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The AXE-5100R7/R9 is a short-depth AI GPU server with a total height of 1U and a depth of 440mm, equipped with a single AMD Ryzen 7000/9000 series processor. This product offers an optional PCIe Gen5 x8 slot, supporting one full-height/3/4-length GPU. Additionally, it features five fan modules with smart control and redundant power supplies, achieving reductions in TCO (total cost of ownership), deployment time, rack space, and data risk in a secure on-premises edge AI environment.
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The ADi-SA6X-RZ-G-E8K, equipped with the AMD Ryzen Embedded 8000 series processor, delivers exceptional computing performance for the latest gaming machines. It supports up to four native 4K displays and offers optional expansion for PCIe Gen4 compatible discrete GPUs, achieving outstanding graphics performance and scalability. Designed for regulated gaming environments, this platform features TPM 2.0, BitLocker support, software-based trust chains, customizable BIOS, and intrusion prevention capabilities, along with a gaming I/O controller. These security features help protect the gaming system while simplifying compliance with regulations. The ADi-SA6X-RZ-G-E8K, designed for continuous operation in casinos, supports Windows 11 IoT and Ubuntu Linux, ensuring reliable performance. ADLINK's gaming middleware further accelerates software integration, leading to reduced development time.
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The ADLINK ADi-SA3X-RZ all-in-one gaming platform features powerful processing and graphics performance for gaming and retail. Equipped with an AMD Ryzen V2000 processor, the ADi-SA3X-RZ delivers compelling graphics performance with PCI Express 3.0x16 discrete graphics cards and/or AMD Radeon Graphics, supporting up to 8 independent monitors. The ADi-SA3X-RZ fully meets the needs of gaming applications with its strong processing capabilities, advanced security features, smart middleware solutions, and versatile I/O array. The ADi-SA3X-RZ is a true application-ready gaming platform that provides OEMs with a flexible and reliable all-in-one system. This platform is designed to meet GLI-11 (Gaming Laboratories International) certification and all major global gaming markets.
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The ADi-SA2X-RZ all-in-one gaming platform is equipped with powerful processing capabilities and graphics performance for gaming infotainment and retail. Featuring the AMD Ryzen Embedded R1000/V1000 series, the ADi-SA2X-RZ offers impressive graphics performance with Radeon RX Vega graphics and PCI Express 3.0 x16 discrete graphics cards, along with multi-display functionality supporting up to eight independent monitors. The ADi-SA2X-RZ meets the needs of gaming applications with its strong processing performance, advanced security features, smart middleware solutions, and diverse I/O array. The ADi-SA2X-RZ is a flexible and reliable all-in-one system that provides an unparalleled service portfolio to assist developers in reducing time and maintaining compliance, making it a true application-ready gaming platform.
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The ADLINK ISB-TR10 is a high-performance CEB server motherboard equipped with AMD EPYC 9005/9004 series processors. It features a robust architecture that supports up to 2TB of DDR5-6400 RDIMM memory and six PCIe Gen5 slots, providing a powerful foundation for high-load server workloads, AI inference, and data-intensive applications. 【Key Features】 ● Enhanced Scalability: Equipped with six PCIe Gen5 slots and five MCIO x8 connectors, maximizing I/O flexibility. ● Versatile Storage: Integrates two M.2 NVMe/SATA slots and flexible SATA support via MCIO for high-speed data processing. ● Optimized Form Factor: The standard 12-inch x 10.5-inch (CEB) size allows for easy integration into space-saving server chassis.
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The AXE-7220SR is a high-performance AI GPU server that adopts a 2U short-depth design with a depth of 450mm, compatible with 4th/5th generation Intel Xeon Scalable processors. It can accommodate up to 2 FHFLDW (full-height, full-length, dual-wide) GPUs, with optional configurations allowing for 2× PCIe Gen4 x16 or 5× Gen4 x8 slots. Additionally, it features hot-swappable fan modules (4 units), SSD bays, and redundant CRPS power supplies, achieving reductions in TCO, deployment time, installation space, and data risk in a secure on-premises AI inference environment.
