日精 Product Lineup

The "IP1212L" is a fully-fledged compact inkjet coating device designed for mass production, capable of both full and partial coating. All devices in the series can form thin films as well as thick films with a single pass coating. By applying multiple coatings, it can accommodate even thicker film formation. It is a model that can be used in a wide range of fields, compatible with conductive inks, insulating inks, resist inks, UV inks, and more. 【Features】 - Usable with various resist inks, polyimide inks, UV inks, and other functional materials - Coating area up to 120×120mm - High-speed coating possible at up to 500mm/second - Options available for automatic nozzle cleaning and more - Device size: 1400W×1200D×2015H mm *For more details, please refer to the PDF materials or feel free to contact us.

• Painting Machine
• Other surface treatment equipment

This product is an inline-compatible heating furnace that can be integrated into fully automated production lines. It takes substrates and trays from the loader, transports them to the heating stage through sheet processing, and heats them up. It adopts a heating method that utilizes efficient thermal conduction, making it an energy-saving and space-saving heating furnace. 【Features】 ■ Can be integrated into fully automated production lines ■ Inline compatible ■ Adopts a heating method utilizing efficient thermal conduction ■ Excellent energy-saving and space-saving properties *For more details, please refer to the PDF document or feel free to contact us.

• Heating device
• Drying Equipment
• others

This product is an inline-compatible heating furnace that can be integrated into a fully automated production line. It is a heating furnace that uses the furnace itself as the heat source, without using hot air, resulting in energy-saving features that minimize heat loss and temperature rise in the surrounding environment. It excels in heat uniformity and allows for long heating times without overshoot. The substrate and tray are taken from the loader and transported to individual furnace chambers for heating through sheet processing. The number of furnace chambers is set based on the tact time, heating time, and heating hold time, making it an energy-efficient heating device without waste. It supports traceability, allowing for management of heating time and temperature on a work unit basis. We provide a fully automated heating device that contributes to space-saving of the heating furnace, with the option to discharge to the next process after heating or store in a cooling stage or magazine. 【Features】 ■ Excellent heat uniformity ■ Capable of long heating times ■ Time management for each furnace chamber ■ Contributes to space-saving of the heating furnace ■ Contributes to energy savings in the heating process *For more details, please refer to the PDF document or feel free to contact us.

• Heating device

An inkjet equipment manufacturer boasting a wealth of delivery achievements in the semiconductor and electronic device fields, starting with the display sector. They offer a top-class lineup of equipment ranging from small devices for experiments and prototypes to large inkjet systems for mass production. All inkjet devices in the series can form thin films as well as thick films with 1-pass coating. The 'IP2030L' model, shown in the photo, enables high-resolution patterning and both partial and full coating. It is equipped with a uniquely developed liquid delivery system and discharge control technology, significantly improving ink usage efficiency. It is also a versatile machine that can be used in a wide range of fields, including compatibility with particle-containing inks. 【Features】 ■ Coating resolution: up to 2400 dpi (scanning) ■ Coating area: up to 300 x 300 mm ■ High-speed coating specification at up to 300 mm/second ■ Equipment size: 1200W x 1200D x 2025H mm (compact design) ■ Options available include print head expansion, UL LED curing unit, CAD conversion tools, and more. *For more details, please refer to the PDF document or feel free to contact us.

• Painting Machine

This series is a basic type of dust removal device used in various processes. We offer models ranging from 2 to 5 units, suitable for both inline and outline applications. The lineup includes the "RY-705B," which features a non-contact magnetic gear for the drive gear, and the "RY-505Z," a two-unit clean roller type with cleaning on both the upper and lower sides. We accommodate various customer requests for sheet products and roll-to-roll lines. 【Features】 ■ Clean Roller RY-705B - Employs a non-contact magnetic gear for the drive gear - A revolutionary clean roller that eliminates dust generation from within the device ■ Clean Roller RY-505Z - Arranges two clean rolls on both the upper and lower sides to double the dust removal effect - Ideal for surface dust removal of products before the lamination process or exposure process in automatic lines ■ Customized Products - Designed and manufactured to fit the customer's work size * We also accept demo evaluations to determine if removal is possible with samples provided. * For more details, please refer to the PDF materials or feel free to contact us.

