ソフエンジニアリング List of Products and Services

■Suitable for various WET processes such as etching, RCA cleaning, and developing ■Ideal for organic stripping/lift-off processes that do not use ultrasound 　◎Compatible with high-pressure jet and spray treatments 　◎When using ultrasound for effective removal of dry-etch residues and burrs during lift-off, the "Spin Dip Processor" is recommended. ■Full process of chemical solution ⇒ rinse ⇒ drying in a single chamber, supporting Dry-In/Dry-Out 　◎Conventional method: 2-chamber configuration (substrate remains in a chemical solution during transfer between chambers) 　◎New method: UDS type uses a 1-chamber configuration. ■Basic operation of the substrate 　◎ "Upper section... LD of the substrate" ⇒ "Lower section... chemical treatment" ⇒ 　　　　　　　　　　　　⇒ "Middle section... rinse and dry" ⇒ "Upper section... ULD of the substrate" ■The patented isolation plate ensures the concentration of the chemical solution during reuse. 　◎Since there is no dilution from rinse water contamination, the chemical solution can be temperature-controlled and reused. *For more details, please refer to the PDF document or feel free to contact us. Wafer, batch-type cleaning equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, resist stripping equipment, resist coating equipment, cleaning equipment, megasonic, photoresist, photolithography process.

The device achieves complete separation and reuse of chemical solutions, and is a manual Spin single-wafer processing device capable of handling the full process of chemical treatment ⇒ rinsing ⇒ drying in one spin. It significantly reduces footprint and costs, and is already patented. It can accommodate not only round substrates but also square-shaped substrates. It has a proven track record in various process treatments such as "RCA," "developing," "etching," "cleaning," "stripping," and "lift-off." 【Features】 ■ It is possible to consolidate various chemical treatment processes such as cleaning and etching into a single total system. ■ It can significantly reduce equipment purchase costs and footprint. ■ Since transfer between chambers is unnecessary, it reduces workpiece attachment and detachment, streamlining operations and preventing transport accidents, thereby improving transport reliability. *For more details, please refer to the PDF document or feel free to contact us. Wafer, single-wafer cleaning device, coating and developing device, substrate cleaning device, spin cleaning device, semiconductor manufacturing equipment, semiconductor, resist stripping device, megasonic, cleaning device, resist, photoresist, photolithography process, silicon, scrub cleaning device, scrub cleaning, wafer stripping device, wafer cleaning device, wafer cleaning machine.

- Suitable for various WET processes such as etching, RCA cleaning, and developing. - A full process of "chemical solution ⇒ rinse ⇒ drying" is handled in a single chamber with Dry-In/Dry-Out. - Conventional method: 2-chamber configuration (the substrate remains in contact with the chemical solution during transfer between chambers). - New method: UDS type uses a 1-chamber configuration. - Basic operation of the substrate: - "Upper section… Substrate LD" ⇒ "Lower section… Chemical treatment" ⇒ - "Middle section… Rinse drying" ⇒ "Upper section… Substrate ULD" - The patented isolation plate ensures the concentration of the chemical solution during reuse. - There is no dilution from rinse water contamination. - For example, it can accommodate "Lower section… SPM treatment" and "Middle section… APM/MS." - The patented isolation plate completely separates and prevents the scattering of chemical gases and mists in the lower treatment section. - Chemical solution/rinse treatment can be performed on the backside of the substrate, ensuring it is contamination-free. - Shortening the manufacturing process significantly increases production efficiency and can greatly reduce cleanroom occupancy area. - A seamless process of etching ⇒ stripping is possible within a single system device. *For more details, please refer to the PDF document or feel free to contact us.*

- Ideal for etching and cleaning processes. - Chemical treatment is done using a spin method, and rinse drying is done using a conveyor method. - Proven track record of high throughput support with W-lane configuration. - Measures against hazardous corrosive gases during etching: ◎ Equipped with front and rear shutters and rollers in the spin chamber. - Features temperature control circulation and reuse function for chemicals, as well as concentrated/diluted separation function for wastewater. - Swing spray function during rinsing can also be installed. - Up and down air knife drying designed to prevent reattachment of rinse water splashes. *For more details, please refer to the PDF document or feel free to contact us. Wafer, batch-type cleaning equipment, coating and developing equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, semiconductors, resist stripping equipment, megasonic, cleaning equipment, resist, photoresist, photolithography process, silicon, scrub cleaning equipment, scrub cleaning, wafer stripping equipment, wafer cleaning equipment, wafer cleaning machine.

This is an introduction to a device that performs a series of patterning processes, including developing, etching, rinsing, and drying, using a conventional spin method. Depending on the substrate type, it allows for the selection of spray or paddle recipes during the developing and etching processes, and it can also improve uniformity through speed control during scanning. This machine is low-cost and has a wealth of experience with numerous users, but the process for recycling requires a two-chamber setup. If proper separation of waste liquid, drainage, and exhaust is necessary, we will respond with a new type of UDS device. *For more details, please refer to the PDF materials or feel free to contact us.*