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This COM Express Type 7 module, equipped with the AMD Embedded Ryzen V3000 (V3C18I) processor, delivers high-performance edge computing with exceptional power efficiency. The 8-core, 16-thread CPU operates at a mere 15W TDP (configurable down to 10W) and supports up to 64GB of 4800 MT/s DDR5 memory (2×32GB), making it ideal for systems with space and power constraints. Designed for network and infrastructure workloads, this module features PCIe Gen4, dual 10GbE Ethernet, and one 2.5GbE Ethernet interface, ensuring low latency and high throughput for edge networking, 5G edge infrastructure, video analytics, intelligent surveillance, and industrial automation applications.
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The ADLINK I-Pi OSM-510 development kit is based on the OSM-MTK510 computer-on-module and is designed to accelerate the development and evaluation of next-generation edge AI and embedded applications. Compliant with the compact OSM R1.2 standard, this kit provides a ready-to-use hardware platform that integrates processing power, connectivity, and essential I/O. Developers can quickly set up their systems without the hassle of complex custom board designs. Based on the power-efficient MediaTek Genio 510 AI-enabled SoC, the I-Pi OSM-510 enables efficient on-device inference for vision, multimedia, and intelligent edge workloads. The I-Pi OSM-510 development kit is optimized for rapid prototyping and early proof-of-concept development, helping engineers shorten time to market while maintaining a clear path to production.
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The I-Pi OSM IMX93 is an OSM-based smart solution development kit equipped with the NXP i.MX 93 (dual-core Arm Cortex-A55 & Arm Cortex-M33) processor and the in-SoC Arm Ethos-U65 microNPU (Neural Processing Unit). This is the first OSM R1.1 low-power development kit specifically designed for robust industrial embedded applications that require long life, high MTBF, and strict revision management. With a robust solderable design, compact size, and compatibility with pick-and-place machines, OSM can achieve many of the advantages of custom SBCs without making large engineering investments. This module features the power-efficient NXP i.MX 93 series SoC integrated with the in-SoC Arm Ethos-U65 microNPU, providing unparalleled flexibility, rich connectivity, and high scalability for compact edge applications.
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The ADLINK I-Pi OSM IMX95 development kit is an industrial-grade, immediately available platform designed to quickly initiate prototyping and software validation for next-generation edge AI and IoT applications. It is centered around the high-performance NXP i.MX 95 application processor and combines a feature-rich 4-inch reference carrier board with ADLINK's highly efficient 45x45mm OSM-IMX95. This evaluation system, which integrates edge AI and powerful graphics processing capabilities, enables developers to immediately build and benchmark advanced vision analytics, smart automation routines, and deterministic robot control loops after deployment. The standout feature of this development platform is its adoption of the advanced Open Standard Module (OSM) architecture. The OSM module utilizes a soldered Size-L BGA form factor, eliminating mechanical weaknesses, increased weight, and additional costs often associated with traditional board-to-board connectors.
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The ADLINK PCIe-10GPoE PCI Express PoE+ frame grabber supports 2 independent Gigabit Ethernet ports, enabling multiple GigE Vision connections with a transfer rate of up to 10Gb/s per port. PoE+ provides up to 30W of power supply and automatic detection, ensuring a stable and reliable connection, contributing to cost reduction, simplified installation, and reduced maintenance burden. Additionally, the unique PoE protection feature prevents equipment damage from overcurrent and overvoltage. Smart PoE management allows real-time monitoring and control of PoE status through an easy-to-use utility and API, reducing maintenance costs and enabling early detection of potential failures. ToE (Trigger Over Ethernet) achieves synchronized acquisition of multiple cameras through FPGA-based Trigger over Ethernet, significantly reducing ownership costs.
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The PCIe-GIE74V PCI Express PoE frame grabber supports 4 independent Gigabit Ethernet ports, accommodating multiple GigE Vision connections with a transfer rate of up to 1 Gb/s per port. PoE supplies up to 15.4W of power and automatically detects stable and reliable connections, achieving cost reduction, simplified installation, and reduced maintenance burden. Multi-card capture capability The PCIe-GIE74V can be installed in one system without occupying I/O resources, allowing for as many cards as needed. Comprehensive PoE protection features to safeguard assets Its unique comprehensive PoE protection features prevent overcurrent and overvoltage, protecting equipment from damage.
