ソフエンジニアリング List of Products and Services

■ This is a cassette-type batch processing device. ■ Ideal for batch processing compatible with RCA processes such as APM/MS, SPM, HPM, and DHF. ■ Also supports substrate regeneration processes such as organic stripping and Poly-Si regeneration. ■ Proven capability for anisotropic etching such as MEMS. ■ Achievements up to 300mm. ■ Compatible with various drying units including S/D, IPA vapor drying, and hot water lift drying. ◎ The IPA vapor drying features a watermark suppression function. ■ For recent demands of "small quantity and diverse variety," we recommend the latest UDS spin processor as a spin single wafer. ◎ Throughput improvement is achieved by multi-chamber configuration of the UDS chamber. *For more details, please refer to the PDF document or feel free to contact us. Wafer, substrate cleaning equipment, semiconductor manufacturing equipment, semiconductor, resist stripping equipment, megasonic, low-cost, cleaning equipment, automatic cleaning machine, resist, batch cleaning equipment, silicon, etching equipment, RCA cleaning, insulating film, film formation, ceramic, loader unloader.

The device achieves complete separation and reuse of chemical solutions, and is a manual Spin single-wafer processing device capable of handling the full process of chemical treatment ⇒ rinsing ⇒ drying in one spin. It significantly reduces footprint and costs, and is already patented. It can accommodate not only round substrates but also square-shaped substrates. It has a proven track record in various process treatments such as "RCA," "developing," "etching," "cleaning," "stripping," and "lift-off." 【Features】 ■ It is possible to consolidate various chemical treatment processes such as cleaning and etching into a single total system. ■ It can significantly reduce equipment purchase costs and footprint. ■ Since transfer between chambers is unnecessary, it reduces workpiece attachment and detachment, streamlining operations and preventing transport accidents, thereby improving transport reliability. *For more details, please refer to the PDF document or feel free to contact us. Wafer, single-wafer cleaning device, coating and developing device, substrate cleaning device, spin cleaning device, semiconductor manufacturing equipment, semiconductor, resist stripping device, megasonic, cleaning device, resist, photoresist, photolithography process, silicon, scrub cleaning device, scrub cleaning, wafer stripping device, wafer cleaning device, wafer cleaning machine.

This is an introduction to a device that performs a series of patterning processes, including developing, etching, rinsing, and drying, using a conventional spin method. Depending on the substrate type, it allows for the selection of spray or paddle recipes during the developing and etching processes, and it can also improve uniformity through speed control during scanning. This machine is low-cost and has a wealth of experience with numerous users, but the process for recycling requires a two-chamber setup. If proper separation of waste liquid, drainage, and exhaust is necessary, we will respond with a new type of UDS device. *For more details, please refer to the PDF materials or feel free to contact us.*

■ Ideal for "prototype development," "alternative to manual cleaning," "labor-saving," and "quality improvement," etc. ■ Unlike manual cleaning, it achieves a high level of surface quality without variation. ■ Achieves both improved base quality and reduced cleaning labor costs. 　◎ For example, operating four tabletop cleaning machines with one worker at a low labor cost. ■ Optimal for processing Si, SiC, GaN, sapphire, GaAs, LT, etc. ■ Compatible with round substrates as well as square shapes like Cr masks. 　◎ Max size: Φ20mm, 6 inches square. ■ The basic processing sequence is "detergent/scrub ⇒ DIW two-fluid ⇒ front and back rinse ⇒ spin dry." 　◎ Scanning rotation function is standard during scrubbing and two-fluid processing. 　◎ Excellent particle removal performance with the DIW two-fluid tool. 　◎ Choose between nylon brush or PVA brush depending on the substrate surface condition. ■ Options available for <automatic detergent dilution unit> and <CO2 ionizer>. *For more details, please refer to the PDF document or feel free to contact us.*