TECHNOVISION, INC. Product Lineup

The wafer mount / tape mount is a tape application device that instantly adheres "wafers," "dicing frames," and various films/tapes without bubbles. It allows for the easy application of uniform tape to wafers, which is considered important in the dicing process. TechnoVision's wafer mount offers a wide range of equipment options tailored to various purposes, from research and development to semi-production applications. The manual type wafer mount is available in three work sizes: - 300mm (12 inches) - 200mm (8 inches) - 150mm (6 inches) (Free demo units are also available for loan.) Additionally, there are devices with specifications tailored for specific applications, such as dicing and back grinding. The application targets are not limited to wafers; the device can accommodate various workpieces such as packages, glass, ceramics, and more. Custom solutions can also be flexibly provided to meet users' special specifications.

The FM-664 series has been developed as a device that can accommodate both pre-cut tape and normal tape. Two types of wafer sizes are available: ■ FM-6648: Up to 8 inches ■ FM-6643: Up to 12 inches This device can instantly attach various tapes to silicon wafers and dicing frames without bubbles. It has been developed to support both pre-cut tape and normal tape. It can be used not only as a dedicated device for pre-cut tape or normal tape but also as a versatile device that can handle the applications listed below.

The operator will only handle the setting and removal of the work, and all subsequent tasks will be fully automated. This will contribute to the stability of the tape/film application process and improve yield.

A semi-automatic tabletop type small tape applicator compatible with 12 inches (300mm) tape. It is the optimal tape applicator that can accommodate the diverse conditions of tape application and lamination. This device responds to customers who wish to "automate the crucial application process" even with a manual device, and further "set application conditions and quantitatively manage application quality!" Even inexperienced operators can perform application tasks with stable quality, similar to that of skilled workers.

The PFM-9008 is a manual wafer mount for pre-cut tape. While expensive specialized equipment was previously required for applying pre-cut tape, this can now be done with a simple manual machine. It is ideal for R&D and small quantity applications.

The EX series "Wafer Expander" is a tape expansion device that stretches fully cut wafers along with the dicing tape on an expansion stage, uniformly widening the chip spacing/street width to the appropriate dimensions. By employing a motor for the drive of the expansion stage, it allows for numerical management of the expansion stroke and speed. It also comes standard with an auto-cut function. Techno Vision offers various wafer expanders, including basic models, motor-driven expanders compatible with 12-inch wafers, and expanders with auto-cut functions, allowing for selection based on requirements. After expansion, the grip ring (automatically clamping the inner and outer rings) maintains the expanded state of the tape.

Achieving the "excellent workability" sought by operators! This is a model of a wafer expansion device equipped with an automatic cutting function that was not available in conventional devices. The task of separating the excess film (dicing frame) that has been done until now will change to "just pressing a switch." The EX series "Wafer Expander" is a tape expansion device that can uniformly stretch fully cut wafers along with the dicing tape on the expansion stage, adjusting the chip spacing/street width to the appropriate width. By adopting a motor for the drive of the expansion stage, it is possible to manage the numerical values of the expansion stroke and expansion speed. Additionally, it comes standard with an auto-cut function. Technovision offers various wafer expanders, including basic models, motor-driven expanders compatible with 12-inch wafers, and expanders with auto-cut functions, allowing for selection based on requirements. After expansion, the grip ring (automatic clamping of the inner and outer rings) maintains the expanded state of the tape.

The motor-driven expander is a device that uses an electric motor for the driving mechanism to raise the expansion stage. This device is a wafer expander that employs a motor-driven method with higher precision and excellent repeatability, and it is compatible with 12-inch wafers, known as the "EX-300." *Support for up to 8 inches is also available. The EX series "wafer expander" is a tape expansion device that stretches fully cut wafers along with the dicing tape on the expansion stage, allowing for uniform widening of chip spacing and street width to appropriate dimensions. By using a motor for the drive of the expansion stage, it enables numerical management of the expansion stroke and expansion speed. It also comes standard with an auto-cut function. Techno Vision offers various wafer expanders, including basic models, motor-driven expanders compatible with 12-inch wafers, and expanders with auto-cut functions, allowing for selection based on requirements. After expansion, the grip ring (automatically clamping the inner and outer rings) maintains the expanded state of the tape.

