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The AMP-104C is a cost-effective 4-axis motion controller card equipped with a PCI Express interface that can generate pulse trains of up to 4.9MHz to control motors. With more versatile I/O and 4-channel encoder feedback inputs, the AMP-104C can be used in many scenarios and applications. As a motion controller, the AMP-104C allows for the setting of asymmetric acceleration and deceleration profiles. The AMP-104C can configure speed profile settings for asymmetric acceleration and deceleration, control T-shaped and S-shaped speed profiles, and select motion stop methods. It also supports speed changes on a single axis, linear interpolation on any two axes, and simultaneous start/stop across multiple axes.
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GPUs can enhance the performance of various workloads such as image processing and analysis, compute acceleration, and artificial intelligence (AI). As the demands for responsiveness and accuracy in edge systems increase, the combination of CPUs and GPUs is becoming mainstream to optimally optimize performance per watt or dollar.
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Automakers are developing and deploying autonomous mobile robots (AMRs) that can handle and transport production materials without human intervention to enhance logistics efficiency. IDEALworks, a wholly-owned subsidiary of the BMW Group, sought support from NVIDIA and ADLINK in developing the necessary software stack and a robust edge AI computing platform. By downloading this case study, you can see how NVIDIA and ADLINK supported IDEALworks in building AMRs, freeing employees from repetitive loading tasks, and allowing them to focus on core competencies.
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The ADLINK Express-ADP COM Express Type 6 basic size module is the first COM Express module to support an advanced hybrid architecture based on the 12th generation Intel Core processors, featuring up to 6 performance cores (P-core) for IoT workloads and up to 8 efficient cores (E-core) for background task management, promoting productivity and IoT innovation across a wide range of deployments. This module provides support that combines PCIe 4.0 with increased DDR5 memory and cache of up to 4800MT/s, as well as security and manageability features, AI capabilities for intelligent workload optimization, and enhancements in graphics, AI, computer vision, peripheral connectivity, and high-speed memory access.
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Tank trucks are one of the most common and efficient means for chemical manufacturers to transport liquid and gaseous chemicals to industrial production facilities. Chemicals can be corrosive, explosive, flammable, or toxic. If hazardous chemicals leak, they can cause long-term damage to people and the environment. However, being human, tank truck drivers and storage tank operators inevitably make mistakes or become distracted during unloading. An analysis of over 1,600 hazardous chemical incidents revealed that 65% of these accidents were due to human error. With the maturation of deep learning technology, AI-enabled machine vision solutions such as IP surveillance cameras and industrial smart cameras have become capable of monitoring the entire chemical unloading process and detecting anomalies before human accidents occur. Combining IP surveillance cameras with AI network video recorders (NVRs) provides installation flexibility, but transmission delays remain an unresolved issue. Industrial smart cameras integrated with machine learning algorithms have become feasible and have been introduced in manufacturing plants to prevent the occurrence of human errors.
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The ADLINK LEC-RB5 is a SMARC module that features the Qualcomm QRB5165 SoC, equipped with eight Arm Cortex-A77 cores and a Qualcomm Hexagon Tensor Accelerator with up to 15 TOPS. This module is designed for applications in robotics and drones, integrating multiple IoT technologies into a single solution. The LEC-RB5 SMARC module provides artificial intelligence (AI) capabilities on-device, supports up to six cameras, and offers low power consumption. It can power robots and drones in consumer, enterprise, defense, industrial, and logistics sectors.
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◆Introduction As ROS 1-based robotic systems become outdated or unable to meet the evolving needs of new industrial applications, the transition of robotic systems to ROS 2 is considered a practical next step in the evolution of robotic system design. The purpose of this guide is to address the following challenges related to the transition from ROS 1 to ROS 2: ● Reasons for transitioning from ROS 1 to ROS 2 ● Who needs to consider transitioning to ROS 2 ● Challenges of the transition ● Solutions and recommendations needed for the transition ● Transitioning Gazebo ROS ● Examples of migrating ROS 2 C++ source code
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GPUs can enhance the performance of various workloads such as image processing and analysis, compute acceleration, and artificial intelligence (AI). As the demands for responsiveness and accuracy in edge systems increase, the combination of CPUs and GPUs is becoming mainstream to optimally streamline performance per watt or per dollar.
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GPUs can enhance the performance of various workloads such as image processing and analysis, compute acceleration, and artificial intelligence (AI). As the demands for responsiveness and accuracy in edge systems increase, the combination of CPUs and GPUs is becoming mainstream to optimally optimize performance per watt and per dollar.
