奥野製薬工業 List of Products and Services

Okuno Pharmaceutical Industry has established a final surface treatment process that forms a void-free and uniform plating film on circuit surfaces. The "ICP-COA process" is a low film thickness Ni-P/Au plating process that utilizes a reducing cobalt catalyst. This process consists of a reducing cobalt catalyst solution "ICP Accel COA" and an electroless Ni-P plating for cobalt catalysts "ICP Nicoron COA-GM." In conventional processes using palladium, the copper material corrodes during the catalyst application step, leading to the formation of voids between the copper material and the plating film, which has been a challenge. In this process, a uniform catalyst film can be formed through reduction deposition, enabling the reduction of the film thickness of electroless nickel plating (electroless nickel plating thickness: conventional process: 3.0µm, ICP-COA process: 0.5µm). Furthermore, since a void-free and well-covered film can be obtained, it is possible to reduce the film thickness of electroless Ni plating without compromising solder joint reliability.

• Chemicals

This is the latest plating technology for semiconductor package substrates (IC substrates). Currently, electronic devices such as smartphones, computers, and servers are becoming more high-performance, leading to a reduction in the diameter of through-holes that electrically connect the layers of printed circuit boards, as well as a decrease in pitch. As a result, there is an advancement in the high aspect ratio and high density of through-holes. We have newly developed a copper sulfate plating additive for high aspect ratio substrates that can accommodate both soluble and insoluble anodes, aimed at improving the productivity and quality stability of printed circuit board production. This product excels in depositability within through-holes and vias, achieving high throwing power across a wide range of current densities.

• Chemicals

Electroless nickel-phosphorus plating tends to have a decreased deposition rate as the number of turns progresses, and it is common to refresh the bath after 5 to 6 turns. Since updating the bath requires significant effort and time, there is a strong demand for longer-lasting electroless nickel solutions. In response, our company has optimized the balance of chelating agent combinations and concentrations to develop an electroless nickel plating solution that experiences minimal reduction in deposition rate for over 10 turns from the start of the bath. The development of this product can enhance productivity, reduce waste liquid volume and energy costs, and contribute to lowering environmental impact. 【Top Nicoron LLM-LF】 - There is little change in deposition rate and phosphorus content due to bath aging. - Usable for up to 20 turns. - Low film stress with minimal changes in stress due to continuous use. Please feel free to contact us for anything other than the above. Inquiries can be made through the contact information below.

• Chemicals

In recent years, the application environment for printed circuit boards has expanded, particularly in fields related to electric vehicles and autonomous driving, where there is a strong demand for improved reliability of interlayer connections, heat resistance, and durability. Additionally, in response to environmental regulations such as the RoHS directive, there is a consideration to switch the solder used in assembly from low-melting-point Sn-Pb solder (melting point 183°C) to high-melting-point solders such as Sn-Ag (melting point approximately 220°C). Therefore, our company has newly developed an electroless copper plating process that can maintain connection reliability even under severe conditions such as high temperature and high pressure.

• Chemicals

With the miniaturization, high performance, and high functionality of information and communication devices, semiconductor devices are now required to operate at high speeds. For the implementation of wiring on semiconductor package substrates and printed circuit boards, the method of forming a copper seed layer through sputtering followed by electroplating has become common to achieve further miniaturization and improved interlayer adhesion. Our company has newly developed a flash etching solution that preferentially etches copper sputtered films to accommodate copper sputtered films. There is a demand for technology that reduces transmission loss in copper films to support high-speed communication. To meet this demand, we have newly developed a flash etching solution for copper sputtered films that is optimal for fine circuit substrates and excels in planar smoothness.

• Chemicals

In the implementation of semiconductor package substrates, attention is being drawn to Fan-Out Wafer Level Packaging (FOWLP) technology. In the case of FOWLP, wiring (redistribution layer) is formed in the internal area of the semiconductor package substrate. In traditional bump connections, it was necessary to electrically connect the semiconductor chip and the terminals of the package substrate. Additionally, in wire bonding using fine wires of gold or aluminum, there was a problem where increasing the number of terminals made it difficult to achieve reliable electrical connections. Therefore, the practical application of fan-out packaging technology, which allows multiple chips to be mounted side by side (multi-chip) without limitations based on chip size, is rapidly advancing. Our company has newly developed a copper sulfate plating solution that enables high filling and in-plane uniformity for the formation of redistribution layers on semiconductor wafers.

