Boyd Technologies Japan List of Products and Services

The burn-in test, essential for quality inspection of semiconductor components. With the "iSocket," which allows for individual temperature adjustments that were not possible with conventional burn-in equipment, high-precision quality maintenance is achievable. The "Upgrade Module" from Wells CTI enables you to use this "iSocket" with your existing burn-in equipment (oven). It compactly integrates the power supply for heaters, fans, and controllers, as well as the data communication system. You can continue using your existing oven, significantly reducing the implementation costs. <Features> ■ Allows for individual temperature adjustments, enabling high-precision inspections ■ Minimizes infrastructure development ■ Lower cost compared to introducing new equipment ■ Supports up to 16 power supply and data communication connections per module

• Temperature and Humidity Control

We offer a wide range of products that can accommodate various variations of SOP, SSOP, TSSOP, and TSOP devices. It is an open-top type suitable for automatic insertion and extraction of devices. It is also possible to make contact with the heat dissipation or ground pads of the device. It can be used in environmental tests such as HAST and THB. While using inexpensive punched contacts, it achieves high contact performance.

• Other inspection equipment and devices

- We offer a wide range of variations for BGA/LGA devices with terminal pitches of 0.4mm, 0.5mm, 0.65mm, and 0.8mm. - This is an open-top type suitable for both automatic insertion and manual insertion of devices. - It employs a push-on surface mount method that makes it easy to remove from the substrate. - Some models utilize a full-pressure latch mechanism to prevent warping of devices at high temperatures. - It can also be used in environmental tests such as HAST and THB. - It achieves high contact performance while using inexpensive stamped contacts.

• Other inspection equipment and devices

- It supports BGA/LGA devices with terminal pitches of 0.4mm and 0.5mm. - It features a clamshell type with a latch lever that is easy to operate even under high loads required for multi-pin devices. - It adopts a press-fit surface mount method that makes it easy to detach from the substrate. - It can accommodate heat sinks, temperature sensors, heaters, etc., and can also connect to a device temperature control system. - It can be used in environmental tests such as HAST and THB. - It achieves high contact performance while using inexpensive punched contacts.

• Other inspection equipment and devices

We offer a rich lineup centered around QFN devices with terminal pitches of 0.4mm and 0.5mm, as well as various other variations. This is an open-top type suitable for both automatic insertion and manual insertion of devices. It adopts a movable guide system that improves the positioning accuracy of fine-pitch devices. It is also possible to make contact with the device's heat dissipation or ground pad. It can be used in environmental tests such as HAST and THB. While using inexpensive punched contacts, it achieves high contact performance.

• Other inspection equipment and devices

The Thermal Control Unit (TCU) is used to control the temperature of ICs during performance testing. The TCU is an IC temperature management solution that can be used for various applications such as IC characterization, verification, manufacturing, or system-level testing.

• Temperature and Humidity Control

- It supports BGA/LGA devices with terminal pitches of 0.4mm and 0.5mm. - It features a clamshell type with a latch lever that is easy to operate even under high loads required for multi-pin devices. - It adopts a push-on surface mount method that makes it easy to detach from the substrate. - It can accommodate heat sinks, temperature sensors, heaters, etc., and can also connect to a device temperature control system. - It can be used in environmental tests such as HAST and THB. - It achieves high contact performance while using inexpensive punched contacts.

• Other inspection equipment and devices

iQ-Phase is an IC temperature management solution used to control the temperature of devices during performance testing, and it can be applied in various scenarios such as device characterization, validation, manufacturing, or system-level testing. iQ-Phase employs a high-performance, high-precision temperature control system that directly contacts the IC with a thermal head to cool or heat it, maintaining the temperature of the IC under test or evaluation. The temperature control uses Peltier elements and utilizes compressed air as the cooling medium instead of liquid, making it compact and easy to install.

