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  6. High connectivity reliability electroless copper plating process with excellent follow-up characteristics.

High connectivity reliability electroless copper plating process with excellent follow-up characteristics.

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last updated:Oct 31, 2022

奥野製薬工業 大阪・放出、東京、名古屋など
奥野製薬工業 大阪・放出、東京、名古屋など
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Introducing the latest surface treatments for semiconductor package substrates all at once. We propose surface treatments and plating chemicals that support the miniaturization, high density, and high performance of electronic devices!

Electronic devices such as computers and smartphones are evolving daily. Along with this, multilayer printed circuit boards are also required to be miniaturized and made more densely packed. Our company has newly developed an electroless copper plating process that excels in coverage for the subtractive process using copper-clad laminates for printed circuit board manufacturing. Okuno Pharmaceutical Industry offers a wide variety of processing chemicals primarily for the plating process of printed wiring boards, covering all aspects of wet processes. Additionally, we propose the latest products and processes for the manufacturing processes of IC substrates and interposers produced by semi-additive processes, so please feel free to contact us.

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High connectivity reliability electroless copper plating process with excellent follow-up characteristics.

image11.JPG
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  • Related Link - https://www.okuno.co.jp/

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Okuno Pharmaceutical Industry offers a wide variety of processing chemicals primarily for the plating process of printed circuit boards, as well as for wet processes in general. Additionally, we provide the latest products and processes for the manufacturing of IC substrates and interposers produced through the semi-additive process, so please feel free to contact us.

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Printed circuit boards for smartphones and modules (for build-up method)

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奥野製薬工業

奥野製薬工業 大阪・放出、東京、名古屋など

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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.

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