TECHNOVISION, INC. List of Products and Services

The wafer mount / tape mount is a tape application device that instantly adheres "wafers," "dicing frames," and various films/tapes without bubbles. It allows for the easy application of uniform tape to wafers, which is considered important in the dicing process. TechnoVision's wafer mount offers a wide range of equipment options tailored to various purposes, from research and development to semi-production applications. The manual type wafer mount is available in three work sizes: - 300mm (12 inches) - 200mm (8 inches) - 150mm (6 inches) (Free demo units are also available for loan.) Additionally, there are devices with specifications tailored for specific applications, such as dicing and back grinding. The application targets are not limited to wafers; the device can accommodate various workpieces such as packages, glass, ceramics, and more. Custom solutions can also be flexibly provided to meet users' special specifications.

The PFM-9008 is a manual wafer mount for pre-cut tape. While expensive specialized equipment was previously required for applying pre-cut tape, this can now be done with a simple manual machine. It is ideal for R&D and small quantity applications.

A semi-automatic tabletop type small tape applicator compatible with 12 inches (300mm) tape. It is the optimal tape applicator that can accommodate the diverse conditions of tape application and lamination. This device responds to customers who wish to "automate the crucial application process" even with a manual device, and further "set application conditions and quantitatively manage application quality!" Even inexperienced operators can perform application tasks with stable quality, similar to that of skilled workers.

The operator will only handle the setting and removal of the work, and all subsequent tasks will be fully automated. This will contribute to the stability of the tape/film application process and improve yield.

The FM-664 series has been developed as a device that can accommodate both pre-cut tape and normal tape. Two types of wafer sizes are available: ■ FM-6648: Up to 8 inches ■ FM-6643: Up to 12 inches This device can instantly attach various tapes to silicon wafers and dicing frames without bubbles. It has been developed to support both pre-cut tape and normal tape. It can be used not only as a dedicated device for pre-cut tape or normal tape but also as a versatile device that can handle the applications listed below.

The "Tape Mount Handbook" is a technical document from Techno Vision, which develops and sells semiconductor manufacturing equipment, cleaning equipment, and post-process assembly equipment. This document includes an overview of the "Tape Application Process in the Dicing Process," as well as solutions to issues and details about the equipment. [Contents (partial)] ■ Overview ■ Tape Application ■ In the case of manual application ■ If you are already using a tape mount ■ Techno Vision manufactured mount *For more details, please refer to the PDF document or feel free to contact us.

The "Vacuum Mounter" is a vacuum film application device designed for workpieces that should not be subjected to stress. It solves the problem of damage caused by rollers. By applying with vacuum, bubbles do not enter the workpiece, and the application conditions (vacuum level, pressure) can be adjusted. Please consult us for a demo test. 【Features】 ■ Compatible with workpieces that should not be subjected to stress ■ Solves the problem of damage caused by rollers ■ No bubbles enter the workpiece ■ Application conditions can be adjusted *For more details, please refer to the PDF document or feel free to contact us.