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The I-Pi SMARC Amston Lake is a SMARC-based edge solution development kit equipped with the power-efficient Intel Atom x7433RE quad-core SoC, integrating 32 EU Intel UHD graphics, deep learning inference capabilities, industrial-grade durability, and comprehensive high-speed interfaces. This kit, specialized for development, simplifies the adoption of AIoT and makes development easier than ever, thanks to support from the latest version of the Intel Distribution of OpenVINO toolkit, which features a dedicated processor, more deep learning models, higher inference performance, and fewer code changes. The I-Pi SMARC Amston Lake, equipped with higher performance, 8GB LPDDR5 memory, and 64GB eMMC storage, becomes an essential key for the development and prototyping of various integrated mission-critical and industrial IoT applications, where safety and reliability are always paramount, by supporting an extended temperature range.
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The AmITX-RZ-G-E8K, equipped with the AMD Ryzen Embedded 8000 series processor, delivers exceptional computing and graphics performance thanks to its advanced RDNA3 architecture. Designed with flexibility in mind, it features PCIe Gen4 expansion slots, multiple M.2 slots, and a rich array of I/O interfaces, enabling seamless system integration. It supports up to four independent DisplayPort outputs, creating an immersive multi-display environment ideal for gaming, infotainment, and interactive applications. This platform, designed with a focus on flexibility and expandability, supports PCIe Gen4 and multiple M.2 slots, allowing for seamless customization to meet a wide range of applications. With RDNA 3 graphics and DisplayPort 1.4a output, it supports up to four independent 4K displays, delivering excellent performance in multi-display environments such as digital signage, control rooms, and immersive gaming setups.
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The ADLINK AmITX-RL-I features Intel Core series 2 and 14th/13th/12th generation Core processors (up to 65W) and delivers exceptional performance in a compact Mini-ITX form factor. Based on the Intel Q670 chipset, it supports PCIe 5.0 x16, DDR5 memory (up to 5600 MHz), dual GbE LAN, and flexible expansion via M.2, making it ideal for AI vision, industrial automation, and compute-intensive edge deployments. With industrial-grade reliability and cutting-edge interfaces, the AmITX-RL-I enables developers to confidently build next-generation solutions.
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The ADLINK VPX3-XMXM series is a 3U VPX GPGPU (General-Purpose computing on Graphics Processing Units) blade designed to provide high-performance graphics and processing capabilities. Its primary application is to enable robust AI inference compliant with SOSA standards, making it a reliable solution specialized for high-load payload applications that require extensive real-time data processing in physically demanding industrial environments.
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Ultimate Embedded GPU for High-Performance Edge AI The EGX-MXM-BW5000, achieving up to 1,824 AI TOPS, is the flagship model of this series. Equipped with up to 24GB of high-speed GDDR7 memory, it delivers exceptional AI inference and graphics performance for the most demanding embedded AI workloads. It is optimized for large language models (LLM), generative AI, multi-stream AI inference, and other compute-intensive edge AI applications.
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High-performance AI and graphics for advanced edge systems The EGX-MXM-BW4000 combines powerful AI acceleration and advanced graphics performance in an MXM 3.1 Type B module, achieving up to 1,334 AI TOPS. This product, enhanced with GPU resources and memory bandwidth, is designed for demanding applications in computer vision, industrial AI, medical imaging, and real-time visualization.
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The highest computational density in MXM Type A modules The EGX-MXM-BW2000, achieving up to 798 AI TOPS, maximizes AI computational density within the compact MXM 3.1 Type A form factor. It is designed for embedded AI systems that require significantly higher inference performance without increasing the size of the module, making it ideal for robotics, machine vision, and medical imaging applications.
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Compact AI Acceleration for Embedded Systems with Space Constraints The EGX-MXM-BW500 is an ultra-compact MXM 3.1 Type A module that delivers up to 294 AI TOPS of AI performance. It is optimized for embedded platforms with limited space, providing efficient AI inference, computer vision, and graphics acceleration in intelligent edge devices where compact size, thermal efficiency, and reliable performance are essential.