• Chemicals

Smartphones are widely used not only for calls but also for content viewing such as music and videos, online shopping, and in industries like automobiles, smart home appliances, and robotics. Mobile communication devices like cell phones and tablets have undergone significant evolution approximately every 10 years, with their maximum communication speeds increasing by about 1,000,000 times over the past 30 years. Additionally, semiconductors used in servers and high-performance computers are required to achieve even higher performance and multifunctionality. Our company has recently developed a new copper sulfate plating additive, TORYZA LCN SD, which is optimal for low aspect ratio via filling. TORYZA LCN SD can be widely applied to microbumps that join semiconductor chips and build-up wiring boards, as well as thermal vias used for heat dissipation in trench wiring on wafers and power semiconductors.

• Chemicals

Solder balls have been widely used in semiconductor packaging. However, due to the increase in pin count (the number of terminals on the substrate), the increase in the number of chips being packaged, and the reduction in bonding area, solder bumps with a diameter of about 100µm are becoming insufficient for high-density packaging. As an alternative, attention is being drawn to a method that involves forming a redistribution layer (RDL) on the semiconductor and using copper pillars for bonding. Our company has developed the optimal additive for copper pillars, TORYZA LCN SP. TORYZA LCN SP can also be used to form ultra-fine electrodes on the build-up layer of the package substrate.

• Chemicals

Okuno Pharmaceutical Industry will exhibit at the 9th Automotive Parts & Processing EXPO (commonly known as Car Mecha JAPAN). 【Exhibited Products Introduction】 - Silica-based coating agents that provide insulation and corrosion resistance to various metals such as aluminum and magnesium. - For optical components. A process that achieves a reflectivity of less than 5% across a wide wavelength by forming fine irregularities on aluminum. - For preventing ice formation, a process that imparts water repellency to aluminum through immersion treatment alone. - Not just for decorative purposes. A trivalent chromium plating solution that forms an antibacterial and antiviral coating. - Designed for use in high-temperature environments for power semiconductors. An electroless nickel plating solution that does not crack even after heat treatment at 400°C. Please feel free to contact us for anything other than the above. Inquiries can be made through the contact information below. *For details, please refer to the PDF or contact us directly.

• Chemicals
• Surface treatment contract service

With the evolution of IoT, various devices and gadgets are now connected to the network in addition to computers and smartphones. In particular, fields such as wearable devices and smart home appliances are expected to expand, and printed electronics, which directly print electrical circuits onto flexible materials, are attracting attention. Okuno Pharmaceutical Industry has developed a copper paste called "OPC Copaseed SCP," which can directly print a seed layer for electroless copper plating onto film, by merging the surface treatment and screen printing technologies cultivated over many years as a technology in harmony with the environment. Currently, the subtractive method using single-sided copper-clad laminates (Flexible Copper Clad Laminates; FCCL) is the mainstream for manufacturing flexible printed circuit boards. Subtractive means subtraction in English, and it forms circuits by etching away unnecessary parts from the copper foil. Our company has developed a screen printing copper paste "OPC Copaseed SCP" and an electroless copper plating solution "OPC Copper HFS" for printed electronics. This process enables the reduction of environmental impact and improvement of productivity.

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• Chemicals

From prototype creation to introducing outsourcing partners, please feel free to consult us about any surface treatment concerns. Okuno Pharmaceutical Industry will be presenting the latest plating chemicals and processes at the 24th Semiconductor and Sensor Packaging Exhibition / Semiconductor Backend Process Specialized Exhibition (ISP), which will be held at Tokyo Big Sight from January 25 (Wednesday) to January 27 (Friday), 2023. 【Related Technology Associations】 ◆ Latest surface treatment processes and plating chemicals for semiconductor wafers https://premium.ipros.jp/okuno/product/category/62111/ ◆ Latest plating and surface treatment chemicals for polyimide, PET, LCP, and glass https://premium.ipros.jp/okuno/product/category/49378/ ◆ Printed circuit boards, printed wiring boards, and circuit formation technology https://premium.ipros.jp/okuno/product/category/61629/ A company introduction video titled "Turning Imagination into Reality" is currently available on our website. ◆ Okuno Pharmaceutical Industry Co., Ltd. website https://www.okuno.co.jp/