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GPUs can enhance the performance of various workloads such as image processing and analysis, compute acceleration, and artificial intelligence (AI). As the demands for responsiveness and accuracy in edge systems increase, the combination of CPUs and GPUs is becoming mainstream to optimally streamline performance per watt and per dollar.
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The ADLINK LEC-EL is a SMARC module that supports the Intel Atom x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE) processor (formerly Elkhart Lake) with integrated Intel UHD graphics and high-speed interfaces. The LEC-EL module supports up to 8GB of LPDDR4 memory and is designed to meet strict operating temperature ranges and low power consumption envelopes, making it an ideal product for mission-critical fanless edge computing applications where safety and reliability are always required.
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The ADLINK nanoX-EL is a COM Express Type 10 module that supports Intel Atom x6000 series processors (x6425E, x6413E, x6211E, x6200FE, x6425RE, x6414RE, x6412RE), Intel Pentium, and Celeron N/J series processors (formerly codenamed Elkhart Lake), and features a high-speed interface with integrated Intel UHD graphics. The nanoX-EL module supports up to 16GB of in-band ECC LPDDR4 memory and is designed for robust operating temperature ranges and low power consumption, making it ideal for mission-critical fanless edge computing applications where safety and reliability are always required.
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ADLINK's "COM-HPC-ALT" is the world's first 80-core COM-HPC server-type module. Based on the Ampere Altra SoC, which utilizes the Arm Neoverse N1 architecture, it features up to 80 Arm v8.2 64-bit cores running at 2.8GHz, with a TDP of just 175 watts. The COM-HPC Ampere Altra, which adopts an architecture with excellent performance per watt, is suitable for massive data processing at the edge without requiring significant initial investment or ongoing maintenance costs. The COM-HPC-ALT has been certified as compliant with the Arm SystemReady program, supporting common operating systems and subsequent software layers, ensuring a seamless user experience. When combined with the open-source EDKII project, this module supports operating systems such as CentOS, Ubuntu, and Yocto Linux.
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**Results of Introducing Medical Panel Computers** National Taiwan University Hospital has introduced ADLINK's MLC 8 series medical panel computers to ensure smooth operations within the hospital while addressing the needs for infection control. ● Cleaning is performed eight times a day to prevent infections without interrupting medical services. ● An antibacterial coating is applied through public health design, suppressing bacterial growth rates by up to 99.999%. ● IT system integration is completed within three business days.
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ADLINK provides an optimized high-availability computing platform with scalable options, including MXM cards. The DLAP-8000 series platform features active cooling for applications that require a very high level of computing in limited space, supporting performance-demanding workloads such as deep learning.
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ADLINK provides an optimized high-availability computing platform with scalability options, including MXM cards. The DLAP-4000F series platform features active cooling for applications that require a very high level of computing in limited space, supporting performance-demanding workloads such as deep learning.
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ADLINK provides an optimized high-availability computing platform with scalability options, including MXM cards. The DLAP-3200-CF series platform features active cooling for applications that require a very high level of computing in limited space, supporting performance-demanding workloads such as deep learning.
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ADLINK provides an optimized high-availability computing platform with scalability options, including MXM cards. The DLAP-3100-CF series platform features active cooling for applications that require a very high level of computing in limited space, supporting performance-demanding workloads such as deep learning.
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Due to the aging population and the increasing demand for early diagnosis, medical imaging diagnostics are required to provide faster, more efficient, and higher diagnostic accuracy. As a result of the rapid development of deep learning algorithms and GPU-accelerated computing, AI is expected to become a catalyst to meet the growing demand for medical image processing. According to a medical market research report, the market for artificial intelligence in medical image processing is expected to grow at a CAGR of +30% from 2021 to 2026. ADLINK leverages its expertise and experience in optimizing edge computing performance for over 20 years to provide GPU solutions, helping medical imaging equipment manufacturers worldwide to utilize AI applications to achieve consistently clear and accurate medical images.
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ADLINK provides an optimized high-availability computing platform with scalability options, including MXM cards. The DLAP-3000-CFL series platform features active cooling for applications that require a very high level of computing in limited space, supporting performance-demanding workloads such as deep learning. Features of the DLAP-3000-CFL series: - Minimal embedded GPU platform (3 liters) - Reliable low TDP MXM GPU design - Scalable graphics processing from Pascal to Turing GPUs.
