ハイソル List of Products and Services

【Tribo】 - Compatible with 400mm diameter polishing plates - 100mm/4-inch polishing head x2 axes - Two slurry pumps, compatible with acidic slurries - Supports industry-standard In-Situ diamond conditioning - Controlled by a built-in touch panel PC 【Orbis】 - Compatible with 600mm diameter polishing plates - 200mm/8-inch polishing head x2 axes - Two slurry pumps, compatible with acidic slurries *Equipped with two types of slurries - Supports industry-standard In-Situ diamond conditioning - Controlled by a built-in touch panel PC

• CMP Equipment

We support everything from lapping (coarse polishing) to polishing, and we monitor and automatically correct the surface shape of the lapping plate itself with a resolution of 0.1μm. The polishing tool communicates with the main unit, allowing for chart displays of the polishing rate, setting of target polishing amounts, and configuration of multi-recipes. Additionally, we offer chemical models compatible with CMP for compound semiconductors such as GaAs and InP, enabling high-precision, high-speed, and damage-free CMP all with a single machine. (De-layering is also possible.)

• CMP Equipment

Fancort Industries' lead former (lead bending machine) boasts overwhelming quality and excellent operability backed by over 45 years of experience and achievements. By creating dedicated jigs, it not only accommodates various types of packages and bending shapes but also offers a variety of options such as simultaneous processing on two sides, trimming, centering stations, and loaders, allowing us to propose the optimal machine for our customers.

• Dedicated IC

Features ● Compact and inexpensive, ideal for laboratory use ● Real-time display of rotational speed changes "Graphic Function" ● Maximum rotational speed of 8000 rpm ● Internal structure is modularized for easy maintenance ● 100 steps/program can be set arbitrarily

• Other semiconductor manufacturing equipment

Features ● Easy handling by simply mixing with blade/cutting tool coolant ● Non-toxic, non-corrosive, and biodegradable, making drainage easy ● Completely water-soluble, providing thorough cleaning after cutting with zero residue

• Chemicals

Features ● Achieves a minimum pin pitch width of 0.22 mm ● Heat-resistant resin for temperatures from -55℃ to 175℃/200℃/300℃ ● Over 3,500 types of abundant molds ● Supports from semi-custom to full custom ● Compatible with Kelvin measurement

• Other machine elements
• Other semiconductors

Features ● Capable of accelerating up to 40,000G ● Reliable test conditions set by CPU control ● Continuous display of rotation speed, gravity value, and duel time ● Complies with US MIL standards ● Ensures reliable safety ● Fixtures available to accommodate over 2,500 types of packages

• Testing Equipment and Devices

Features ● Equipped with up to 6 types of load cells ● Continuous measurement for various tests such as wire pull and shear ● High precision measurement with an error of ±0.075% ● Wide work area ● Compatible with automatic measurement programs using pattern recognition ● Maximum load: shear 200kgf, pull 100kgf ● Customizable work holder

• Strength Testing Equipment

Features ● Temperature control range from room temperature to 1100°C (normal use at 1000°C) ● Compatible with vacuum inside the furnace ● Inert gas encapsulation is possible ● Sample stage with excellent operability and height adjustment ● Temperature control through programmed operation

• Annealing furnace

Features This is a high-end model that supports leaks from gross to fine. It is capable of detecting leaks from gross to fine in a single test.

• Leak Testing Equipment

Features ● Cost reduction can be achieved ● Quiet operation, suitable for indoor use ● Built-in compressor type is also available ● Low dew point possible, -50℃

• Nitrogen Gas Generator

By using software for recipe editing, you can freely create inspection processes, allowing you to perform efficient inspections tailored to your objectives.