• Chemicals
• Coating Agent
• Surface treatment contract service

The lotus leaf is known as a surface with water-repellent properties found in nature. The surface of the lotus leaf has protrusions of about a few micrometers, and this fine uneven structure manifests its water-repellent properties. As a result, water on the surface of the lotus leaf forms droplets due to surface tension and rolls off along with dirt and foreign substances. By chemically reproducing this self-cleaning property (lotus effect), we have successfully imparted anti-fouling and self-cleaning properties to aluminum surfaces. We propose applications of this process for anti-fouling in buildings, prevention of frost on air conditioning parts, and suppression of reduced thermal conductivity due to water accumulation on cooling components.

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In recent years, there has been an increase in the adoption of sensors that measure and monitor parameters such as force, sound, acceleration, temperature, light, color, pressure, magnetism, and speed in fields aimed at automation and labor reduction, such as Advanced Driver-Assistance Systems (ADAS), autonomous vehicles, and industrial robots. Additionally, there is growing demand for devices equipped with sensors in areas outside of automobiles, such as information communication and home appliances. Okuno Pharmaceutical Industry has developed a top-notch Alcroi process for high-precision sensor devices, sensing cameras, optical components, and optical equipment.

• Chemicals

Okuno Pharmaceutical Industry, a manufacturer of plating and surface treatment chemicals, has newly developed the silica-based thin film coating agent "Protector Series," which achieves high insulation and high corrosion resistance with a thin film. Do you want to improve corrosion resistance and insulation? Are you unable to achieve the required corrosion resistance? Do you want to realize high hardness with low-temperature film formation...? Okuno Pharmaceutical Industry will solve your concerns. For more details, please refer to the technical documentation. We provide prompt support from prototyping to mass production, so please feel free to contact us.

• Chemicals

Okuno Pharmaceutical Industry, a manufacturer of plating and surface treatment chemicals, has newly developed the silica-based thin film coating agent "Protector Series," which achieves high insulation and high corrosion resistance with a thin film. Do you want to improve corrosion resistance and insulation? Are you unable to achieve the required corrosion resistance? Do you want to realize high hardness with low-temperature film formation...? Okuno Pharmaceutical Industry will solve your concerns. For more details, please refer to the technical documentation. We provide prompt support from prototyping to mass production, so please feel free to contact us.

• Chemicals

Okuno Pharmaceutical Industry, a manufacturer of plating and surface treatment chemicals, has newly developed the silica-based thin film coating agent "Protector Series," which achieves high insulation and high corrosion resistance with a thin film. Do you want to improve corrosion resistance and insulation? Are you unable to achieve the required corrosion resistance? Do you want to realize high hardness with low-temperature film formation...? Okuno Pharmaceutical Industry will solve your concerns. For more details, please refer to the technical documentation. We provide prompt support from prototype to mass production, so please feel free to contact us.

• Chemicals

I want to improve corrosion resistance and insulation properties. There are issues with adhesion. I want to achieve high hardness with low-temperature film formation, among other things. Okuno Pharmaceutical Industry, a manufacturer of plating and surface treatment chemicals, will solve your questions regarding coatings and surface treatments. We will provide prompt support from prototyping to mass production, so please feel free to contact us.

• Chemicals

From prototype production to introducing subcontractors, please feel free to consult us about any surface treatment concerns you may have. ◆Useful Information and Basic Knowledge - A major manufacturer of plating and surface treatment chemicals reveals the basics of surface treatment! https://premium.ipros.jp/okuno/product/category/48928/ - Antibacterial plating and antibacterial/antiviral surface treatments for aluminum https://premium.ipros.jp/okuno/product/category/53972/ - Silica-based high corrosion-resistant, antibacterial, and antiviral coatings https://premium.ipros.jp/okuno/product/category/48806/ ◆Exhibiting at the 5th Paint and Coating Equipment Exhibition (Coating Japan) We will showcase many new products, including high corrosion-resistant coatings and surface treatment chemicals for aluminum. Please check here for more details. https://www.ipros.jp/news/detail/103409 *For more details, please contact us.