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The ADLINK VPX3-TL 3U VPX processor blade is equipped with 11th generation Intel Core i7 technology (formerly Tiger Lake-H), achieving performance improvements across generations with enhanced data and graphics capabilities necessary for next-generation mission-critical applications, as well as AI acceleration features. The SOSA-compliant design of the VPX3-TL module allows for easy reconfiguration and upgrades, providing high cost-effectiveness and enabling rapid development and deployment of embedded computing capabilities.
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The ADLINK Express-TL COM Express Type 6 Basic size module is based on the 11th generation Intel Core, Xeon W, and Celeron 6000 processors, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With 8 cores, 16 threads, and up to 128GB of memory, the Express-TL delivers uncompromising system performance and responsiveness for your solutions. The Express-TL features 12th generation Intel Iris Xe graphics and Intel AVX-512 Vector Neural Network Instructions (VNNI), achieving three times the AI inference performance compared to previous generation platforms without VNNI.
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Standard Operating Procedures (SOPs) in manufacturing are created to optimize product quality and cycle time, as well as to protect workers from hazards. However, the main failure factor in adhering to SOPs is human error. Therefore, continuous auditing and improvement of procedures are key to the success of SOPs. Traditionally, manufacturers have audited SOP compliance through manual monitoring. Tracking every process performed by each operator is too time-consuming to implement across all production lines. This has led manufacturers to seek automated solutions. "A high level of standardization is required in display assembly to ensure product quality. A solution that constantly monitors every movement on the assembly line is necessary. ADLINK addresses these requirements by utilizing AI smart cameras and behavior analysis deep learning algorithms," stated an assembly manager from a world-leading display manufacturer.
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CompactPCI Serial (PICMG CPCI-S.0) is a new modular computer standard officially adopted by PICMG in 2011. The CompactPCI Serial standard defines entirely new connectors that support high-speed serial interfaces such as PCI Express, SATA, USB, and Ethernet. The CompactPCI Serial backplane has six high-speed connectors P1 to P6 for system slots, but only P1 is mandatory for peripheral slots, while P2 to P6 are optional. A CompactPCI Serial system can consist of a total of nine blades (one system blade and eight peripheral I/O blades) through Ethernet full mesh or single star architecture. The CompactPCI Serial standard is the next generation of the CompactPCI specification, providing greater flexibility and higher bandwidth for modular system solutions.
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The CM5-P1000 PCIe104 module is a compact and slim graphics module solution compliant with the PCI/104-Express & PCIe/104 version 3.0 specifications, providing the benefits of the latest and most advanced GPUs for embedded systems. Its excellent graphics performance, GPU computing, and video capabilities make it an ideal solution for systems that require performance, such as digital signage, medical imaging, defense, and aerospace applications.
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The Express-CFR is a COMExpress COM.0R3.0 basic size Type 6 module that supports hexacore (6-core) 64-bit 9th generation Intel Core and Xeon processors (codename "Coffeelake Refresh-H"). It is equipped with Mobile Intel QM370, HM370, and CM246 chipsets. The Express-CFR features up to three SODIMM sockets that support a maximum of 96GB of DDR4 memory (with two on the top by default and one on the bottom as a build option). It fully complies with the mechanical specifications of PICMG COM.0. Modules with Xeon processors and the CM246 chipset support both ECC SODIMM and non-ECC SODIMM.
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The ADLINK LEC-IMX8MP is the first module compliant with SMARC revision 2.1, based on the powerful NXP i.MX8M Plus (quad-core Arm Cortex-A53) processor equipped with an optional neural processing unit (NPU) that operates at up to 2.3 TOPS, focusing on industrial IoT with machine learning and vision, advanced multimedia, and high reliability. Additionally, it supports dual image signal processors and two camera inputs, enabling an effective vision system. The LEC-IMX8MP is suitable for applications such as smart homes, buildings, cities, and Industry 4.0.
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The contact lens market in the Asia-Pacific region is expected to grow at a CAGR of 8.16% from 2020 to 2025. This rapid growth relies on increased production and improved quality inspection rates. ADLINK and its AI solution partner, LEDA Technology, provide AI-enabled Automated Optical Inspection (AOI) solutions to help Taiwanese contact lens manufacturers enhance the accuracy and speed of quality inspections.