• Printed Circuit Board

The mass production ultrasonic dicing device "CSX501" is a dicing machine that cuts difficult materials such as SiC, GaN, and fine ceramics with high speed and precision. The ultrasonic-assisted cutting with "CSX501" adds ultrasonic assistance to the "force generated by the rotation of the blade," allowing the blade to "vibrate in the outward direction" while cutting. This technology enables the achievement of improved throughput, reduced running costs, and increased yield while maintaining high-quality cutting. Furthermore, the addition of device monitoring functions allows for remote support, contributing to a reduction in recovery time from unexpected troubles. Additionally, by equipping various optional functions, it also contributes to the control of blade edge shapes and the reduction of cutting burrs. *We also conduct evaluations by cutting sample work upon request, so please feel free to contact us. *For more details, please refer to the PDF materials.

• Ultrasonic Oscillator
• Other cutting tools
• Other processing machines

We would like to introduce the "Thin Plate Compatible Clean Roller." The "RY-1106 Series" utilizes a new type of clean roll with a small diameter, making it possible to remove dust from thin plates and films. Additionally, by adopting a magnetic gear in the drive section of the device, we suppress minute dust generation from the gear part. We also offer the "RFC-705A" and "RF-705A." 【Features】 ■ Prevents dropping ■ Clean roll that prevents entanglement ■ Uses magnetic gear in the drive section ■ Capable of cleaning 50μm workpieces ■ Customized products Designed and manufactured to fit the customer's work size * We also accept demo evaluations to determine if removal is possible with samples provided. * For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• LCD display
• Other semiconductor manufacturing equipment

Adwells contributes to the advancement of technology development aimed at energy saving, electrification, and weight reduction in electronics products, automobiles, and industrial equipment through ultrasonic joining devices that enable room temperature, short time, and dissimilar metal joining.

• aluminum
• Secondary Cells/Batteries

We propose customized unit rollers tailored to your needs. We accommodate various specifications for roll-to-roll lines and vertical path lines, as well as designs for fixed installation units in line equipment. Our solutions are ideal for dust removal from films, substrates, and glass panels. 【Features】 - Manufactured to order according to customer requirements. - Capable of responding to various requests for installation and mounting in existing lines and equipment. - We can produce unit rollers up to 2,600mm based on our track record. - Suitable for long products in raw material processes and slitting processes. - Enhanced structural strength improves adhesion to products, allowing for high-speed flow rates of up to 250m/min. *We also accept demo evaluations to determine if removal is possible with samples provided. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• LCD display
• Secondary Cells/Batteries

I thoroughly explained the mechanism, advantages and disadvantages of flux acid reduction, as well as actual case studies of its application.

• Annealing furnace

A variety of high-performance materials are being developed to improve product performance in a wide range of applications, including electronics. Cutting technologies that maximize the properties of these materials are in demand. Adwell's ultrasonic cutter contributes to the development and manufacturing technology of electronic products and resin/rubber products.

• Capacitor

◆Advantages of Non-Contact Type It enables cleaning of delicate materials that you want to avoid contact with, as well as uneven surfaces that are difficult to clean with contact methods (especially rollers). Additionally, because it is non-contact, it minimizes the impact on the workpiece. ◆Low Running Costs Due to the dry cleaning method, there is no need for water or chemical solution replacement, nor for expensive infrastructure development. Furthermore, the main consumable is just the filter, achieving low running costs. ◆Applications: Dust removal and foreign matter removal in the manufacturing processes of printed circuit boards, metal foils, PET films, etc. Dust removal devices, including clean rollers, have a proven track record of delivery in over 20 countries, both domestically and internationally. ◆Catalog The "Clean Roller Dust Removal Device Comprehensive Catalog" is a compilation of clean rollers and cleaners. 【Contents】 ◆ Clean Roller (Standard) ◆ Non-Contact Cleaner "RD series" ◆ Wiping Cleaner "SKF series" If you have any concerns regarding "deburring," "dust collection and removal," or "trash and dirt," please feel free to contact us. We also accommodate custom products. *For more details, please contact us or download the PDF to view.

• Printed Circuit Board
• lens
• LCD display

Technological development is underway to promote the use of CFRTP in automobiles, airplanes, wind power generation, and industrial equipment, where lightweight structures are required. At Adwells, we contribute to the technological advancement of CFRTP products through ultrasonic application devices that can be applied to the manufacturing of CFRTP materials, intermediate processed products, and final products.

