清和光学製作所 List of Products and Services

The "FSM Series" is a device that measures the outer diameter dimensions of FOUP/FOSB/OC. With a 25-megapixel camera and a dedicated optical engine, it enables ultra-high-quality outer diameter measurements. It measures and inspects the top flange, side fork lift flange, step pitch for wafer mounting, and registration pinholes from various angles. Custom orders are also available. Please feel free to consult us. 【Features】 ■ Compatible with FOUP/FOSB/OC from various manufacturers ■ Capable of inspecting sizes other than the standard φ300mm and color cassettes ■ Enables ultra-high-quality outer diameter measurements with a 25-megapixel camera and dedicated optical engine ■ High-speed processing with an ultra-wide field of view achieves industry-leading throughput ■ Custom orders are also available *For more details, please refer to the PDF document or feel free to contact us.

• Semiconductor inspection/test equipment
• Other inspection equipment and devices

The "MS-200-TCD33" is an F-mount tube designed for infinite focus (f=200mm) compatible with 12-megapixel area cameras (5.5μm, 4096×3072) like the "CMV1200" and 25-megapixel area cameras (4.5μm, 5120×5120) such as the "Python25K." It supports built-in coaxial illumination and can accommodate laser autofocus and an electric revolver. We also offer a TNIR model compatible with near-infrared wavelengths, along with the objective lens. Please feel free to contact us if you have any inquiries. 【Features】 ■ Full field observation with F-mount 25-megapixel cameras ■ Compatible with laser autofocus and electric revolver ■ f=200mm infinite focus design ■ Supports built-in coaxial illumination ■ Four types of dedicated objective lenses available: ・1.5X: 22mm, 2.5X: 13.2mm, 5X: 6.6mm, 10X: 3.3mm *For more details, please refer to the PDF document or feel free to contact us.

• Other microscopes
• Microscope
• lens

The "NIR2021-200" is a microscope that utilizes the transmission and reflection characteristics of infrared light to observe the interiors of semiconductor devices such as silicon wafers, chips, MEMS, and CSPs. Equipped with a SWIR camera featuring a 1.3MP Sony IMX990 sensor with a pixel size of 5μm, it allows for the acquisition of high-resolution images despite being in the near-infrared spectrum. The uniquely designed imaging tube and PEIR objective lens series, specifically designed for the highly sensitive near-infrared range of 1100-1700nm, enable the capture of high-contrast images even with thick or high-density wafers. 【Features】 ■ Equipped with a 1.3 Mega SWIR camera ■ Allows internal observation of mounted IC chips that do not transmit visible light ■ Set up with a high-power near-infrared halogen light source ■ Bright images can be obtained even when using a 100x objective lens ■ Equipped with a stage for 8-inch wafers ■ Options such as vibration isolation tables and wafer loaders are also available *For more details, please refer to the PDF document or feel free to contact us.

• Optical microscope
• Other microscopes

Compatible with InGaAs (SWIR) cameras. High transmission rate imaging lens with f=200mm for 900-1700nm. Compatible with 1.1-inch sensors. C-mount. Coaxial Kohler illumination.

• Semiconductor inspection/test equipment

C-mount 1.2-inch high-resolution design compatible with CMOS sensors with pixel sizes less than 3μm. WD65mm series announced with 0.5x, 0.69x, 1x, and 2x options.

• lens

Overview Capable of multi-purpose applications from research and development to small lot production Offers suggestions based on the intended use by selecting hard contacts, soft contacts, or proximity.

• Other semiconductor manufacturing equipment

Overview Adopts a unique UV optical system optimized for high-precision exposure and a mechanism that can align photomasks and wafers with high accuracy. Fully automatic exposure equipment compatible with vacuum contact, soft contact, and proximity, with custom options available.

• Other semiconductor manufacturing equipment

The "PElR2000HR 20X・50X" is an objective lens that maintains over 80% transmittance at 2000nm. It demonstrates its power in detecting extremely weak emissions caused by current leakage in semiconductor device failure analysis. It allows observation of highly integrated, multi-layered semiconductor devices through infrared light that passes through the silicon from the back of the chip. *Silicon correction is available, so please consult us. 【Features】 ■ Maintains over 80% transmittance at 2000nm ■ Effective in detecting extremely weak emissions ■ Silicon correction available *For more details, please refer to the catalog or feel free to contact us.

• lens
• Other microscopes

The "UV/DUV Plan APO20X・50X" is a long working distance objective lens for bright field observation. It is corrected to focus at wavelengths used in the visible range and near ultraviolet. Designed with high spectral transmittance in the near ultraviolet region, it is optimal for thin film processing such as semiconductor circuit and LCD repairs when used with a microscope and YAG laser. 【Features】 ■ For bright field observation ■ Designed for high spectral transmittance ■ Ideal for thin film processing *For more details, please refer to the catalog or feel free to contact us.