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The SP2-TWL, equipped with the Intel Twin Lake processor, achieves an optimal balance of performance, energy efficiency, and scalability for modern edge computing. With a modular architecture and display sizes of 10.1 inches, 15.6 inches, and 21.5 inches available, OEMs and system integrators can quickly develop customized solutions for HMI, machine vision, medical, automation, and self-service applications.
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ADLINK is a global leader in the fields of industrial PCs and edge computing. This guide introduces the latest edge AI platforms, industrial PCs, servers, COM modules, vision systems, and display products that support digital transformation (DX) across a wide range of industries, including manufacturing, transportation, healthcare, and retail. By collaborating with major technology partners such as Intel, NVIDIA, AMD, and NXP, we provide high-performance and highly reliable solutions. Through case studies in AI visual inspection, railway communications, medical devices, and public infrastructure, you can explore our comprehensive product lineup that enables practical applications of edge AI.
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DLAP-IGX is a high-performance edge AI platform specifically designed for demanding applications such as humanoid robots, autonomous mobile robots (AMR), and advanced vision sensing systems. It features the NVIDIA IGX Thor architecture, achieving an astonishing 4,293 TFLOPS of AI performance. This industry-grade system is equipped with a 14-core Arm CPU and NVIDIA Blackwell GPU architecture, along with 128 GB of LPDDR5X memory. With dual 200GbE networking and integrated safety support, it provides the overwhelming throughput and reliability required for complex multi-model generative AI workloads.
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The core of the DLAP-701 is equipped with the cutting-edge NVIDIA Blackwell architecture. With the NVIDIA Jetson T5000/Jets T4000 modules, it achieves an astonishing maximum of 2070 FP4 TFLOPS of extreme AI performance. By combining a powerful ARM Neoverse-V3AE CPU (up to 14 cores) with 128GB of LPDDR5X memory, it processes complex AI workloads at unprecedented speed and low latency. Connectivity is extremely important in modern autonomous systems, and the DLAP-701 excels with its rich high-speed I/O. In addition to large data throughput supported by QSFP ports with 4x 25GbE, it features dual Gigabit Ethernet, multiple USB 3.2 Gen 2 ports, and comprehensive M.2 expansion slots for Wi-Fi 6 and 5G connectivity. The inclusion of an isolated CAN-FD interface further enhances reliability in vehicle and robot control.
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●Flexible Configuration through Advanced Modularity Manufacturers can easily customize the industrial panel PC STC series to match application-specific I/O and functions, allowing changes to computing performance levels, touch panel types, display sizes, and I/O interfaces. This customization accelerates development, validation, and verification, leading to savings in time, cost, and resources for all manufacturers. ●Long-term Durability and Reliability ADLINK's standalone panel PCs (STC series) achieve high ROI with long-life support and exceptional reliability. Even in harsh environments with extreme temperature and power input ranges, the STC series operates thanks to built-in over-voltage and under-voltage protection and an IP65-rated front panel. ●Infinite Possibilities through Customization ADLINK's smart touch computers can address the unique needs of individual vertical applications through custom functions and custom interfaces.
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● Flexible Configuration through Advanced Modularity Manufacturers can easily customize the industrial panel PC STC series to match application-specific I/O and functions, allowing changes to computing performance levels, touch panel types, display sizes, and I/O interfaces. This customization accelerates development, validation, and verification, leading to savings in time, cost, and resources for all manufacturers. ● Long-term Durability and Reliability ADLINK's standalone panel PCs (STC series) achieve high ROI with long-life support and exceptional reliability. Even in harsh environments with extreme temperature and power input ranges, the STC series operates with built-in over-voltage and under-voltage protection and an IP65-rated front panel. ● Infinite Possibilities through Customization ADLINK's smart touch computers can meet the unique needs of individual vertical applications through custom features and custom interfaces.