• Secondary Cells/Batteries
• Plastic processing machines (cutting and rolling)

Amsonic Hamo is highly regarded for its quality and complete cleaning process. Our systems can be easily integrated into your manufacturing line in a space-saving manner, and the transition from manual to automatic cleaning simplifies operations, allowing for reductions in labor costs and minimizing the consumption of utilities such as cleaning water and detergents. The high potential of the equipment itself, along with minimized utility consumption and operating time, contributes to improving your productivity. 【Features】 ■ Validated cleaning process ■ Customized cleaning racks ■ Individually designed cleaning systems ■ High energy efficiency ■ High-spec equipment specifications that do not generate residual water *For more details, please refer to the PDF materials or feel free to contact us.

• Other cleaning machines

This is a device for performing visual inspections of power device ceramic substrates for defects such as burrs, chips, cracks, scratches, dirt, discoloration, solder overflow, foreign objects, and bulging/denting on both the front and back surfaces. By setting magazines or trays containing the ceramic substrates and operating the device, visual inspections of the front and back surfaces of the ceramic substrates are conducted, and based on the inspection results, sorting into good and defective products is performed. 【Features】 ■ Detection of "bulging" and "denting" defects through high-density 3D inspection ■ Realization of an optimal lighting environment using multi-angle lighting ■ High-speed inspection achieved with fast lighting switching and rapid image capture ■ Capable of inspecting both the front and back surfaces *For more details, please refer to the PDF document or feel free to contact us.

• Visual Inspection Equipment
• Other inspection equipment and devices
• Automatic sorting machine

The "CB-505" supports various packages (*1) and various bonding processes (*2) due to its highly versatile device concept. *1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. *2 ACF, ACP, NCF, NCP, ultrasonic, etc. *For more details, please refer to the PDF materials or feel free to contact us.

• Bonding Equipment

Nissei responds to customers who need to integrate antennas into their equipment with multi-antenna technology. Nissei's multi-antenna technology enables the creation of custom antennas that can meet customer demands for high-gain and wideband antennas in a short delivery time. 【Features】 ■ High Gain: By combining multiple antennas of the same frequency to operate as a single antenna, high-gain antennas are achieved. ■ Wideband: By combining antennas from multiple bands, wideband antennas are realized. ■ Short Delivery Time: With a proven track record of obtaining telecom certifications from mobile operators, we can respond to customer demands in a short delivery time, contributing to reduced development costs. *For more details, please refer to the catalog or feel free to contact us.

• antenna

SMARTRAC and Nissei's carefully selected RFID tags - Best Selection. High-performance products that also offer large capacity. Ideal for applications on materials with high dielectric constants such as cardboard, plastic, and glass. 【Features】 ○ High performance ○ High quality ○ Global compatibility ○ Low price ○ Stable supply * Additionally, we also offer experiments, demonstrations, equipment rentals, and testing! Please feel free to contact us.

• IC tag reader/writer
• IC tag

The "VPO-1000-300" is a tabletop vacuum process high-speed heating furnace that is suitable for research and development as well as prototype development, and is among the smallest in the industry. It supports Φ12-inch, Φ6-inch, and 4-inch sizes, and allows for the processing of small sample pieces with a dedicated susceptor. With a maximum temperature of 1000°C, it accommodates a variety of gas purge environments. It can be used for the crystal growth of new materials such as GaN and SiC, as well as for the sintering of paste materials, making it versatile. 【Features】 ■ Supports nitrogen gas, oxygen gas, forming gas (hydrogen + nitrogen) purging, as well as high-concentration hydrogen gas purging. ■ Equipped with 24 IR (infrared) heaters for precise high-speed heating. ■ High-purity quartz chamber. ■ Cooling compatible with nitrogen gas purging method. ■ Up to 4 process gas lines (MFC). ■ Achieves a vacuum level of 0.1 Pa (10^-3 Pa possible with HV model equipped with TMP). ■ Standard touch panel monitor for easy operation. *For more details, please refer to the PDF document or feel free to contact us.