• Coating Agent

Electroless nickel plating, specifically nickel-phosphorus (Ni-P) plating, is widely used. Electroless nickel plating provides a uniform coating thickness, excellent coverage, and outstanding wear and corrosion resistance. Therefore, electroless nickel plating is widely used in various metal parts for precision machinery, automobiles, molds, motors, electronic components, and manufacturing equipment across all industries. We have newly added an environmentally friendly electroless nickel plating solution to our lineup in this field.

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Do you have any recommended surface treatments? What should I do in such cases? Okuno Pharmaceutical Industry, a manufacturer of surface treatment chemicals, will introduce technical information related to plating. Example questions: Is there a plating that excels in corrosion resistance? Is there a plating with high hardness? Is there a plating that excels in antibacterial properties? Is there a plating that excels in wear resistance? Can plating be done on plastics? Are there methods to improve the adhesion of plating? And so on, there is a wealth of useful information.

• Chemicals

Lightweight compared to metals and easy to mold into various shapes, plastic. Plastic plating (resin plating) is a method of forming a metallic coating on resin molded products such as ABS resin and PC/ABS resin through plating. In recent years, automobile manufacturers have strengthened their efforts to reduce weight for improved fuel efficiency, and plastic plating has been widely adopted for interior and exterior parts. In fields other than automobiles, plastic plating with a metallic shine and luxurious feel is widely used to enhance the design of motorcycle and bicycle parts, faucets, bathroom and interior products, and home appliances. We have recently launched TOP NOBAC CR, a chemical for trivalent chromium plating that provides a blue-black color tone and has antibacterial and antiviral effects.

• Chemicals

In conventional horizontal transport Roll to Roll plating equipment, there was a problem where copper oxidized during the transfer of substrates, leading to a decrease in via filling performance. Our company has successfully developed an additive that incorporates components to control the weak current flowing during inter-cell movement, achieving both good filling properties and throwing power (patent obtained). The high-filling copper sulfate plating additive, Topruchina SVP, enables further densification and multilayering of flexible circuits, making it ideal for improving the efficiency of flexible circuit board manufacturing.

• Chemicals

Since 2020, following 4G, 5G mobile communication services have also started in Japan. 5G not only enables ultra-high-speed communication but also features ultra-low latency that allows for smooth operation of robots and other devices in remote locations, as well as the ability to connect multiple smartphones and computers simultaneously. Currently, high-frequency compatible substrates using low-dielectric materials such as LCP and fluorine-based resins are attracting attention as suitable materials for high-speed transmission. In particular, liquid crystal polymer (LCP) excels in electrical properties in the high-frequency range, has a low moisture absorption rate, and offers excellent dimensional stability, leading to its increasing adoption for 5G and millimeter-wave applications. Our company has developed a process that combines surface modification and plating to ensure high adhesion for LCP, which is said to have difficulty securing copper plating adhesion.

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Electronic devices such as smartphones are becoming smaller and more high-performance, and flexible printed circuit boards are used to meet the demands for lightweight and compact designs. Our company has newly developed a process that can form a nickel seed layer using a wet method, which is capable of responding to the miniaturization of circuits. This process is compatible with the semi-additive method, allowing for the formation of fine circuits.

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Electronic components are mounted on printed circuit boards through wire bonding using gold, copper, or aluminum wires, and solder joints. Servers used for ultra-high-speed communication need to handle large currents and high capacities, requiring further performance enhancements and advanced connection reliability for the semiconductor packages and printed circuit boards used in them. Okuno Pharmaceutical Industry has successfully developed a catalyst solution using cobalt instead of palladium, establishing a final surface treatment process that forms a void-free and uniform plating film on the circuit surface. The ICP-COA process contributes to the reliability improvement of semiconductor packages and printed circuit boards.

• Chemicals

With the miniaturization, high functionality, and high density of electronic devices, there is an increasing demand for high-performance through-hole plating for module substrates and high-layer printed wiring boards. Our company has developed a sulfuric acid copper plating additive, Topluchina MSD, specifically for through-holes that can handle high currents, primarily for module substrates and high-layer printed wiring boards. This product achieves high throwing power at high current densities and contributes to improved productivity by reducing maintenance through stable operation.

