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Sakurai Graphic Systems Corporation

EstablishmentOctober 1946
capital36700Ten thousand
number of employees84
addressTokyo/Chuo-ku/6F, Marukuni Building, 10-2 Nihonbashi-Koamicho
phone03-3643-1131
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last updated:Jul 16, 2026
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試作支援・受託開発サービス 試作支援・受託開発サービス
スクリーン印刷機 スクリーン印刷機
試作支援サービス 試作支援サービス
箔押し 箔押し
RFID向け|試作支援事例 RFID向け|試作支援事例
半導体向け|試作支援事例 半導体向け|試作支援事例
FPC向け|スクリーン印刷機導入・試作支援事例 FPC向け|スクリーン印刷機導入・試作支援事例
MLCCで選ばれるスクリーン印刷|導入事例 MLCCで選ばれるスクリーン印刷|導入事例
車載ディスプレイ向け|スクリーン印刷機導入事例 車載ディスプレイ向け|スクリーン印刷機導入事例
スクリーン印刷について知る スクリーン印刷について知る
プリンテッドエレクトロニクスとは プリンテッドエレクトロニクスとは
フレキシブルハイブリッドエレクトロニクス(FHE)とは フレキシブルハイブリッドエレクトロニクス(FHE)とは
フレキシブルハイブリッドエレクトロニクス(FHE)とは

フレキシブルハイブリッドエレクトロニクス(FHE)とは

FHE(フレキシブル・ハイブリッド・エレクトロニクス)分野における、基礎知識やPE(プリンテッドエレクトロニクス)との関係性をご紹介します。

Beyond the Limits of Semiconductors | Flexible Hybrid Electronics

An explanation of the basic knowledge and use cases of flexible hybrid electronics (FHE). Introducing technologies that are useful for the development of next-generation electronic devices.

In recent years, with the spread of wearable devices and IoT equipment, there has been an increasing demand for lightweight, thin, and flexible electronic devices. A technology that is gaining attention to support this realization is Flexible Hybrid Electronics (FHE). This column will provide an easy-to-understand explanation of the basics of FHE, its application areas, and technical challenges. It is recommended for those interested in FHE and printed electronics, as well as those considering research, development, and prototyping of next-generation electronic devices. Sakurai Graphic Systems, a manufacturer of screen printing machines, offers a development and prototyping support service that consistently assists in process design, prototyping, quality establishment, and mass production without the need for equipment. Please feel free to consult us about ideas in the conceptual stage of FHE development. *For detailed content of the column, you can view it through the related links. For more information, please feel free to contact us.

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What is the difference between FHE and printed electronics (PE)?

Explaining the basic knowledge of FHE to address challenges such as the communication limits of printing and the rigidity of ICs for vehicle-mounted and wearable curved surfaces.

Do you have these challenges in device development? "Communication and control performance is insufficient with just printing technology." "Silicon ICs are rigid and cannot be expanded to large areas or curved surfaces." "There is a concept for FHE, but there is no evaluation equipment or manufacturing know-how." In this column, we will organize the characteristics and limitations of printed electronics (PE) and silicon semiconductors, and clearly explain the design philosophy of "FHE (Flexible Hybrid Electronics)" that merges the strengths of both. Wiring and sensors are formed using flexible printing (PE), while computing and communication functions are realized with high-performance ICs. We will introduce an approach to integrate these into a device and the prototyping process that holds the key to development. At Sakurai Graphic Systems, a screen printing machine manufacturer, we provide consistent support for process verification from the conceptual stage with our "prototyping-focused contract manufacturing" that requires no equipment and allows for a small start. *For more details about the column, please refer to the related links. For further inquiries, feel free to contact us.

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Electronics Design Philosophy "FHE"

We realize electronics with thin, lightweight, and flexible substrates. The design philosophy of flexible hybrid electronics in response to changes in social structure.

"FHE" is an electronics design philosophy that accompanies changes in social structure. By using printing technology to create thin, lightweight, and flexible sensors and wiring that do not fit into traditional enclosures, and combining them with silicon semiconductors, we achieve low-cost and flexible device development. It is a system architecture that appropriately combines the areas where printing excels, such as "sensing (wiring, electrodes, antennas, sensors, etc.)," with the areas where silicon excels, such as "thinking (CPU, memory, AI computation, communication control, etc.)," to connect the real world to the digital society. [Features] - Thin, lightweight, flexible - Large area, disposable, ultra-low cost *For more details, please download the PDF or feel free to contact us.

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The explosion of sensors and the limitations of silicon semiconductors in Society 5.0.

Solving technical challenges for large-scale deployment of IoT sensors! We propose low-cost dataization for society as a whole.

We will introduce the technical challenges and solutions related to the large-scale deployment of IoT sensors required in Society 5.0. In a society where constant measurement in various locations is demanded, the demand for disposable temperature sensors is rapidly increasing, and the number of sensors is expanding into unknown territories. For areas that cannot be addressed by traditional rigid and expensive silicon substrates, we propose low-cost data collection for society as a whole using inexpensive and flexible sensor substrates. 【What the new society demands】 ■ Bendable ■ Lightweight ■ Thin ■ Large area ■ Disposable ■ Ultra-low cost *For more details, please download the PDF or feel free to contact us.

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Printed electronics

Reduce manufacturing processes by applying functional ink only where necessary! A new manufacturing technology that contributes to energy savings and material waste reduction.

"Printed electronics" is a new manufacturing technology that reduces environmental impact by directly applying functional ink to necessary areas. In comparison to the conventional semiconductor manufacturing process of photolithography, which involves multiple stages and significant material waste, this technology adopts a simple process that applies ink only where needed. It significantly reduces the complexity of traditional processes, achieving reductions in material loss, energy consumption, costs, and environmental impact. 【Features】 ■ Directly applies functional ink to necessary areas ■ Significantly reduces the number of steps from traditional complex processes ■ Achieves reductions in material loss, energy consumption, costs, and environmental impact *For more details, please download the PDF or feel free to contact us.

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FHE System Architecture

Wireless communication sends data to smartphones and the cloud! FHE system configuration that allocates roles appropriately.

"FHE" is a system architecture that integrates flexibility, allowing for free shape changes, and complexity by merging printing and semiconductors. This system first detects changes in temperature and pressure in the real world using flexible printed sensors, which transmit the weak signals through printed wiring. Then, a small silicon LSI mounted on the film processes and records the signals. The true value lies in the ability to integrate a series of functions—measuring, transmitting, and judging—within a single sheet of film. [Features] ■ Flexibility to change shape freely ■ Complexity by merging printing and semiconductors ■ Functionality that completes the system ■ Integration of the series of functions—measuring, transmitting, and judging—within a single sheet of film *For more details, please download the PDF or feel free to contact us.

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Global Trends, Roadmap, and Application of FHE

We expand the possibilities of product design with flexible substrates! FHE enhances design freedom and creates new applications.

"FHE" is a design philosophy for device manufacturing that meets the new demands for creating thin, lightweight, bendable surfaces at low cost. It is not merely "bendable electronic components," but integrates flexibility, complexity, and functionality to seamlessly connect the real world to the digital society. Through printed electronics, it significantly reduces the number of processes, minimizes material waste, and achieves low cost, energy savings, and reduced environmental impact. Leveraging world-class core technologies, it is expected to serve as an electronics substrate technology for digitizing various industries. [Features] - Flexibility to change shape freely - Complexity that merges printing and semiconductors - Functionality that completes the system - Reduction of processes, achieving low cost and energy savings - Contribution to environmental impact reduction with minimal material waste *For more details, please download the PDF or feel free to contact us.

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