding to address high-temperature issues? The applications range widely, including not only mold components but also other devices. If you have any concerns, please feel free to consult with us. Our development and design departments will work together to solve the problem. We can also assist with component design and thermal analysis. Please feel free to contact us.

Diffusion bonding is a joining technology that integrates materials using only heat and pressure without melting them. Since it does not involve melting like welding, it results in less distortion and defects, allowing for high-precision bonding. <Features> - Since it does not melt, cracking, bubbling, and welding defects are less likely to occur. - The bonded area is less likely to become a weak point. - There is no significant thermal distortion like in welding. - Dimensional accuracy can be maintained even for precision parts. <Benefits> - It allows for weight reduction by creating a hollow interior within the metal. - By combining with microfabrication, fine flow paths can be created within the metal. - Increased flexibility in cooling circuits improves cooling efficiency, leading to reduced cycle times and enhanced quality. - It enables the bonding of dissimilar materials. - It allows for processing that is normally not possible. We exceed the limits of metal processing and provide new applications.

In the semiconductor manufacturing industry, the miniaturization and high performance of products have made the cooling efficiency of precision components and the accuracy of microchannels increasingly important. Diffusion bonding technology addresses these challenges by providing high bonding precision and durability, contributing to improved product reliability. By combining diffusion bonding with microfabrication, it enables the production of high-precision components in semiconductor manufacturing. 【Application Scenarios】 - Production of cooling components in semiconductor manufacturing - Fabrication of microchannels - Manufacturing of components requiring high precision 【Effects of Implementation】 - Improved cooling efficiency of products - Contribution to miniaturization and high performance of products - Enhanced product reliability due to high bonding precision

In the field of research and development, precise component processing is required to maximize the performance of prototypes. Particularly when cooling effects or microchannels are necessary, advanced bonding techniques are essential. Diffusion bonding achieves atomic-level bonding of metals, providing high reliability and durability. Our diffusion bonding technology contributes to solving challenges in the prototyping phase of research and development. 【Application Scenarios】 - Research and development of new materials - Prototyping of high-performance devices - Development of cooling systems - Prototyping of microfluidic devices 【Effects of Implementation】 - Production of high-precision prototypes - Miniaturization and enhancement of product performance - Reduction of research and development time - Compatibility with a variety of metal materials

In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. It is particularly important to achieve weight reduction while maintaining strength. Diffusion bonding allows for the joining of metals at the atomic level, enabling the production of lightweight components while preserving high strength. This contributes to improved fuel efficiency in aircraft and increased payload capacity in spacecraft. 【Application Scenarios】 - Aircraft components (engine parts, structural members, etc.) - Spacecraft components (satellite structures, rocket parts, etc.) - Precision instruments requiring weight reduction 【Benefits of Implementation】 - Improved fuel efficiency through weight reduction of components - Ensured high strength and durability - Capability to manufacture complex-shaped parts - Increased design flexibility

In the medical device industry, miniaturization and precision part processing are required. In particular, miniaturization of components is essential to pack many functions into a limited space. By combining diffusion bonding and microfabrication, it becomes possible to manufacture medical device components that are small yet have high performance. Our technology contributes to the improvement of medical device performance. 【Application Scenarios】 - Miniature medical devices - Precision inspection equipment - Surgical instruments 【Effects of Implementation】 - Miniaturization of components - High cooling efficiency - Fabrication of microchannels

Diffusion bonding is a technique for bonding similar or dissimilar metals together. By processing before bonding, it is possible to create spaces within the metal after bonding. It is also possible to bond multiple plates, allowing for the creation of a more extensive hollow state. This significantly reduces the weight of the individual block. The bonding surface is not visible to the eye. Even when water passes through, there is no leakage from the bonding surface. Our company has development and design departments, so specialized teams will respond as needed. We also accept inquiries regarding research and development.

Our company enables the realization of high-precision and high-strength integral structures through diffusion bonding technology that joins different metals and materials. Diffusion bonding is ideal for applications that require high precision, airtightness, and durability, which are difficult to achieve with welding or adhesive methods, as it joins materials at the atomic level without melting them. By integrating complex structures and multifunctional components, we contribute to reducing the number of parts, improving performance, and miniaturization. ■ Addressing these challenges: - Strength and precision cannot be achieved with adhesives or welding - Need to ensure airtightness - Want to reduce the number of parts - Want to achieve miniaturization and weight reduction We can also respond to the optimization of bonding technology according to new applications and specifications from the development stage.