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The ADLINK PXES-2596 is a 9-slot PXI Express all-hybrid chassis. It features 1 system slot and 8 hybrid slots, supporting CompactPCI, PXI, and PXI Express modules for maximum flexibility. Based on a 2-link PXI Express architecture with a system bandwidth of 16GB/s, all peripheral slots support PCIe Gen3 x4, achieving a transfer speed of up to 4GB/s per slot. For expanded configurations, a 12-slot version of the PXES-2596E is also available, which includes 1 system slot, 8 hybrid slots, and 3 PXI Express peripheral slots, enhancing slot density and price-performance ratio. Additionally, both versions support single-board sales and utilize an ATX power supply design that eliminates the need for a power board, simplifying system integration and making it more user-friendly for single-board users. The chassis is equipped with a smart monitoring system that reports fan speed, system voltage, and internal temperature in real-time.
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The ADLINK PXIe-9908 is a PXI Express Source Measure Unit (SMU) designed for accurate measurements such as probing tests for Mini LEDs and Micro LEDs. This advanced SMU supports four-quadrant current/voltage source and measurement operations. With a current source and measurement range of 100nA to 100mA, it provides high precision. The voltage source and measurement options can be set to ±30V for 4 channels and -10V/+20V for 8 channels. Additionally, it can boost voltage measurements up to ±100V at a current of 10μA for specific tests, ensuring accurate and reliable data acquisition in research, development, and production testing.
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The ADLINK EMP-100-IMX8 is a palm-sized, fanless embedded platform designed for reliable edge computing in industrial environments. Equipped with the NXP i.MX 8 application processor, it achieves an optimal balance of performance and power efficiency, making it ideal for HMI, industrial automation, transportation, and smart infrastructure applications. Its robust solid-state design ensures reliable operation even in space-constrained environments and harsh installation conditions. Designed with flexibility in mind, the EMP-100-IMX8 features rich I/O connectivity, allowing for seamless integration with a variety of peripherals and sensors. With support for high-resolution display output, industrial communication interfaces, and multiple USB and serial options, developers can easily build scalable systems. Additionally, it supports Linux and Windows operating systems, accelerating application development and simplifying system integration.
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The ADLINK AXE-7220GW is a compact 2U short-depth AI GPU server equipped with Intel Xeon 600 processors for workstations, supporting a maximum TDP of 350W. The ultra-short-depth chassis, specially designed for space-constrained edge environments, maximizes rack efficiency without sacrificing performance, enabling high-bandwidth vision workloads and real-time AI inference in tight spaces and remote deployment sites. - Compact Edge Optimization: Featuring a 2U chassis with a depth of 438mm, it maximizes space efficiency in small racks and limited edge spaces. - Dual GPU Performance: Supports up to 2 FHFLDW PCIe Gen5 x16 GPU cards, providing overwhelming processing power necessary for high-load AI processing and fast visual analysis. - High-Density Thermal Management: Equipped with 4 built-in fan modules and high-speed DDR5-6400 memory, it achieves stable high-performance operation despite its small form factor.
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The ADLINK AXE-7420GWA is a 4U short-depth industrial server equipped with Intel Xeon 600 processors for workstations, supporting a maximum TDP of 350W. Designed for industrial backends with limited space, its compact 550mm chassis maximizes rack efficiency while providing a 12-slot expansion design that integrates complex automation workloads and server-class AI intelligence into existing infrastructure. - Compact rack efficiency: The short-depth 4U chassis with a depth of 550mm is ideal for deployment in standard industrial cabinets or factory environments with limited space. - Abundant I/O flexibility: It offers a 12-slot expansion layout, including three PCIe x16 slots and two x8/x4 slots via MCIO, catering to diverse automation and GPU acceleration needs. - Industrial storage and power: It supports up to eight 2.5-inch/3.5-inch SATA HDD bays and an industrial-grade ATX power supply, ensuring reliable data processing and power stability for mission-critical tasks.
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The ADLINK AXE-7440GW is a high-performance 4U AI GPU server equipped with Intel Xeon 600 processors for workstations, supporting a maximum TDP of 350W. Designed for large-scale parallel processing, it features an 11-slot expansion design that supports up to four double-width PCIe Gen5 x16 GPU cards via expansion boards. It provides the advanced computational power necessary for deploying large language models (LLMs) and complex multimodal AI at the edge. - Exceptional GPU scalability: Supports up to four dual-slot Gen5 x16 GPU cards, accelerating high-load generative AI training and real-time inference. - Flexible high-density storage: Equipped with eight 2.5-inch/3.5-inch SATA HDD bays and dual M.2 NVMe slots, enabling fast data access and large-capacity local storage. - Advanced thermal resistance: Features three hot-swappable built-in fan modules and an optional rear exhaust fan to ensure stable performance of high TDP workstation processors.
