TECHNICAL INFOMATION INSTITUTE CO.,LTD Product Lineup

Book Title: Development of Polymer Materials through Materials Informatics －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of This Book ● Selection of Descriptors and Features! Towards Ensuring Data Quantity and Quality! - Collection of successful and unsuccessful data - Organizing data from internal and external sources such as experimental data, commercial products, and literature information - Preprocessing of noisy image data - Integration of numerical data and language data - Unit conversion, organization of measurement conditions, and documentation by experimenters - Supplementing training data with virtual data - Utilizing transfer learning and enhancing data with limited samples - Points for strengthening and expanding descriptors ● Improving Prediction Accuracy of Learning Models! - Balancing interpretability and reliability - Measures to counteract reduced interpretability due to large data volumes - Optimizing ambiguous variables through dimensionality reduction - Preprocessing explanatory variables and selecting models - Tips for incorporating scale differences into models - Ensuring reproducible data - Building multimodal AI that handles different data types such as molecules, images, and spectra - Adjusting target variables through innovative experimental and evaluation methods ● Ensuring Contradictory Physical Properties through MI, with an Eye on Scale-Up for Material Development! - Securing desired physical properties through inverse analysis

◎What are the key points for integrating materials with different thermal expansion coefficients and elastic moduli? ◎A comprehensive overview of thermal stress countermeasures required in high thermal density environments and composite packaging. －－－－－－－－－－－－－－－－－－－－－ ■Key Points of This Book ◆Design for reduced warping and low thermal expansion of materials ◆Surface treatment and dispersion technology for fillers ◆Reduction of thermal stress using negative thermal expansion materials ◆Evaluation and simulation techniques

Book Title: Development Trends and Reliability Evaluation of Joining Technologies and Materials for Semiconductor Devices －－－－－－－－－－－－－－－－－－－－－ ◎ 3D semiconductors, chiplet integration, SiC power semiconductors, automotive electronic components, microLEDs, etc. This book includes case studies and verification results of new materials and processes aimed at the development of advanced semiconductors! －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of This Book ◎ Joining technologies for miniaturization and heterogeneous integration of advanced semiconductor packages - Application examples of surface-activated bonding in semiconductor device development - Recent development trends and challenges to be addressed in hybrid bonding technology - Surface activation for hybrid bonding and its experimental results - Effectiveness and potential of Cu pillar bonding technology using Ag diffusion bonding - Development of Au-coated Ag bonding wires for the transition to Au-free wire bonding - Principles and mechanisms of ultrasonic bonding and application examples in semiconductor packaging ◎ Joining materials and processes for next-generation power semiconductors to support high-temperature operation - Development of Cu sintering paste and its reliability evaluation - Examination of bonding processes considering the oxidation susceptibility of Cu - Development of new Cu-based solder materials for insulating heat dissipation substrates for power modules