• Visual Inspection Equipment

Features ● Compact tabletop size ● Ideal for analyzing voids, delamination, solder defects, and bonding failures ● Supports high-frequency ultrasound from 5 to 100 MHz (other frequencies available) ● High-resolution scanning with a minimum of 10 μm

• Other inspection equipment and devices

Features ● High output density downstream plasma treatment ● Heater stage maximum temperature 250℃ ● Control of various gas atmospheres using MFC (up to 4 systems) ● Efficient and low-heat treatment achieved with low-frequency 40kHz plasma power supply (CV200RFS) ● Strip rate CV200RFS: up to 7000Å/min EcoClean: 1.5 to 10μm/min

• Plasma surface treatment equipment

Features This device is designed to pressurize and inject low-boiling point fluorinated liquid to detect micro leaks of 10-5 ATMcc/sec that cannot be detected by gross leak bubble tests at atmospheric pressure. Leak detection is typically performed using a bubble tester. An optional system configuration can be created by injecting helium gas and combining it with a helium gas detector.

• Leak Testing Equipment

Features ● Forms a coating on "copper" using proprietary technology to protect it from acidic solutions ● Lowers acidic solutions to 10°C for low irritation upon opening ● Compatible with Cu, Al, and Au wires ● Automatically produces mixed acid in 13 different ratios ● Waste liquid is discharged separately for each acidic solution, eliminating concerns about mixing acids with different boiling points

• Visual Inspection Equipment

Features ● Industry No.1 pricing ● Wide field of view, ideal for large samples ● Abundant lens options ● Operates like a digital camera

• Defect Inspection Equipment

Using fluorinated liquid, we detect leaks up to 10-3 ATMcc/sec. The device's airtightness has been improved compared to conventional models, resulting in reduced consumption of expensive fluorinated liquid. Additionally, by using the optional fluorinated liquid recovery cover, we can efficiently recover and reuse the fluorinated liquid during sample loading and unloading. The device also comes standard with a cooling water circulation pipe, allowing for the efficient recovery of vaporized fluorinated liquid by circulating cooling water.

• Leak Testing Equipment

Patent technology of laminar flow method The YES PB series chamber features a gas generation plenum at the top and a suction plenum at the bottom, allowing heated gas (typically N2) to flow parallel to the wafer. The parallel laminar flow is effective in removing particles generated on the wafer surface during the heating process. Equipped with a particle removal filter inside the chamber The heated process gas reaches the workpiece through a filter with holes of 100 micrometers in diameter, and after passing through the workpiece, it goes through the filter again before being discharged outside the chamber. This results in a very low amount of particles in the process gas, allowing the wafer to be heated with clean gas. Convection cooling mechanism The cooling of the 450PB is performed entirely from outside the process chamber, ensuring that the processed workpiece is not exposed to cold air. The chamber is surrounded by an independent cabinet equipped with a cooling air inlet and exhaust duct. The heated air cooling the chamber is mixed with ambient air before being exhausted, resulting in a lower temperature during discharge.

• Heating device
• Annealing furnace

- Long lifespan LED type (LED type only) Achieves a lifespan of over 20,000 hours with minimal heat generation. - Power control (LED type only) The irradiation power can be adjusted from 2% to 100%. For lamps, it takes time to reach maximum irradiation intensity, but LEDs can emit at maximum intensity from the moment the switch is turned ON. - You can choose from three types of lamps: Iron (Fe), Mercury (Hg), and Gallium (Ga). - Safety The sealed door prevents light leakage. It also features an interlock for the opening and closing of the irradiation shutter, and allows for setting irradiation time with a timer. - Compact size Despite being compact, it offers a practical workspace of approximately 180×180×180mm. (Common to both lamp type and LED type) If a larger workspace is desired, you can choose the UV PITARI 400. - Uniform irradiation The inner walls of the chamber are made of dimpled reflective panels, allowing for uniform UV irradiation on the workpiece.

• Industrial Furnace

The LatticeAx420 can perform micro-indentation (shallow cuts) to cleavage all in one machine, with an accuracy within ±10um (patent pending). In recent years, it has gained attention as a preprocessing tool for cross-sectional observation of TSVs and bumps, producing cross-sections suitable for SEM observation in just under 5 minutes, and is also used as a preprocessing tool that significantly reduces processing time for FIB and other methods. Since it does not perform scribing, there is no risk of losing the target area.

• Plastic processing machines (cutting and rolling)

The FlipScribe100 is a compact and low-cost scriber developed by the American company LatticeGear, unlike any other. It allows you to align the position with the target visible on the sample surface while in a face-up position, enabling you to make markings on the back side of the sample. The surface is non-destructive, preventing chipping and debris attachment, allowing you to scribe the intended area.