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OPC FLET Copper is an electroless copper plating solution of the noncyanide Rochelle salt type, adapted for semi-additive processes. It excels in low film thickness and uniform deposition on material surfaces and within via holes, reducing circuit width narrowing during flash etching. Additionally, it suppresses deposition on copper surfaces, achieving continuity of crystals between inner layer copper and upper layer plated copper, making it an ideal plating solution for fine pattern and micro via hole formation in IC substrates. 【Features】 - Excellent connection reliability between upper layer plated copper and inner layer copper - Achieves low film thickness with uniform and stable deposition on material surfaces and via hole walls - Suppresses blister formation on low roughness materials, providing excellent peel strength - The film demonstrates high purity and low resistance values, not hindering subsequent pattern plating even at low film thickness

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The COVID-19 pandemic has significantly changed our lifestyle, making remote work and online business the norm. The demand for information and communication devices in fields such as 5G smartphones, computers, data centers, and car electronics is further increasing, and there is a growing need for higher performance and higher density in the semiconductor package substrates used in these devices. Build-up methods are common for printed circuit boards used in smartphones and modules, and our electroplating additives for copper have a strong track record of adoption in this sector. Okuno Pharmaceutical Industry has evolved its stacked via technology to improve the wiring flexibility of circuits and has newly developed electroplating additives for copper that are specialized for uniform film thickness, intended for fine circuit formation used in high-speed transmission.

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Triggered by the outbreak of the novel coronavirus infection, digital transformation (DX) has progressed, leading to rapid growth in markets such as internet shopping, electronic payments, and video streaming services. Additionally, electronic devices, including smartphones, continue to evolve significantly, and as the performance and miniaturization of these devices improve, there is a strong demand for higher density and thinner printed circuit boards. Semiconductor package substrates are formed using a semi-additive method, with interlayer connections made through via filling plating. As the miniaturization of circuits advances, it has become increasingly difficult to achieve both uniformity in plating thickness and good via filling properties. To achieve further uniformity in pattern plating thickness and excellent via filling properties, our company has developed a new additive for electroplating copper (copper sulfate), called Topluchina GAP.

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Electronic devices such as computers and smartphones are evolving daily. Along with this, multilayer printed circuit boards are also required to be miniaturized and made more densely packed. Our company has newly developed an electroless copper plating process that excels in coverage for the subtractive process using copper-clad laminates for printed circuit board manufacturing. Okuno Pharmaceutical Industry offers a wide variety of processing chemicals primarily for the plating process of printed wiring boards, covering all aspects of wet processes. Additionally, we propose the latest products and processes for the manufacturing processes of IC substrates and interposers produced by semi-additive processes, so please feel free to contact us.

• Chemicals

UBM stands for Under Bump Metal or Under Barrier Metal, and it is a film formed to join aluminum electrode pads on semiconductor chips with package terminals through wire bonding, soldering, or silver sintering. This film is composed of materials such as electroless nickel/gold plating or electroless nickel/palladium/gold plating. We offer a wide range of products that support the evolution of semiconductors and electronics, so please feel free to consult with us.

• Chemicals

We have newly developed a coating agent that excels in insulation, heat resistance, and bend resistance, capable of forming a high-hardness, transparent silica-based thin film. This product is expected to be applied to winding materials for electrical devices such as motors and sensors, as well as magnet wire. Additionally, we are advancing the development of various high-performance plating chemicals for the electronics field, including automotive, electric vehicles, home appliances, electronic components, and printed circuit boards, so please feel free to contact us.

• Chemicals

Glass has high smoothness and insulation properties, making it excellent in signal transmission characteristics and attracting attention as an interposer material necessary for 2.5D implementation in semiconductor packaging. Various adhesion layers have been researched for improving adhesion to glass materials, including sputtering methods and sol-gel methods. Our company has developed an electroless copper plating process called "PLOPX," which achieves high plating adhesion to glass substrates by using metal oxides deposited via Liquid Phase Deposition (LPD) as the adhesion layer. This process allows all steps to be treated using wet methods.