• lens
• Other microscopes

The "MlF Series" is an objective lens designed for use with white light interferometers. Interference fringes corresponding to the height differences of the sample can be obtained through the built-in beam splitter and reference mirror along with the sample image at the focus position. For custom-made products, we will manufacture them after consulting on aspects such as the presence of a shutter and the adjustment method for the reference mirror. We can also provide reference mirrors with reflectivity tailored to the target object. 【Features】 ■ Built-in beam splitter ■ Accommodates height differences of the sample ■ Custom manufacturing available *For more details, please refer to the catalog or feel free to contact us.

• lens
• Other microscopes

The "PE lR Plan Objective Series" is a long working distance, high-resolution objective lens designed for high spectral transmittance in the near-infrared range. It can be used to observe the backside of wafers by transmitting through silicon, or as a lens for photoemission failure analysis. When mounted on our microscope "PS-888L" and used in conjunction with a YAG laser, it can also be utilized for laser repair, among other applications. *It is compatible with LCD glass correction and silicon correction, so please feel free to consult us. 【Features】 ■ Lens for photoemission ■ Long working distance, high-resolution objective lens ■ Usable for laser repair and more *For more details, please refer to the catalog or feel free to contact us.

• lens
• Other microscopes

Compared to halogen light sources, it offers low power consumption (80% reduction compared to conventional sources), a long lifespan (up to 60 times longer), and significantly reduces maintenance labor. It is a next-generation light source that is gentle on both the environment and humans. The light guide with a diameter of φ15mm and a depth of 20mm can be used as is. We offer demo units for loan (availability is limited, so please consult us for timing). For more details, please contact us through the inquiry form.

• Lighting for image processing

1500×1100mm compatible / reviews / image filing / space-saving, cost-effective

• Visual Inspection Equipment

Supports 8th and 9th generation sizes. Achieves high-speed inspection using a mobile multi-eye camera, with a repeatable misalignment inspection accuracy of 3σ below 0.5μ.

• Visual Inspection Equipment

Supports 8th and 9th generation sizes. The use of dedicated lenses for sealant inspection enables high-precision inspections (disconnection detection, line width measurement).

• Visual Inspection Equipment

SPE series / Compatible with 300x400~1250x1100mm local front inspection possible / Rejectable (optional)

• Visual Inspection Equipment

We support sizes from 550X650 up to 5G, 6G, 7.5G, and 8G.

• Other semiconductor manufacturing equipment

Glass, pattern correction through ITO / Class 1 compatible We offer both manual and inline types in our lineup. We will accommodate at a low price.

• Other semiconductor manufacturing equipment

Laser 1064.532.355nm, repetition frequency 1~50Hz, power 0.6~2m/s, supports fully automatic repair with safety modifications of the single plate and address communication.

• Other semiconductor manufacturing equipment

UV type / thermal curing type This is a device compatible with 300mm wafers. It performs parallel alignment of molds, pressurization, UV irradiation, and demolding, achieving high-precision repeat positioning accuracy for step-and-repeat processes. It is ideal as an alternative patterning method for lithography (such as terabyte optical discs, LEDs, microlenses, diffusion films, high-density packages, etc.). It is suitable for both research and development and mass production. Ultra-high precision repeatability accuracy = 20nm

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment

<Features> This is a fully automatic exposure device optimized for LED/crystal devices. It features a high-rigidity design focused on productivity, utilizing stone plates for the base and supports. It has high throughput access with random control via a double-hand robot. It is also equipped with an Orifla aligner.

• Other semiconductor manufacturing equipment
• Wafer processing/polishing equipment

<Features> MLCSP, a dual-side alignment exposure device for C-MOS backside wiring. Equipped with an environment (Foup), compatible with GEM300 and OHT. Spin coater and developer can also be integrated, allowing for fully automated processes from resist coating to exposure and development. Patterning is possible (optional). Automatic reticle exchange (optional).

• Other semiconductor manufacturing equipment
• Wafer processing/polishing equipment

<Features> Provides high-precision patterning and alignment accuracy suitable for prototype mass production.

• Other semiconductor manufacturing equipment
• Wafer processing/polishing equipment

<Features> We provide a manual aligner with high precision and user-friendly design for research and development.

• Other semiconductor manufacturing equipment
• Other surface treatment equipment
• Wafer processing/polishing equipment

<Features> We offer single-sided or double-sided exposure for film devices such as 3D, touch panels, FPC, and OLED.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment
• Other surface treatment equipment

<Features> We offer a lineup of horizontal exposure devices ranging from 2G to 3.5G. Transport is achieved through high-speed shuttle transport or robot transport, contributing to high throughput production. Additionally, we provide high alignment capability for hard-to-see ITO marks and metal-covered marks through our unique optical system, lighting, and image processing. With temperature control of the mask and workpiece, we achieve a total pitch of ±3-5μm.

