ソフエンジニアリング List of Products and Services

■Rich track record in lift-off and organic peeling processes ■Capable of building systems with wide process margins according to various substrate conditions ■Simultaneous mounting of various peeling/lift-off tools possible Tool selection and combined use possible based on substrate conditions (type/process, etc.) ◎<BLT-type ultrasonic><Horn-type ultrasonic><High-pressure jet><Chemical two-fluid><Multi-spray> ■Equipped with <BLT-type ultrasonic> for low-damage, general-purpose substrate ultrasonic processing ◎BLT-type ultrasonic: Frequency = 38KHz, Vibration amplitude = less than 1μ (P-P) ■Capable of mounting ultra-high amplitude <Horn-type ultrasonic> suitable for robust resist peeling/lift-off ◎Horn-type ultrasonic: Frequency = 38KHz, Vibration amplitude = Max 20μ (P-P) ■Conducting highly uniform ultrasonic processing ◎Standing wave irregularities... theoretically impossible (ultrasonic processing with only direct waves) ◎Irregularities within the ultrasonic vibration surface... strong/weak irregularities above the element (strong) and between elements (weak) are resolved by <substrate rotation> and ultrasonic <scan optimization> ■Application development for burr removal and cleaning after polishing has been implemented *For more details, please refer to the PDF document or feel free to contact us.

■Suitable for various WET processes such as etching, RCA cleaning, and developing ■Ideal for organic stripping/lift-off processes that do not use ultrasound 　◎Compatible with high-pressure jet and spray treatments 　◎When using ultrasound for effective removal of dry-etch residues and burrs during lift-off, the "Spin Dip Processor" is recommended. ■Full process of chemical solution ⇒ rinse ⇒ drying in a single chamber, supporting Dry-In/Dry-Out 　◎Conventional method: 2-chamber configuration (substrate remains in a chemical solution during transfer between chambers) 　◎New method: UDS type uses a 1-chamber configuration. ■Basic operation of the substrate 　◎ "Upper section... LD of the substrate" ⇒ "Lower section... chemical treatment" ⇒ 　　　　　　　　　　　　⇒ "Middle section... rinse and dry" ⇒ "Upper section... ULD of the substrate" ■The patented isolation plate ensures the concentration of the chemical solution during reuse. 　◎Since there is no dilution from rinse water contamination, the chemical solution can be temperature-controlled and reused. *For more details, please refer to the PDF document or feel free to contact us. Wafer, batch-type cleaning equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, resist stripping equipment, resist coating equipment, cleaning equipment, megasonic, photoresist, photolithography process.

This device is equipped with a variety of tools, including [horn-type ultrasonic], [BLT-type ultrasonic], [high-pressure jet nozzle], and [spray nozzle], to support demonstrations of organic lift-off for various substrate surface conditions. It can accommodate various sizes, substrate types, and device pattern states with an in-house demonstration machine. Furthermore, we will incorporate the insights and know-how gained to customize the implementation device into an optimal form. *For more details, please refer to the PDF materials or feel free to contact us. Wafer, batch-type cleaning equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, resist stripping equipment, megasonic, cleaning equipment, photoresist, photolithography process, silicon, batch substrate cleaning machine, batch spin cleaning machine, surface treatment, thin wafer, insulating film, high-pressure jet cleaning machine, substrate cleaning equipment, load lock chamber, glass transport, glass substrate, wafer cleaning machine.

The device is a dedicated single-wafer processing equipment designed to address various issues such as the re-adhesion contamination of a large amount of peeling metal debris generated during the lift-off process. In the peeling dip tank, a combination of downflow/QDR/spray/shower/side US/swing is used, while the cleaning and drying spin single-wafer chamber employs special nozzles/MS rinse/HP-Jet, achieving high-efficiency and uniform short-time lift-off without re-adhesion dirt, resulting in a high-purity substrate surface. 【Features】 ■ Usable for organic peeling as well ■ Significant reduction in filter load with cyclone and composite mesh ■ Over 10 years of delivery records with numerous units supplied to major electronic component manufacturers ■ This system can be replaced with the new "Spin/Dip type" or "UDS type" *For more details, please refer to the PDF materials or feel free to contact us. Wafer, single-wafer cleaning equipment, coating and developing equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, semiconductors, resist stripping equipment, megasonic cleaning equipment, cleaning equipment, resist, photoresist, wafer cleaning equipment, wafer cleaning machines, loaders, unloaders.