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The NuDAM module provides direct communication with a wide variety of sensors, performs signal conditioning, scaling, linearization, and conversion, and acquires measurements of temperature, pressure, flow, voltage, and current. It can handle multiple digital signal types widely used in IoT and other industrial applications such as equipment monitoring, environmental monitoring, and industrial process control. The new ND-6117, ND-6124, ND-6150, and ND-6160 modules adopt Modbus/RTU as the best remote data transmission protocol, offering customers a comprehensive product.
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The NuDAM module provides direct communication with a wide variety of sensors, performs signal conditioning, scaling, linearization, and conversion, and acquires measurements of temperature, pressure, flow, voltage, and current. It can handle multiple digital signal types widely used in IoT and other industrial applications, such as equipment monitoring, environmental monitoring, and industrial process control. The new ND-6117, ND-6124, ND-6150, and ND-6160 modules adopt Modbus/RTU as the best remote data transmission protocol, offering customers a comprehensive product.
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The NuDAM module provides direct communication with a wide variety of sensors, performs signal conditioning, scaling, linearization, and conversion, and acquires measurements of temperature, pressure, flow, voltage, and current. It can handle multiple digital signal types widely used in IoT and other industrial applications, such as equipment monitoring, environmental monitoring, and industrial process control. The new ND-6117, ND-6124, ND-6150, and ND-6160 modules adopt Modbus/RTU as the best remote data transmission protocol, offering customers a comprehensive product.
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The NuDAM module provides direct communication with a wide variety of sensors, performs signal conditioning, scaling, linearization, and conversion, and acquires measurements of temperature, pressure, flow, voltage, and current. It can handle multiple digital signal types widely used in IoT and other industrial applications, such as equipment monitoring, environmental monitoring, and industrial process control. The new ND-6117, ND-6124, ND-6150, and ND-6160 modules adopt Modbus/RTU as the best remote data transmission protocol, offering customers a comprehensive product.
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The nanoX-AL is a COM Express COM.0 R2.1 Type 10 module compatible with the Intel Atom Processor E3900 series SoC. The nanoX-AL is designed for customers seeking a low-power, long-life solution that emphasizes optimized processing capabilities and graphic performance. The nanoX-AL features a dual/quad-core Intel Atom Processor E3900 series and supports non-ECC type DDR3L single-channel or dual-channel memory at 1600/1867 MHz, offering exceptionally excellent overall performance. The integrated Intel 9th generation LP graphics include support for OpenGL 4.3, DirectX 12, OpenCL 2.0, and hardware decoding for H.265/HEVC, H.264, MPEG2, VC1, VP9, MVC, and JPEG/MJPEG.
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ADLINK's cExpress-TL is based on the 11th generation Intel Core i7/i5/i3 and Celeron processors, and is the first COMExpress module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of the previous generation. Notably, it supports 2.5GbE Ethernet and, when leveraging the existing Cat5e cable infrastructure used for 1GbE Ethernet, can support four USB 3.2 ports with transfer speeds of up to 10Gb/s. The module's power range can be configured from 15 to 28 watts, making it suitable for embedded applications with space constraints that require fanless operation. Typical industries that require such high-performance/low-power characteristics include transportation, healthcare, industrial automation and control, edge controllers, robotics, and multi-camera-based AI.
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The ADLINK cExpress-EL supports the next-generation Intel Atom x6000 processor (Elkhart Lake) combined with Intel UHD graphics in a low-power envelope and high-speed interfaces. The cExpress-EL module supports up to 32GB of in-band ECC dual-channel DDR4 memory and is available in a robust operating temperature range and low-power envelope, making it ideal for mission-critical fanless edge computing applications that always require safety and reliability.
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The cExpress-AR, equipped with the new AMD Ryzen V2000 APU and high-performance integrated Radeon graphics, is the first Type 6 module in the market to support up to 16 threads of octa-core (8 cores) embedded SoC, achieving significant turbo boost up to 4.2 GHz. Compared to the previous embedded quad-core V1000 processor, the combination of additional cores and AMD's Zen 2 architecture has more than doubled performance and improved efficiency per watt by twofold. ADLINK's cExpress-AR standardly supports up to 64GB of DDR4 with two SO-DIMM slots. It offers ECC error correction and configurable TDP (up to 10W) based on the selected SKU, while providing 6 to 8 cores and passive cooling, making it suitable for mission-critical applications in harsh environments.