• Soldering Equipment
• Heating device

The "RTP-150" is a tabletop vacuum process rapid heating furnace that is suitable for research and development as well as prototype development, classified as one of the smallest in the industry. It supports a maximum temperature of 1000°C and accommodates a variety of gas purge environments. It can be used for various purposes, including crystal growth of new materials such as GaN and SiC, as well as sintering of paste materials. 【Features】 ■ Supports nitrogen gas, oxygen gas, forming gas (hydrogen + nitrogen) purging, as well as high-concentration hydrogen gas purging. ■ Enables precise rapid heating with 24 IR (infrared) heaters on the top and bottom. ■ High-purity quartz chamber. ■ Supports cooling using nitrogen gas purging method. ■ Up to 4 process gas lines (MFC). ■ Achieves vacuum levels of 10^-1 Pa (10^-3 Pa possible with HV model equipped with TMP). ■ Standard touch panel monitor for easy operation. *For more details, please refer to the PDF document or feel free to contact us.

• Soldering Equipment
• Heating device

The "RTP-100" is a tabletop vacuum process rapid heating furnace that is suitable for research and development as well as prototype development, and is among the smallest in the industry. It supports 4-inch wafers and allows for the processing of small samples using a dedicated susceptor. With a maximum temperature of 1200°C, it accommodates a variety of gas purge environments. It can be used for various purposes, such as crystal growth of new materials like GaN and SiC, and sintering of paste materials. 【Features】 - Supports nitrogen gas, oxygen gas, and forming gas (hydrogen + nitrogen) purging, as well as high-concentration hydrogen gas purging. - Enables precise rapid heating with 18 IR (infrared) heaters on the top and bottom. - High-purity quartz chamber. - Supports cooling through nitrogen gas purging. - Up to 4 process gas lines (MFC). - Achieves a vacuum level of 10^-1 Pa (10^-3 Pa possible with the HV model equipped with TMP). - Comes standard with a touch panel monitor for easy operation. *For more details, please refer to the PDF document or feel free to contact us.

• Soldering Equipment
• Heating device

The "AZ9T/AZ9C" is a microscope that achieves a working distance (WD) of 90 mm, an optical 10x zoom, and a resolution of 3 μm. During profile execution, it has previously been difficult to confirm the status of objects within the chamber. By attaching this product to the "viewing window" standardly equipped on the reflow unit and connecting it to the main unit, you can observe the melting of solder in real-time. Additionally, with a working distance (WD) of 90 mm, it captures sharp and clear images even when passing through the glass of the viewing window (10 mm thick). Furthermore, data can be saved to a PC not only as still images but also as videos. 【Features】 ■ Real-time observation of solder melting ■ Sharp and clear imaging even when passing through the glass of the viewing window (10 mm thick) ■ Data can be saved to a PC as still images or videos *For more details, please refer to the PDF document or feel free to contact us.

• Microscope
• Other microscopes

The "RSS-110-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean, void removal, and lead-free processes. It supports traditional "flux," "hydrogen reduction," and reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability even without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace applications. 【Features】 ■ Rapid heating at 2°C per second, significantly reducing takt time due to water cooling ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly exact realization of the set temperature profile High repeatability with almost zero overshoot ■ Minimal in-plane temperature difference on the heating plate, allowing uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

• Soldering Equipment
• Reflow Equipment

The "RSS-160-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean flux, void removal, and lead-free processes. In addition to conventional "flux" and "hydrogen reduction," it also supports reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. Despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to support a wide range of prototype development. 【Features】 ■ Rapid heating at 100°C per minute, and with water cooling, significantly reduces takt time ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly achieves the set temperature profile as is, with high repeatability and almost zero overshoot ■ The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

• Soldering Equipment
• Reflow Equipment

The "RSS-210-S" is a desktop vacuum solder reflow device that is suitable for solving challenges related to no-clean flux, void removal, and lead-free processes. It supports traditional "flux," "hydrogen reduction," and reduction using "formic acid." With the powerful reducing effect of formic acid, it effectively removes the oxide film on metal surfaces such as substrates, achieving improved wettability even without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting that meets the standards required for power devices and aerospace applications. 【Features】 ■ Rapid heating at 4°C per second, significantly reducing takt time due to water cooling ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot ■ The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

• Soldering Equipment
• Reflow Equipment

The "RSO-200" is a desktop vacuum solder reflow device that enables a void-free rate of up to 0.01%, making it suitable for solving challenges related to no-clean and lead-free soldering. In addition to "hydrogen reduction" for removing oxide films from the metal surfaces to be joined, it also supports "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Moreover, despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to accommodate a wide range of prototype development. With its diverse reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. 【Features】 ■ Ultra-fast heating rate of 10°C per second, significantly reducing takt time with water cooling ■ Supports maximum temperature of 650°C ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly achieves the set temperature profile as is, with high repeatability and almost zero overshoot ■ The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF document or feel free to contact us.