• Temperature and Humidity Control

Due to the increase in heat generation of devices associated with advancements in semiconductor technology, controlling device temperature has become a significant factor affecting the yield and throughput of the burn-in process, and ultimately the productivity of the devices. The iso-socket provides a solution to control the temperature of devices individually for each site in order to manage the variation in heat generation during burn-in. This solution enables a substantial improvement in yield and productivity during the burn-in process, achievable with the smallest possible cost burden. In other words, it allows standard burn-in equipment to achieve efficiency comparable to high-end burn-in equipment equipped with active temperature control systems.

• Temperature and Humidity Control

The Thermal Control Unit (TCU) is used to control the temperature of ICs during performance testing. The TCU is an IC temperature management solution that can be used for various applications such as IC characterization, validation, manufacturing, or system-level testing.

• Temperature and Humidity Control

Demo Content ○ High-Temperature Individual Temperature Control System / IsoSocket: This utilizes Wells C.T.I.'s unique technology to individually monitor and control the device temperature within the socket. ○ Low-Temperature Control System / TCU: A temperature control unit with cooling functionality that provides high-performance temperature management/control from low to high temperatures.

• Temperature and Humidity Control

The IsoSocket Oven Upgrade Module is a module that simply integrates all the infrastructure necessary for IsoSocket installation into one box, enabling easy and quick upgrades of existing burn-in systems. Benefits of use: - Temperature management via IsoSocket is possible with simple modifications to existing ovens. - Low-risk installation method. - Quick upgrades of ovens are possible through the use of modular components. - Reduced burden of infrastructure development. - A low-cost solution as an alternative to procuring new equipment for competing systems.

• Temperature and Humidity Control

- We offer a variety of standard BGA/LGA sockets manufactured by Wells C.T.I. - Over 10 years of experience in semiconductor-related thermal design. - The latest thermal analysis and simulation technology. - In-house prototyping line that enables short delivery times.

• Other machine elements

Wells Cti provides innovative interconnect solutions. The various sockets, carriers, clips, contactors, and design services included in this solution meet the extensive requirements for burn-in, testing, and thermal management of ICs, accommodating a wide range of both new and old packages. Since its establishment in 1948, Wells Cti has been a leading supplier of burn-in sockets for the IC industry and a global supplier of IC carriers and flat-pack contactors for the military/aerospace market.

• Other electronic parts
• socket

This is a semi-custom socket that can accommodate various BGA/LGA device variations. It allows the use of various contact methods, from elastomers to spring probe pins. Effective use of molded components enables a low-cost solution. The maximum package size that can be accommodated is 15x15 mm. It can handle high loads of up to 18 kg. The use of a finger knob ensures high operability even under heavy loads. The lid can be easily removed. It is possible to open airflow ventilation holes in the lid for temperature control.

• Other inspection equipment and devices

The QFN semiconductor package is essential for miniaturizing precision equipment. The Burn-In Socket 'Series 790' allows for quality testing to be conducted with higher precision and efficiency to avoid defective products. - Supports terminal pitches of 0.4, 0.5, 0.8, and 1.0 mm - Open-top type, ideal for both automatic and manual insertion/removal - Usable in harsh environmental tests such as HAST and THB - Improves positioning accuracy for fine-pitch devices These features enhance the accuracy of burn-in testing.

• Other inspection equipment and devices

- We offer a wide range of variations of BGA/LGA devices with terminal pitches of 0.4mm, 0.5mm, 0.65mm, and 0.8mm. - It is an open-top type suitable for both automatic insertion and manual insertion of devices. - It adopts a push-type surface mount method that makes it easy to remove from the substrate. - Some models employ a full-cover latch mechanism to prevent warping of devices at high temperatures. - It can also be used in environmental tests such as HAST and THB. - It achieves high contact performance while using inexpensive punched contacts.

• Other inspection equipment and devices

We offer a wide range of variations that can accommodate various SOP, SSOP, TSSOP, and TSOP devices. It is an open-top type suitable for automatic insertion and extraction of devices. It is also possible to make contact with the device's heat dissipation or ground pad. It can be used in environmental tests such as HAST and THB. While using inexpensive punched contacts, it achieves high contact performance.

• Other inspection equipment and devices

Wells Cti offers high-reliability Kelvin test sockets with excellent cost performance for XSOP, QFP, and QFN packages.

• probe