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◆MCM-100 The MCM-100 maximizes the accuracy and sampling rate of rotating machinery and equipment, enabling continuous data collection and vibration measurement 24 hours a day, 7 days a week. By integrating data collection, vibration analysis algorithms, computation, and network connection tasks into a single system, operators of rotating machinery, tooling, plants, and automation equipment can easily overcome the challenges of traditional equipment maintenance. ◆MCM-204 The MCM-204 is based on the ARM Cortex-A9 processor and features built-in 4-channel, 24-bit high-resolution analog inputs, functioning as a standalone device without a host PC. It is ideal for vibration measurement applications that require 24-hour vibration monitoring of rotating machinery and equipment. ◆USB-DAQ The USB DAQ module leverages ADLINK's expertise in analog design to enhance the convenience of data collection. By simply connecting ADLINK's PCI DAQ card to the USB port of a computer or notebook, there is no need to power off or open the chassis, while delivering performance equal to or greater than that of ADLINK's PCI/PCIe DAQ cards.
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◆ROScube-I ADLINK's ROScube-I is a real-time ROS 2 compatible robot controller based on Intel Xeon 9th generation Intel Core i7/i3 and 8th generation Intel Core i5 processors, featuring excellent I/O connectivity that supports various sensors and actuators for unlimited robot applications. It also supports Intel VPU and NVIDIA GPU cards for AI algorithm and inference computations. ◆ROS Starter Kit - Neuron The ADLINK ROS Starter Kit features flexible connectivity with a wide range of I/O ports and support for AI computing platforms. Additionally, compatibility with open-source ROS/ROS 2 provides full access to open-source application libraries for robot control, including vision, navigation, and motion control, facilitating the rapid realization of ROS/ROS 2 functionalities.
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The AmITX-CF-G, aimed at customers in the gaming industry and system integrators, is a Mini-ITX board specially designed for gaming. The AmITX-CF-G features GLI compliance, easy and flexible configuration, enhanced security, and system resilience. The value of the AmITX-CF-G includes expanded visual impact, guaranteed system integrity, secure transactions through fast TTM and low TCO, and maximized system uptime. The AmITX-CF-G meets application functionality requirements and can comply with GLI certification that other conventional Mini-ITX boards cannot provide.
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● Smart medical robots that reduce the risk of hospital-acquired infections and alleviate the burden on healthcare staff. ● AI-based facial recognition that excels in recognition efficiency and prevents contact infections. ● Advanced remote monitoring of production facilities to reduce the risk of viral infections among workers. ● Towards a smarter future.
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ADLINK's ROScube Pico TGL is a real-time ROS 2-compatible robot controller based on the 11th generation Intel Core i7/i5/i3 processors and Intel Iris Xe graphics, featuring excellent I/O connectivity and supporting a wide variety of sensors and actuators for unlimited robotic applications. The ROScube Pico TGL fully complements resources developed with the ADLINK Neuron SDK, making it an ideal platform for developing industrial service robot applications such as autonomous mobile robots (AMRs) and autonomous mobile industrial robots (AMIRs).
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This is an embedded fanless computer equipped with 9th generation Intel Xeon, Core i7/i3, and 8th generation Intel Core i5 processors. It is ideal for applications such as factory and machine automation, surveillance, railways, marine automation, and vehicle traffic systems.
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The robust Smart Touch Computer STC-AL series is equipped with an Intel Atom processor and is available with 10.1-inch and 15.6-inch touchscreens. Designed for industrial automation applications in harsh environments, the STC2-AL series features an IP65-rated front panel that withstands dust and water ingress, supports a power range of 9-36V, and optionally offers an extended temperature range of -30°C to 60°C. In addition to flexible mounting options and ADLINK's Smart Embedded Management Agent (SEMA), the STC series extends system uptime, facilitates cleaning, installation, and system management, ensuring end-user productivity. The STC series is suitable for light industrial applications such as food and beverage, pulp and paper, textiles, printing, and machinery sectors.
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GPUs can enhance the performance of a wide range of workloads, including image processing and analysis, accelerating computations, and artificial intelligence (AI). As the requirements for responsiveness and accuracy in edge systems become more stringent, the combination of CPUs and GPUs is becoming more mainstream to achieve optimal efficiency in performance per watt and per dollar.
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The ADLINK MVP-6100 series, featuring a 9th generation Intel Core processor, is a fanless embedded computing platform optimized for edge computing applications. The MVP-6100 series integrates high-performance computing, scalable features and enhanced I/O, and industrial-grade reliability into a compact fanless platform, providing reliable long-term operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
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