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The ADLINK ISB-W890 is a high-performance CEB board equipped with Intel Xeon 600 processors for workstations. It features a robust architecture that supports up to 1TB of DDR5-6400 ECC memory and seven PCIe slots (including three Gen5 x16 slots), providing a powerful foundation for multi-GPU AI inference and professional visualization tasks. Key Value Propositions Elite Expandability: With seven PCIe slots and four MCIO x8 connectors, it maximizes I/O flexibility. Versatile Storage: Equipped with two M.2 NVMe, two SlimSAS, and eight SATA III slots for high-speed data processing. Optimized Form Factor: The standard 12-inch x 10.5-inch CEB size allows for easy integration into space-saving workstation chassis. *The PCIe lane configuration varies depending on the Intel Xeon CPU SKU installed.
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Compact, powerful, industrial-grade specifications The EVP-1000-E4 is a space-saving 1U edge AIoT system designed for intelligent industrial applications. Equipped with 12th/13th generation Intel Core processors and supporting CPUs up to 65W, this platform delivers exceptional computing performance in a compact form factor. Designed for automation, vision, and IoT edge environments, it integrates robust I/O, advanced networking capabilities, and expansion through a PCIe x4 slot, enabling flexible peripheral integration.
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The IAP-E47-4U is a power-efficient 4U industrial PC designed for control, machine vision, and embedded AI applications that require reliable performance and diverse scalability. This platform, equipped with Intel Core processors (up to 8 cores, 65W), provides balanced computing power for industrial automation workloads while maintaining energy efficiency. Built on ADLINK's industrial-grade architecture, the IAP-E47-4U supports scalable PCIe expansion for motion control, vision, DAQ, and GPU cards, and is fully compatible with ADLINK's validated I/O modules. With certifications for international safety standards and EMC standards (CB, UL, LVD, CE, FCC), it simplifies international deployment and reduces the effort required for equipment manufacturers to obtain certification.
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The IAP-M47-4U is a high-performance 4U industrial automation platform designed for AI inference, machine vision, and GPU-accelerated computing. It supports dual high-end GPUs with up to 125W Intel Core processors and up to 2,000W power supply, providing high stability and scalability to handle compute-intensive industrial workloads. Equipped with up to 12 expansion slots, the IAP-M47-4U can flexibly integrate GPUs, frame grabbers, motion controllers, DAQ cards, and TSN networks through ADLINK's fully validated I/O ecosystem. Its optimized thermal design and industrial-grade power supply ensure reliable full-load operation even in continuous high-load environments.
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The MLC-M is a slim and lightweight medical panel PC that is ideal for hospital information management in nursing stations and medical carts. The MLC-M supports the 11th generation Intel Core processor (Tiger Lake) and provides the processing power necessary to run high-performance imaging software, as well as hospital applications such as HIS, RIS, PDMS, and document creation software. The MLC-M has obtained an IP54 rating due to its screwless and fanless design, making it easy to clean and protecting clinicians, nurses, and patients from potential infections. For an excellent user experience, the MLC-M features a highly flexible IO function module that can be customized for dedicated applications, four control keys for easy operation, a touch panel, and a selection of optional accessories.
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This panel PC reduces risks associated with standard IT certifications by complying with the strict requirements of the EU Medical Device Regulation (MDR), ensuring higher safety. Furthermore, as it complies with EU MDR Class I for medical devices, it becomes a valuable asset for healthcare facilities aiming for seamless, safe, and efficient operations, facilitating integration into large medical systems. Additionally, to maximize patient safety, it features 4kV isolation (2xMOPP) on one of the Ethernet ports, with optional 2x USB 2.0 Type-A and up to 6x RS232/422/485 D-Sub DB9 UART ports. The stringent patient protection design ensures that both patients and medical staff are safely protected from potential electrical hazards.