• Soldering Equipment
• Reflow Equipment

This product is a tabletop vacuum solder reflow device that enables a maximum of 0.01% void-free soldering, making it suitable for addressing challenges related to fluxless and lead-free applications. It supports the removal of oxide films on the metal surfaces to be joined through "hydrogen reduction" and "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Additionally, despite its compact design, which is among the smallest in the industry, it consolidates the functions and performance needed for everything from prototype development to mass production into a single unit. With a wide variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. **Features** - Rapid heating at a speed of 2.5°C per second, significantly reducing takt time with water cooling - Maximum reachable temperature of 450°C (optional up to 650°C) - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen - Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot - The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Free demo requests are also accepted. Please feel free to contact us.* *For more details, please refer to the PDF materials or feel free to reach out to us.*

• Soldering Equipment
• Reflow Equipment

This product is an ultraviolet (UV) irradiation device. Despite being compact and reasonably priced, it thoroughly pursues cost-effectiveness in "curing" (i.e., effectiveness). It is utilized in various fields such as research and development of semiconductors, resin materials, films, and adhesives. Additionally, we also offer a fluorescent lamp type (note: this product uses LED lighting)! 【Features】 ■ UV irradiation is possible from both the top and bottom by changing the direction of the lamp ■ Compact and lightweight ■ Lamp lifespan exceeds 20,000 hours ■ Easy operation with a liquid crystal display *For more details, please download the PDF or feel free to contact us.

• Other semiconductor manufacturing equipment

This product is a UV irradiation device capable of dual-sided irradiation (top/bottom). Despite its compact size and reasonable price, it thoroughly pursues cost-effectiveness in "curing" (i.e., effectiveness). It is used in various fields such as research and development of semiconductors, resin materials, films, and adhesives. (Note: An LED lighting type is also available.) 【Features】 ■ Capable of dual-sided irradiation ■ Compact and lightweight ■ Lamp life exceeds 4,000 hours ■ Easy operation with a liquid crystal screen *For more details, please download the PDF or feel free to contact us.

• Other semiconductor manufacturing equipment

In the semiconductor industry, accurate cross-sectional observation of finely processed components is essential for product quality control and yield improvement. It is particularly important to detect subtle defects and structural issues early in the manufacturing process and take appropriate measures. Traditional cross-section sample preparation requires time and specialized skills, hindering efficient analysis. Our ultrasonic cutting device addresses these challenges and streamlines SEM observation. 【Usage Scenarios】 - Cross-sectional observation of finely processed semiconductor devices - Failure analysis, defect analysis - Verification of manufacturing conditions 【Benefits of Implementation】 - Cross-sections are finished very cleanly, improving observation accuracy - No specialized skills are required, allowing anyone to produce stable cross-sections - Significantly reduces ion milling time before SEM observation

• Analytical Equipment and Devices

The cross-section sample preparation device "CSX-100Lab" is a specialized device that utilizes the cutting surface polishing effect (PolishCut) of our uniquely developed "ultrasonic cutting technology" to simultaneously perform "cutting" and "polishing." It is ideal for improving the efficiency of cross-sectional observation, failure analysis, defect analysis, structural analysis, and verification of manufacturing conditions. Features include: 1) clean cross-sections, 2) precise cutting at targeted positions, 3) cutting of invisible objects by overlaying drawings or X-ray images with monitor images (skeleton cut option), 4) skill-free cross-section sample preparation, 5) reduction of milling time when used as a pre-treatment device for ion milling during SEM observation, and 6) cross-sectional observation of small chip components like 0402. It is particularly used in situations where many cross-section samples are prepared. We also have a demo environment where you can evaluate the actual cutting of your samples, so please feel free to contact us!