This is a UV film curing device that uses LED light sources. It can maintain the same level of equipment pricing as conventional devices while reducing running costs to less than one-tenth. Compared to mercury lamps and metal halide light sources, it achieves a better level of curing performance (cured state, curing speed). Additionally, this device supports modularization for custom specifications, including bottom and top irradiation, as well as applications for device integration.

By adopting a high-output LED driver developed independently by Techno Vision, an irradiation output of 250mW/cm2 (at a 10mm work distance) has been achieved. The light source uniformly irradiates the workpiece while performing a reciprocating scan. Numerous benefits can be obtained, such as reduced thermal damage to the workpiece due to room temperature irradiation, low power consumption, long lifespan, and safety during light source replacement.

A UV film curing device that enables uniform irradiation across the entire area of the wafer by rotating the workpiece during irradiation.

The 【Model UVC-512】 is a device capable of emitting ultraviolet light at a specific wavelength (365nm). By irradiating UV (ultraviolet) curing type films, it allows for easy separation of chips from the tape after dicing. This device rotates the workpiece during irradiation, making it compact and lightweight, as the length of the light source fits within the radius of the workpiece, while also enabling uniform irradiation across the entire area of the workpiece. It is a UV film curing device / UV irradiation device.

This is a double ring that can hold elastic films, fabrics, and papers between an inner ring (white) and an outer ring (black), maintaining a taut and pinned state. It is a bidirectional grip ring that does not have a specific orientation for fitting. It can be easily removed after use and can be reused multiple times.

The "Grip Ring Case" can hold one wafer fitted/attached to a grip ring or dicing frame. It is stackable, allowing for space-saving storage. It is suitable for transporting, shipping, and storing prototypes or small quantities. 【Features】 - Can hold one grip ring or dicing frame - Wafer is non-contact - Stackable for space-saving storage - Made of conductive PP - Ideal for transporting, shipping, and storing prototypes or small quantities *For more details, please refer to the PDF document or feel free to contact us.

The "TV-150/TV-200/TV-300" is a standard type of vacuum mount that attaches wafers to dicing tape in a vacuum environment. By performing the attachment process inside a vacuum chamber, it suppresses the retention of air bubbles, which can be problematic in atmospheric attachment, and achieves uniform and highly reproducible attachment quality across the entire wafer surface. It is a compact, versatile model that can accommodate a wide range of processes. TV-150: 150mm (6 inches) TV-200: 200mm (8 inches) TV-300: 300mm (12 inches)

The "TV-200H/TV-300H" is a heated vacuum mount that combines a vacuum adhesion method with a heating function. By heating the adhesion stage, it stabilizes the properties of the adhesive tape, and through the synergistic effect with vacuum adhesion, it achieves a more uniform and reproducible mounting quality. This model is suitable for processes where temperature conditions affect adhesion quality and for applications where process variation needs to be minimized. 【Supported Wafer Sizes】 TV-200H: 200mm (8 inches) TV-300H: 300mm (12 inches)

The "TV-200TH" is a vacuum mount that combines a membrane bonding method compatible with TAIKO(R) wafers and a heating function. By applying radial bonding in a vacuum environment, it suppresses stress concentration on the unique outer edge steps and thin sections of TAIKO(R) wafers, and by stabilizing the properties of the adhesive tape with a heated chuck, it achieves high bonding uniformity and reproducibility. This is the top model designed for processes with high difficulty, such as thin wafers and high-value-added devices. 【Compatible wafer size】 TV-200TH: 200mm (8 inches) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

The "TV-200T" is a vacuum mount designed to accommodate wafers with step or special shapes on the outer edge, such as TAIKO(R) wafers and thin wafers. By adopting a bonding method using a top membrane, it achieves "radial bonding," which uniformly applies tape from the center of the wafer outward. This helps to suppress stress concentration and uneven bonding on the outer edge specific to TAIKO(R) wafers, providing stable mounting quality. 【Compatible Wafer Size】 TV-200T: 200mm (8 inches) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.