• Chemicals

Glass has high smoothness and insulation properties, making it excellent for signal transmission characteristics, and it is gaining attention as an interposer material necessary for 2.5D implementation in semiconductor packaging. Various methods for forming adhesion layers, such as sputtering and sol-gel methods, have been researched to improve adhesion to glass materials. Our company has developed an electroless copper plating process called "PLOPX," which achieves high plating adhesion to glass substrates by using metal oxides deposited via Liquid Phase Deposition (LPD) as the adhesion layer. This process allows for all steps to be treated using wet methods.

• Surface treatment contract service

Okuno Pharmaceutical Industry offers a wide range of environmentally friendly pretreatment processes and dyes for aluminum. The new product, TOP NOBAC ALT, an antibacterial and antiviral sealing agent for aluminum anodizing, demonstrates high effectiveness against E. coli, Staphylococcus aureus, influenza A virus, and feline calicivirus. Evaluation using the film adhesion method showed a reduction rate of over 99% against E. coli and Staphylococcus aureus (after 5 minutes of contact). Furthermore, it exhibits dye fixation and corrosion resistance comparable to nickel acetate-based sealing agents, making it ideal for smartphones, tablets, and home appliances.

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Okuno Pharmaceutical Industry is heavily focused on the research and development of surface treatment agents related to aluminum. Among these, we particularly recommend our flagship product, the color anodizing dye "TAC Dye." In addition to basic colors, we also offer custom-made dyes tailored to customer requests, making them ideal for enhancing the design of home appliances, smartphones, camera parts, bicycle components, and automotive accessories. ~Dyes for Aluminum Anodizing Coatings: TAC Dye~ Here’s what’s amazing! - Enhances the design of smartphones, digital devices, music players, automotive parts, exterior and interior components, and home appliances - Allows for a high-quality appearance - Beautiful color development - The dye is fixed through sealing treatment, ensuring color retention - Glossy, matte, and pearlescent finishes can be selected through pre-treatment - We offer a total process from pre-treatment to post-treatment - A rich variety of color options Our specialized sales staff will propose tailor-made processes and chemicals according to your needs. We can also introduce you to contractors, so please feel free to contact us.

• aluminum
• paint
• Chemicals

Mobile devices used in environments exposed to ultraviolet rays, such as outdoors. Okuno Pharmaceutical Industry has newly developed a light stability enhancer that can prevent fading and color loss due to light. Fading suppressor for anodized products: TAC Sunblock 88 What's amazing about it! - Significantly improves the light stability of anodized (alumite) dyed products - Effective with a short processing time - Simple process - Can be adapted to existing processes - Suppresses color loss during sealing Our specialized sales staff will propose tailor-made processes and chemicals according to your needs. We can also introduce you to contractors, so please feel free to contact us.

• Chemicals
• aluminum

Do you have concerns about the finish, gloss unevenness, or dyeing variation of aluminum die casting materials such as ADC12? Okuno Pharmaceutical Industry will solve those issues. ~ For aluminum castings and aluminum die casting dyeing ~ ~ Top ADD Process ~ Here’s what’s amazing! - Developed specifically for aluminum castings and aluminum die castings - Developed a dedicated black dye - Proposing a total process including pretreatment, sealing agents, and lubricating agents - Compatible with various aluminum alloys, including high-silicon aluminum alloy (ADC12) - Enables uniform dyeing - Continuous processing is possible, increasing productivity - Excellent corrosion resistance, dimensional stability, and heat dissipation Our specialized sales staff will propose tailor-made processes and chemicals according to your needs. We can also introduce contractors, so please feel free to contact us.

• Chemicals
• aluminum
• alloy

Okuno Pharmaceutical Industry, a specialist in aluminum surface treatment, proposes a completely new process. A process that imparts superhydrophobicity to aluminum surfaces! Top Algeek Process Okuno Pharmaceutical Industry is the only company in Japan and abroad that offers the entire process from the development and manufacturing of aluminum surface treatment agents to pre-treatment and post-treatment. Please feel free to consult us about anything related to aluminum, including the optimal process for your line, small-scale prototypes, various surface treatments, technical guidance, and introductions to outsourcing partners. ~ What’s great about Okuno Pharmaceutical Industry ~ We listen carefully to all your requests through detailed hearings. 30% of our employees are researchers, and experienced researchers handle small-scale prototypes. Using the samples you provide, we conduct prototype testing together with customers in our open lab space. From prototyping to mass production support and introductions to outsourcing partners, we will thoroughly pursue the reproduction of the "image you are seeking." Our specialized sales staff will provide detailed proposals tailored to your needs, so please feel free to consult us.