• Analytical Equipment and Devices

Start RFID with zero initial costs! Utilizing the features of UHF band RFID, which excels in long-distance reading, we streamline various inspection tasks such as inventory in/out and lending/returning. With a wealth of functions, including inventory management and a search mode that sounds an alert when an item is found, we support your company's RFID utilization. - Start RFID with your smartphone (compatible with UHF band RFID) - Multi-menu support capable of handling diverse inspections - Cloud-based, allowing for inter-site collaboration - Zero initial costs!?

• IC tag

By performing three-dimensional measurements, it is optimal for measuring warpage of precision machined parts that cannot be detected by cross-sectional curves, shape defects of molded products, and quantitative evaluation of wear and scratches in tribology. - Measurement of samples that would get scratched or where the stylus could break with contact methods. - Measurement of transparent or mirror-like surfaces, which was impossible with conventional optical methods. - Compliant with the latest standard ISO-25178-605 for surface texture, it can be used as a standard instrument for roughness evaluation.

• 3D measuring device

The clean roller is a device that removes fine dust and dirt adhering to the surface of products, improving yield. It can be customized, allowing for flexible integration into existing equipment. Dust removal and foreign matter removal in the manufacturing processes of printed circuit boards, metal foils, and PET films. Dust removal devices, including the clean roller, have a proven track record of delivery in over 20 countries, both domestically and internationally. The "Clean Roller Dust Removal Device Comprehensive Catalog" is a catalog that compiles clean rollers, cleaners, and other cleaning devices. [Contents] ◆ Clean Roller ◆ Non-contact Cleaner "RD series" ◆ Wiping Cleaner "SKF series" If you have any issues related to "deburring," "dust collection and removal," or "garbage and dirt," please feel free to contact us. We also accommodate custom products. *For more details, please contact us or download the PDF to view it.

• Printed Circuit Board
• lens
• LCD display

Compared to other stirring devices, it is a high-efficiency stirring blade. As an agent for Nanox Co., Ltd., we handle the stationary fluid mixing device "Lamond Nano Mixer," the stirring device "Lamond Stirrer," the ultra-fine bubble (nano bubble) generation device "Nano Fresser," the research and development device "Nano Quick," and the ultra-fine bubble (nano bubble) seawater treatment machine "Shinsen Tamotsu-kun." ◆ The RS050A can be attached to a φ8mm shaft that comes with a standard stirring motor. It stirs without disturbing the liquid surface and does so in half the time of a regular stirring blade. Even when there are many materials with poor compatibility, it can stir instantly. It achieves uniformity in liquid diameter. It is optimal for fine processing, mixing, disintegration, and pre-dispersion of liquid-liquid, gas-liquid, and powder-liquid. ◆ There are numerous delivery records with customers in the stirring and mixing industry.

• Mixer/agitator
• Homogenizer
• Other cleaning machines

This is a device specialized for the production of cross-sectional observation samples that can simultaneously "cut" and "polish" using the cutting surface polishing effect of "ultrasonic cutting technology" (PolishCutTM). It is particularly used in situations where many cross-sectional observation samples are being produced. We also have a demo environment where you can actually cut your samples and evaluate them, so please feel free to contact us. 【Features】 ■ Clean cutting surface ■ Accurate cutting at the targeted position ■ Cutting of invisible objects by overlaying X-ray images with monitor images ■ Skill-free production of cross-sectional observation samples ■ Can be used as a pre-treatment device for ion milling to reduce milling time *For more details, please contact us or download the PDF for more information.

• Analytical Equipment and Devices

In the MEMS industry, as microfabrication technology advances, high precision and quality in the resist stripping and lift-off processes are required. In particular, the uniformity of the wafer surface and the suppression of contamination are crucial, and addressing these challenges is essential for improving product yield. This device achieves high stripping performance through the combination of heated organic solutions and high-pressure jets. It is a one-chamber system that contributes to high throughput and a reduced footprint. 【Application Scenarios】 - Resist stripping and lift-off processes in MEMS device manufacturing - Processes requiring high-precision pattern formation - Processes needing wafer surface uniformity and contamination control 【Benefits of Implementation】 - Improved yield due to high stripping performance - Increased efficiency of manufacturing lines through reduced footprint - Reduced running costs through the reuse of chemicals