• Other semiconductor manufacturing equipment
• Wafer processing/polishing equipment
• Other surface treatment equipment

<Features> Supports touch panels from 4.5G (920*730mm) to 6G (1500*1850mm). Provides optimal modes for ITO, OC1, metal, and OC2 processes. Aligns unclear ITO marks and metal-covered marks with high precision using a unique optical system and lighting. Panel transport is vertical, non-contact, and compatible with thin panels. Standard equipped with a mask changer (5-10 sheets) to support clean patterning.

• Wafer processing/polishing equipment
• Other surface treatment equipment
• Other semiconductor manufacturing equipment

<Features> This is a vertical exposure device for masks that minimizes the bending of large panel masks. It performs exposure of multi-faceted, large panels in X-steps with high alignment accuracy. The device features precise temperature control for both the mask and the panel, resulting in a reduced total pitch.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment
• Other surface treatment equipment

The electric revolver is designed to be compact while equipped with an electric Z-axis. It can be used for device integration, observation, and image design measurement, among other applications.

• Optical microscope

This is a series of high-resolution, long working distance plan apochromatic lenses for bright field use.

• Optical microscope

Infinite design, compact tube with a 200mm tube lens.

• Optical microscope

It is a long working distance, high-resolution objective lens designed with a high spectral transmittance in the near-infrared range.

• Optical microscope

Enables sharp laser patterns with high NA!

• Optical microscope

High resolution, low distortion, compact design, and a user-friendly variable magnification telescope for low magnification!

• Optical microscope

Compared to halogen light sources, it offers low power consumption (80% reduction compared to conventional sources), a long lifespan (up to 60 times longer), and significantly reduces maintenance work. It is a next-generation light source that is gentle on both the environment and humans. Existing light guides can be used.

• Lighting for image processing

This is a 5-hole electric revolver for microscopes. The repeat positioning accuracy is ±3μm. It has a non-click structure, which prevents wear and ensures a long lifespan. It is driven by a micro-stepping motor. M.Plan APO objective lenses can be attached, as well as adapters for mounting RMS mount lenses.

• Other optical parts

NUVPlan20X・・・WD12mm、N.A.　0.5 NUVPlan50X・・・WD10mm、N.A.　0.52

• lens

2-beam interference objective lens" "Linnik-type interference objective lens

• Semiconductor inspection/test equipment
• Other image-related equipment
• lens

This is a robot-driven table inspection device designed to accommodate workpieces up to 1250mm x 950mm for the purpose of correcting and inspecting display substrates. It is equipped with an observation microscope for patterning substrates and features the ability to set workpieces on a large XYZ robot table and move to defect locations.

• Semiconductor inspection/test equipment
• Visual Inspection Equipment

* Compatible with 2/3 CCD format. * Telecentric lenses on the object side for all models. * Option to choose between coaxial illumination on/off for each magnification. * Less than 0.1% low distortion across the entire field of view for all models. * All lenses are multi-coated. * C-mount adopts a clamping fixation method for stronger securing. * Standard 20mm filters from Seiwa Optical can be used with the C-mount.

• Other optical parts

【Optical Magnification】1X (both upper and lower) 【Working Distance】47±1mm (upper), 38±1mm (lower) 【Image Formation】Inverted image (upper), upright image (lower) 【Field of View】6.5X4.85mm (both upper and lower)

• Other electronic parts

<PDP-ITO Film Pattern Correction Laser Device> ■Overview The PDP cell repair device automatically corrects defects in the cell panel after lighting inspection by cutting the ITO pattern through the glass, setting the bright spot as the origin. It does not affect the underlying dielectric materials or the pattern. ■Features 1. This device is a laser repair and review system equipped with a bright field microscope on a large stage. 2. It allows for the confirmation of defect locations in the ITO film and image filing. 3. It includes a bright field microscope, objective lens, laser slit with built-in θ (theta) rotation for pattern alignment, a gantry-type XY linear stage (max: compatible with 1380×2300), a monitoring system, a large stage, and a PC system.

• Electron beam lithography equipment
• Laser marker
• Other processing machines

This is a telecentric lens compatible with 2 to 5 million pixel cameras. It is ideal for capturing images with a wide field of view and for high-precision alignment.

• lens

0.7 to 4.5X zoom eyepiece 0.37 to 2.23 low magnification zoom eyepiece These are two types of compact zoom eyepieces.

• lens

It is possible to observe the minute irregularities on the sample surface with enhanced contrast. The Pozazaisa, Analyzer, and Normal-Ski Prism come with a locking mechanism, making them suitable for integration into devices.

• lens