化研テック Product Lineup

The photopolymer resin used in 3D printers requires cleaning because resin adheres to the exterior and nozzle after printing. IPA is widely used for cleaning, but there are cases where compliance with organic regulations and fire safety laws is necessary. In this instance, we will introduce a case where the burden of compliance with organic regulations and fire safety laws was reduced by switching from IPA to a cleaning agent that is not subject to fire safety laws.

In the manufacturing site of electronic components, fine contaminants such as machining oils, grease, and dust can affect product quality, making the cleaning process essential. On the other hand, IPA falls under the organic regulations, requiring ongoing measures for health checks, protective equipment, and local exhaust systems. This document presents a case study of switching from IPA to a cleaning agent that is not subject to organic regulations, resulting in reduced compliance costs and management man-hours.

The flow palette accumulates flux and solder, so regular cleaning is necessary. However, hand cleaning not only takes time and labor but can also result in variations in cleaning quality. In this case, we will introduce an example where the introduction of a dedicated cleaning system achieved a reduction in cleaning time and labor savings.

In the cleaning process of electronic components, various running costs arise, including not only cleaning agents but also the water used for rinsing and waste liquid treatment. This time, we will introduce a case where significant cost reduction was achieved while maintaining cleaning performance by switching the cleaning agent to the Microclean RW series.

In the painting process of automobiles and automotive parts, a stripping process is necessary to regularly remove the paint film that adheres to the jigs. This time, we will introduce a case where we achieved a significant reduction in energy consumption while maintaining stripping performance by changing the stripping agent to Strial UM-4400.

Inside the reflow oven, flux residue that has baked on due to heating accumulates, necessitating regular cleaning. This time, we will introduce a case where we reviewed cleaning with IPA and adopted Locklin YD-99, achieving a reduction in cleaning time and an improvement in the working environment.

In the solder paste printing process, the back wiping process to remove the paste adhered to the back of the metal mask is essential. We will introduce a case where switching from the traditionally used IPA and ethanol to a dedicated cleaning agent has achieved a reduction in the burden of compliance with fire laws and organic regulations.