• High pressure cleaner

In the semiconductor industry, especially in the miniaturization process, the precision of resist removal significantly affects product quality. In the formation of fine patterns, the presence of resist residues or foreign substances can lead to critical defects. Our batch-type automatic resist stripping and lift-off equipment achieves high stripping performance and uniformity, contributing to improved yield. 【Application Scenarios】 - Fine wiring processing - Resist removal for high aspect ratio structures - Lift-off processing at the wafer level 【Benefits of Implementation】 - Improved yield - Stabilization of quality - Reduction of running costs

• High pressure cleaner

A mass production-oriented resist stripping and metal lift-off processing device that combines a standard straight nozzle with a high-pressure jet nozzle. The one-chamber type, which performs resist stripping, lift-off, rinsing, and drying all in one chamber, contributes not only to high throughput but also to a reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off. 【Features】 ■ Unique jet lift-off mechanism with high stripping performance ■ Improved flexibility and reduced running costs to accommodate small quantities of various products and fluctuations in production volume ■ Improved quality and yield through single wafer processing (achieving precise processing without cross-contamination and enhancing uniformity and control across the surface) *For more details, please contact us or download the PDF for further information.

• High pressure cleaner

In the MEMS industry, the quality of resist stripping and lift-off processes is crucial for the manufacturing of high-precision devices. Particularly in MEMS devices that utilize microfabrication technology, residual resist and uneven stripping can negatively impact product performance and reliability. Our batch-type automatic resist stripping and lift-off equipment achieves high-precision stripping performance by combining heated organic solutions with high-pressure jets for physical assistance. 【Usage Scenarios】 - Resist stripping and lift-off processes in MEMS device manufacturing - Resist removal in microfabrication processes - Resist stripping for research and development purposes 【Benefits of Implementation】 - Improved device quality through high-precision stripping - Increased productivity through high throughput - Reduced running costs through the reuse of solutions

• High pressure cleaner
• Resist Device

In the semiconductor industry's miniaturization process, precise stripping of the resist is essential. Particularly, as density increases, the presence of resist residues and foreign substances can significantly reduce yield. Our batch-type automatic resist stripping and lift-off equipment achieves high stripping performance through a combination of heated organic chemicals and high-pressure jets. 【Application Scenarios】 * Resist stripping in microfabrication processes * Research and development applications * Small-scale production 【Benefits of Implementation】 * Improved yield due to high stripping performance * Enhanced installation efficiency through space-saving design * Reduced running costs through chemical reuse

• High pressure cleaner
• Resist Device

A research and development device that combines a standard straight nozzle with a high-pressure jet nozzle, designed for resist stripping and metal lift-off processes for small-scale production. It features a compact design that can be installed in tight spaces (approximately 40% more compact than conventional models). The one-chamber system performs resist stripping, lift-off, rinsing, and drying all in a single chamber, contributing not only to high throughput but also to reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off.*

• High pressure cleaner
• Resist Device

A metal lift-off processing device for research and development that combines a standard straight nozzle with a high-pressure jet nozzle. This model is a compact version of the TWPm, further miniaturized and cost-effective by omitting the transport unit. The one-chamber complete type performs resist stripping, lift-off, rinsing, and drying all in one chamber, contributing not only to high throughput but also to a reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off. 【Features】 ■ 60% reduction in footprint (compared to our TWPm) ■ One-chamber completion ■ Prevention of chemical backflow (patented) ■ Prevention of liquid and mist scattering and reattachment *For more details, please contact us or download the PDF for further information.

• High pressure cleaner
• Other semiconductor manufacturing equipment
• Resist Device

Have you been struggling with running costs and labor issues due to manual cleaning or relying on contractors for cleaning? This device automatically cleans dicing frames through automated transport. - Jet cleaning type (focused on reducing running costs) - Scrub cleaning type (focused on cleaning power) We offer these two types in our lineup. By selecting a specification that matches the dirt on the frames you use, we can propose quality and cost benefits. Additionally, dicing frames with tape (sheets) can also be processed, allowing for tape removal and cleaning within the device. (*Optional)

• Other semiconductor manufacturing equipment

With years of experience backing us, we utilize clean technology, transport/control technology, and more to design and manufacture optimal equipment for our customers with our total engineering capabilities. Using various engineering tools, including 3D CAD, we deliver space-saving and user-friendly equipment. *For more details, please download the PDF or contact us.*

• Wafer processing/polishing equipment