• Other processing machines

It can accommodate applications for all materials and demonstrates the highest convenience in its wrapping/polishing process. 【Features】 ○ Operates 1 to 3 Workstations ○ Chemical-resistant model for CMP ○ Supplies a variety of lapping & polishing plates and cloths ○ Infra-red function (optional) that automatically stops operation when slurry supply is insufficient ● For more details, please contact us or download the catalog.

• Wafer processing/polishing equipment

Desktop-type latest high-speed thermal processing equipment optimal for compound semiconductors such as LEDs and VCSELs, as well as high-speed thermal processing of solar cell wafers. 【Features】 ○ Powerful visible light enables heating treatment of single wafers from 2 inches to 8 inches at controlled temperatures in a short time. ○ Excellent heating uniformity. ○ Advanced temperature control. ○ High-precision temperature measurement using wide-range pyrometer (optional). ○ Closed-loop temperature control using pyrometer or thermocouple temperature sensors. ○ Temperature control range from +100°C to +1,250°C. ○ High-speed heating at 100°C/sec and high-speed cooling at 100°C/sec. ○ High reproducibility of inter-wafer processes. ○ Temperature-time profiles tailored to specific process conditions. ○ Space-saving and high energy efficiency. ● For other functions and details, please contact us.

• Other semiconductor manufacturing equipment

We can introduce you to the best vendor right away. With over 35 years of experience and a trusted relationship, we are confident that you will be completely satisfied. Please feel free to consult us about anything.

• Contract manufacturing

Low price and short delivery time.

• Other semiconductors

A machine that easily performs epoxy and silver paste die bonding. The model 7200CR epoxy die bonder features a dispensing tube for applying epoxy materials (adhesives) and silver paste, along with a pickup tool for attracting chips, all integrated into a single bond head. With the operation of the new X-Y-Z three-axis manipulator (patented), it is possible to switch between dispensing mode and pickup mode, as well as perform die bonding. Additionally, since the bond head is equipped with a motor and timing belt, the chips attracted by the pickup tool can be rotated freely 360° using the control knob at hand. Furthermore, by setting the die puff time, the chips smoothly detach from the pickup collet, improving bonding efficiency.

• Other painting machines

Electronic products that support our lives. With their development, our lifestyles have also changed. The evolution of these electronic products is brought about by advancements in precision processing technology. We provide high-precision microprocessing that was not achievable with conventional processing techniques using lasers. In addition, leveraging our uniquely developed system technology, we manufacture and sell laser processing equipment for LCD substrate repair, IC wafer marking, semiconductor trimming, and cutting, accumulating numerous achievements and gaining trust. We will continue to pursue further possibilities in laser processing to assist in enriching your lives. Custom-made production and sales of various systems are available to meet your needs.

• Other semiconductor manufacturing equipment

G1000 / G500 is a system that utilizes the etching effect of gas plasma to clean the surface of objects under low-pressure conditions. By selecting the appropriate gas for your application (such as argon, oxygen, hydrogen + argon, etc.), it effectively removes not only organic but also inorganic contaminants. This system is ideal for improving bonding strength through the cleaning of bonding surfaces on HIC substrates and lead frames, as well as enhancing wettability through surface modification (hydrophilization).

• Other semiconductor manufacturing equipment

The multifunctional manual prober, independently developed and designed by Highsol based on experience and achievements. It boasts excellent cost performance, space-saving design, low noise, a wide frequency range from DC to microwave, and a measurement temperature range of -65°C to +400°C. The PMP series can be widely used, from first-time prober users to next-generation device development applications. Moreover, it is equipped with a high-grade manipulator that excels in operability, ensuring high-precision probing without backlash. Additionally, since we handle the design and manufacturing in-house, upgrades after purchase can be carried out quickly.