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The AVA-7200 is an EN 50155:2021 certified edge AI platform designed to meet the connectivity and processing needs of modern railway vehicles. It is available in the architecture of both NVIDIA Ampere GPGPU (A2000/A4500) and the 13th generation Intel Raptor Lake mobile processors, featuring a fanless robust design and excellent durability, allowing for flexible adaptation to various integration requirements.
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The AVA-1000 is a compact, EN50155-compliant onboard gateway designed to meet the connectivity and processing needs of modern railway vehicles. Available in both ARM and x86 architectures, it is small yet flexible enough to accommodate various integration requirements. With built-in 5G, Wi-Fi, and GNSS, the AVA-1000 enables reliable high-speed communication between onboard systems. It maintains real-time consistency in data updates between passenger information displays in each compartment and the central railway server, allowing passengers to receive accurate and synchronized information throughout their journey.
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The ADM-AL30 is dedicated to autonomous driving applications. This AI computing platform, equipped with Intel's 12th generation Core i9/i7 CPU and NVIDIA RTX 4000 SFF Ada GPU, can process vast amounts of data and make critical decisions for autonomous vehicles. It features two 10G Base-T and eight 1G Base-T1 automotive Ethernet ports, as well as eight CAN FD and four CAN 2.0 interfaces, allowing for seamless integration into any automotive ecosystem. Additionally, it complies with ISO 16750-2 and ISO 7637-2, ensuring reliability and safety even under the most demanding conditions.
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**[Case Study Introduction]** ADLINK's computer-on-module portfolio supports drone startups with a scalable and simple design that accelerates AI performance, reducing time to market for cutting-edge drone platforms. For companies facing challenges in drone design and manufacturing that are not yet prepared to respond, the approach using computer-on-modules can alleviate design complexity while providing the potential for shortened time to market and cost reduction, all while meeting the technical requirements of advanced drones. By downloading this case study, you will gain insights into "Streamlining Drone Design with COM" and "Enhancing AI Workload Performance in Next-Generation Drones with ADLINK's COM," among other topics. We encourage you to download it and read through it.
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In the drone industry, flight control systems require real-time performance, high processing power, and safety and reliability. In particular, to achieve functions such as stability during flight, accurate positioning, and obstacle avoidance, high-performance processors and robust systems that support them are essential. The OSM-MTK510 is an OSM R1.1 Size L module equipped with the advanced MediaTek Genio 510 series processor. It features a dual-core Arm Cortex-A78 and a quad-core Cortex-A55, boasting an excellent MediaTek DLA+VPU AI engine capable of up to 3.2 TOPS, making it ideal for edge AI applications. It excels in providing edge AI processing with ultra-low power consumption. The OSM-MTK510 supports a variety of graphic outputs, including HDMI/DP, eDP, and DSI, and comes with comprehensive connectivity options such as GbE x1, I2S audio codec interface, USB 3.0 x1, and USB 2.0 x2. It is versatile and robust, equipped with 17x GPIO, and guarantees long-term availability with a 10-year supply.
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In the drone industry, flight control systems require real-time performance, high processing capability, as well as safety and reliability. In particular, to achieve functions such as stability during flight, accurate positioning, and obstacle avoidance, high-performance processors and robust systems that support them are essential. The ADLINK LEC-MKT-I1200 is a SMARC module equipped with the MediaTek MT8395 SoC, which features four Arm Cortex-A78 cores, four Cortex-A55 cores, and up to 5 TOPS APU. This module incorporates IoT technologies, including on-device artificial intelligence (AI) capabilities and support for up to three cameras, while achieving a low power consumption envelope.
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In the drone industry, flight control systems require real-time capabilities, high processing power, and safety and reliability. In particular, to achieve functions such as stability during flight, accurate positioning, and obstacle avoidance, high-performance processors and robust systems that support them are essential. The ADLINK SMARC LEC-RB5N module is a Linux microprocessor-based COM. This solution is based on Qualcomm's QRB5165 octa-core CPU, equipped with an integrated NPU, providing up to 15 TOPS of performance to handle demanding AI tasks. It also features a powerful GPU compatible with OpenGL and Vulkan for processing visual data. Additionally, it comes with a wide range of video and display interfaces.
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