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Our products have a proven track record in various areas, including smartphones, home appliances, portable devices, music players, digital cameras, and bicycles. They are widely adopted in flagship model specifications. We particularly recommend our aluminum anodizing dyes (TAC dyes), which excel in a rich variety of colors and high-quality color reproduction. Additionally, we provide comprehensive support for other processes such as electroless plating and various surface treatments, from prototyping to mass production.

• others

Aluminum is a metal that has excellent luster. In addition to physical and mechanical methods, chemical polishing is commonly used to polish aluminum. Chemical polishing is a technique that dissolves the aluminum surface chemically to achieve a polished finish, and phosphoric-nitric polishing solutions are widely used to obtain a high-gloss appearance. Okuno Pharmaceutical Industry, which aims to achieve the SDGs, has developed a high-gloss finishing process for aluminum that does not contain phosphoric or nitric acid. Please take a look at OKUNO's environmentally friendly products that are gentle on the Earth and people.

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【Okuno Pharmaceutical Industry's Antibacterial Technology】 ◆ Antibacterial Sealing Agent for Aluminum The antibacterial component penetrates the anodized film to exhibit high antibacterial performance, and can also be used on dyed products. ◆ Silica-based High Antibacterial Coating Agent A transparent hard coating can be formed through low-temperature heat treatment. ◆ Polylisine-containing Sustained-release Disinfectant and Antibacterial Agent Achieves powerful disinfecting and antibacterial performance through the synergistic effect of ethanol and ε-polylisine. https://premium.ipros.jp/okuno/product/category/53972/ 【Okuno Pharmaceutical Industry's New Development Products】 ◆ Aluminum Anodizing Process that Imparts Super Hydrophobicity Modifies the aluminum surface to achieve high to super hydrophobicity, realizing water repellency through the surface's uneven texture. Anodizing treatment is possible after high water-repellent processing. ◆ Environmentally Friendly Aluminum Pretreatment Process Free of Phosphoric Acid, Boron, and Nitric Acid Greatly reduces the burden on the environment and wastewater, resulting in a uniform and smooth high-gloss appearance. https://premium.ipros.jp/okuno/product/category/48920/

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We are members of the Kansai SDGs Platform and are actively working towards the realization of the Sustainable Development Goals (SDGs) set by the United Nations. Among these efforts, Okuno Pharmaceutical Industry is putting significant emphasis on the development of new technologies and products for aluminum that are friendly to both the Earth and humanity. This document introduces the initiatives that Okuno Pharmaceutical Industry is undertaking towards a future of science and manufacturing.

• Chemicals
• aluminum

Anodizing (alumite) treatment is a technique that forms fine pores on aluminum. By adsorbing dyes into the numerous micropores formed on the aluminum, it is possible to design colorful smartphones, digital devices, music players, and wearable products. The dyes in the micropores are trapped and fixed by a sealing treatment. Since nickel solution is generally used for sealing treatment, it can induce metal allergies in portable devices that come into direct contact with the human body. Okuno Pharmaceutical Industry has solved this issue with a two-step treatment. ~ Dye Fixative: Top NF Fix F-25 ~ ~ Nickel-Free Sealing Agent: Top NF Seal S-205 ~ What's great about it! - Excellent dye fixation - Sealing performance equivalent to nickel acetate - Reduced leaching of dyes during the sealing process - Does not contain nickel, which poses a risk of allergens - Simple process Our specialized sales staff will propose tailor-made processes and chemicals according to your needs. We can also introduce contractors, so please feel free to contact us.

• Chemicals
• aluminum

Okuno Pharmaceutical Industry's surface treatment chemicals for aluminum have a proven track record in numerous applications, including smartphones, home appliances, portable devices, music players, digital cameras, and bicycles, and are widely adopted in flagship model specifications. We would like to introduce Okuno Pharmaceutical Industry's latest surface treatment processes and chemicals for the fiscal year 2021, so please take a look.

• Chemicals
• aluminum