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  1. Home
  2. Testing, Analysis and Measurement
  3. 受託分析|ユーロフィンEAG
Testing, Analysis and Measurement
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受託分析|ユーロフィンEAG

addressTokyo/Chiyoda-ku/3-8-1 Nishikanda, Chiyoda First Building East Wing, 12th Floor
phone03-4330-3709
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last updated:Jul 18, 2025
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受託分析|ユーロフィンEAG Company Overview

Expert in material analysis | WE KNOW HOW to solve your scientific problems!

If you are having trouble with material analysis, please feel free to consult EAG! ● High-quality analysis ● Short delivery time ● Quick response Eurofins EAG (abbreviated as EAG) has been providing material analysis services for over 40 years in the semiconductor industry, high-purity metals, and advanced/nano materials fields. We respond to customer needs with our long-standing technical expertise and quick delivery in SIMS analysis (Secondary Ion Mass Spectrometry), which is essential for process development, research and development, and quality assurance of semiconductor devices and manufacturing equipment, as well as TEM/STEM analysis (Transmission Electron Microscopy) and GDMS analysis (Glow Discharge Mass Spectrometry) used for impurity analysis of high-purity materials.

Business Activities

■EAG Material Analysis Services Morphological Analysis ● Electron Microscopy Analysis: TEM/STEM, AC-STEM, EDS, EELS, Cryo-TEM, Cryo-FIB, FIB-SEM, Plasma-FIB, SEM-CL ● Identification of Emission Failure Locations: OBIRCH, Emission (EL), IR ● Non-destructive Analysis: XCT, C-SAM SIMS Analysis: SIMS, PCOR-SIMS Crystal Structure Analysis: TEM, XRD, Raman, PED, EBSD Surface Analysis: XPS/ESCA, AES, TOF-SIMS ● Thin Film Analysis: RBS/HFS, XRR, Ellipsometer ● Wafer Surface Contamination Analysis: TXRF, VPD-ICP-MS Impurity Analysis: GDMS, GD-OES, IGA, XRF, ICP-MS, ICP-MS/MS, ICP-OES, SIMS Organic Analysis: Nano-IR, TOF-SIMS, Raman, FT-IR Others: ● Sealing Package Analysis: IVA/HR-IVA (Analysis of Internal Moisture Content and Gas Components), Kr85 Leak Test Semiconductor ATE Testing, Electrical Characteristic Evaluation, Reliability Evaluation

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Products/Services (4)

Fine structure analysis | TEM/STEM (Transmission Electron Microscopy Analysis) product image
Fine structure analysis | TEM/STEM (Transmission Electron Microscopy Analysis)
Impurity Analysis | GDMS (Glow Discharge Mass Spectrometry) product image
Impurity Analysis | GDMS (Glow Discharge Mass Spectrometry)
SIMS Analysis | PCOR-SIMS (High-Precision Secondary Ion Mass Spectrometry) product image
SIMS Analysis | PCOR-SIMS (High-Precision Secondary Ion Mass Spectrometry)
Free Analysis Seminar | Smart CHART product image
Free Analysis Seminar | Smart CHART

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catalog(5)

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Company Information | Eurofins EAG

Company Information | Eurofins EAG

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Case Analysis | Material Analysis Research on the Evolution of FinFET Technology: From 22 nm to 7 nm

Case Analysis | Material Analysis Research on the Evolution of FinFET Technology: From 22 nm to 7 nm

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Analysis Case | Measurement of Impurities in Silicon for Solar Cells

Analysis Case | Measurement of Impurities in Silicon for Solar Cells

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Analysis Case | Characterization of Ultra-Low Energy Boron Ion Implantation Samples After Thermal Treatment Using PCOR-SIMS

Analysis Case | Characterization of Ultra-Low Energy Boron Ion Implantation Samples After Thermal Treatment Using PCOR-SIMS

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news(1)

[Company Name Change] As of December 2019, NanoScience has changed its company name.

  • COMPANY

Notice of Company Name Change We would like to inform you that our company, Nano Science Co., Ltd., will change its name as follows starting from December 2019. We appreciate your continued support. This is a brief notice to convey our greetings. New Company Name: Eurofins EAG Materials Science Tokyo Corporation *There will be no changes to our address or phone number. For inquiries regarding this matter, please contact us at analysis@eag.com.

Dec 23, 2019

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Company name 受託分析|ユーロフィンEAG
Contact addresspostalcode 101-0065 Tokyo/ Chiyoda-ku/ 3-8-1 Nishikanda, Chiyoda First Building East Wing, 12th FloorView on map TEL:03-4330-3709
Industry Testing, Analysis and Measurement
受託分析|ユーロフィンEAG Building Image

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