• Other semiconductor manufacturing equipment

Short delivery time and low price

• Other semiconductors

Prototype/development specialized die flip chip bonder. It combines high-precision die bonding and flip chip bonding functions, allowing for ultra-high precision bonding through manual adjustments on the monitor screen. (For model MOA1250, no-load alignment ±1 micron) High-precision bonding is easily achieved through PC or sequencer control. ● It is compatible with various objects such as silicon wafers, chips, ceramic substrates, and FR4. ● Feedback on the movement amount is provided for each actuator unit, enabling ultra-high precision. (MOA-1250 type) ● Bonding can be performed in low oxygen concentration using an air curtain heat-up stage. ● Various options available, including conical collets, pulse heaters, and scribing functions. ● All equipment is made to order, customizable in layout, budget, and functions.

• Other semiconductor manufacturing equipment

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor for West Bond in Japan for over 40 years, handling import, sales, and support. Among our products, the model 7700D has a proven track record of numerous installations in government agencies, universities, and various research institutions, and its operability using the patented new mechanism X-Y-Z 3-axis manipulator has received high praise from users. Additionally, it enables easy bump bonding, making it highly recommended for customers considering flip chip bonding.

• Steel

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor for West Bond in Japan for over 40 years, handling import, sales, and support. The E series wire bonder has specifications nearly equivalent to the D series, while featuring a vertical drive X-Y-Z three-axis manipulator. The body itself accommodates deep depths, making it a manual wire bonder suitable for bonding large substrates. Like the D series, it offers a lineup of wedge bonders and ball bonders.

• Steel

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor for West Bond in Japan for over 40 years, handling import, sales, and support. Among our products, the model 7476D has a proven track record of numerous installations in government agencies, universities, and various research institutions, and its operability using the patented new mechanism X-Y-Z 3-axis manipulator has received high praise from users. We would be grateful if you would consider it as a highly versatile manual wedge wire bonder that can meet diverse needs.

• Steel

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor of West Bond in Japan for over 40 years, handling import, sales, and support. Among our products, the model 7476D has a significant track record of deliveries to government agencies, universities, and various research institutions, and its operability using the patented new mechanism X-Y-Z 3-axis manipulator has received high praise from users. We would be grateful if you would consider it as a highly versatile manual wedge wire bonder that can meet diverse needs.

• Steel

West Bond has over 40 years of history as a pioneer in wire bonders used in the semiconductor industry, and we have received support from many customers both domestically and internationally. As the exclusive distributor of West Bond in Japan, we have been engaged in import, sales, and support for over 40 years. The model 7100C is a manual type crystal pickup machine suitable for research and development, which allows for easy pickup of crystals using the patented X-Y-Z 3-axis micromanipulator, the biggest feature of West Bond products. It has already been adopted as a handling machine for protein crystals, so please feel free to contact us.

• Steel

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor for West Bond in Japan for over 40 years, handling import, sales, and support. The coated wire, TAB, and beam lead bonders are manual bonders that excel in operability and versatility, utilizing a new X-Y-Z three-axis manipulator for operations. The applicable load range is from 25 to 250 grams.

• Steel

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor for West Bond in Japan for over 40 years, handling import, sales, and support. The Model 3000 series is an automatic wire bonder that is optimal for special packages. The automatic recognition device employs a multi-value method, enabling stable bonding. Our lineup includes the wedge type (Model 3400F), deep access wedge type (Model 3600F), and ball type (Model 3700F).

• Steel

West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor of West Bond in Japan for over 40 years, handling import, sales, and support. The Model 4000 series is a semi-automatic wire bonder equipped with an X-Y manipulator and motor-driven Y and Z axes. The basic operation method involves aligning the cross mark on the monitor with the bonding point and performing wire bonding through button operations. Loop control during wire bonding can also be set.

• Steel

The chips are pushed up from the wafer (tray) and adhered, followed by alignment through image processing after flipping them upside down. Automatic flip chip bonding is performed using thermal compression/adhesive (dispensing)/eutectic methods. The alignment accuracy is ±5 microns (under no load).

• Steel

Installation of two cameras, top and bottom. Alignment based on chip alignment marks, bumps, pads, and outlines. High-precision bonding is performed. A general-purpose simple flip chip bonder that is not restricted by device types, materials, or bonding methods.

• Steel