日精 List of Products and Services

This product is an inline-compatible heating furnace that can be integrated into a fully automated production line. It is a heating furnace that uses the furnace itself as the heat source, without using hot air, resulting in energy-saving features that minimize heat loss and temperature rise in the surrounding environment. It excels in heat uniformity and allows for long heating times without overshoot. The substrate and tray are taken from the loader and transported to individual furnace chambers for heating through sheet processing. The number of furnace chambers is set based on the tact time, heating time, and heating hold time, making it an energy-efficient heating device without waste. It supports traceability, allowing for management of heating time and temperature on a work unit basis. We provide a fully automated heating device that contributes to space-saving of the heating furnace, with the option to discharge to the next process after heating or store in a cooling stage or magazine. 【Features】 ■ Excellent heat uniformity ■ Capable of long heating times ■ Time management for each furnace chamber ■ Contributes to space-saving of the heating furnace ■ Contributes to energy savings in the heating process *For more details, please refer to the PDF document or feel free to contact us.

• Heating device

An inkjet equipment manufacturer boasting a wealth of delivery achievements in the semiconductor and electronic device fields, starting with the display sector. They offer a top-class lineup of equipment ranging from small devices for experiments and prototypes to large inkjet systems for mass production. All inkjet devices in the series can form thin films as well as thick films with 1-pass coating. The 'IP2030L' model, shown in the photo, enables high-resolution patterning and both partial and full coating. It is equipped with a uniquely developed liquid delivery system and discharge control technology, significantly improving ink usage efficiency. It is also a versatile machine that can be used in a wide range of fields, including compatibility with particle-containing inks. 【Features】 ■ Coating resolution: up to 2400 dpi (scanning) ■ Coating area: up to 300 x 300 mm ■ High-speed coating specification at up to 300 mm/second ■ Equipment size: 1200W x 1200D x 2025H mm (compact design) ■ Options available include print head expansion, UL LED curing unit, CAD conversion tools, and more. *For more details, please refer to the PDF document or feel free to contact us.

• Painting Machine

The "CB-2100" is a high-speed FC bonder that supports a variety of devices (5G/data communication/RFID). It incorporates the elemental technologies cultivated through years of FCB (flip chip bonder) manufacturing and follows the data obtained from structural analysis to accommodate mass production. We offer a lineup including the tabletop model "CB-200," the manual type "CB-505," and the semi-automatic type "CB-600." 【Features】 ■ Compatible with chip trays ■ Automatic cleaning of the head tip ■ Installation of HEPA filters and ionizers ■ Support for various devices (5G/data communication/RFID) ■ Mapping support ■ Production management support *For more details, please refer to the PDF materials or feel free to contact us.

• Bonding Equipment

"FACE FOUR" is an AI temperature measurement facial recognition terminal that can detect body temperature without contact, using a unique "AI algorithm." It recognizes a person's face and is equipped with four functions: temperature detection, mask detection, entry management, and labor management. We offer wall-mounted and standalone types. 【Features】 ■ Instantly detects body temperature using facial recognition and temperature detection technology ■ Can identify individuals even while wearing masks, automatically judging along with temperature ■ Controls entry gates and doors to prevent access for those with abnormal temperatures or without masks ■ Automatically records employee IDs and body temperatures ■ While measurements are taken one person at a time, it can continuously measure 20 to 30 people per minute *For more details, please refer to the PDF document or feel free to contact us.

• Other safety and hygiene products
• Entrance and exit control system
• Other inspection equipment and devices

This series is a basic type of dust removal device used in various processes. We offer models ranging from 2 to 5 units, suitable for both inline and outline applications. The lineup includes the "RY-705B," which features a non-contact magnetic gear for the drive gear, and the "RY-505Z," a two-unit clean roller type with cleaning on both the upper and lower sides. We accommodate various customer requests for sheet products and roll-to-roll lines. 【Features】 ■ Clean Roller RY-705B - Employs a non-contact magnetic gear for the drive gear - A revolutionary clean roller that eliminates dust generation from within the device ■ Clean Roller RY-505Z - Arranges two clean rolls on both the upper and lower sides to double the dust removal effect - Ideal for surface dust removal of products before the lamination process or exposure process in automatic lines ■ Customized Products - Designed and manufactured to fit the customer's work size * We also accept demo evaluations to determine if removal is possible with samples provided. * For more details, please refer to the PDF materials or feel free to contact us.

• Printed Circuit Board

The "CB-200" is suitable for small-scale and multi-variety production. Its highly versatile device concept accommodates various packages (※1) and various bonding processes (※2). ※1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. ※2 ACF, ACP, NCF, NCP, ultrasonic, etc.

• Bonding Equipment

The mass production ultrasonic dicing device "CSX501" is a dicing machine that cuts difficult materials such as SiC, GaN, and fine ceramics with high speed and precision. The ultrasonic-assisted cutting with "CSX501" adds ultrasonic assistance to the "force generated by the rotation of the blade," allowing the blade to "vibrate in the outward direction" while cutting. This technology enables the achievement of improved throughput, reduced running costs, and increased yield while maintaining high-quality cutting. Furthermore, the addition of device monitoring functions allows for remote support, contributing to a reduction in recovery time from unexpected troubles. Additionally, by equipping various optional functions, it also contributes to the control of blade edge shapes and the reduction of cutting burrs. *We also conduct evaluations by cutting sample work upon request, so please feel free to contact us. *For more details, please refer to the PDF materials.

• Ultrasonic Oscillator
• Other cutting tools
• Other processing machines

We would like to introduce the "Thin Plate Compatible Clean Roller." The "RY-1106 Series" utilizes a new type of clean roll with a small diameter, making it possible to remove dust from thin plates and films. Additionally, by adopting a magnetic gear in the drive section of the device, we suppress minute dust generation from the gear part. We also offer the "RFC-705A" and "RF-705A." 【Features】 ■ Prevents dropping ■ Clean roll that prevents entanglement ■ Uses magnetic gear in the drive section ■ Capable of cleaning 50μm workpieces ■ Customized products Designed and manufactured to fit the customer's work size * We also accept demo evaluations to determine if removal is possible with samples provided. * For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• LCD display
• Other semiconductor manufacturing equipment

Adwells contributes to the advancement of technology development aimed at energy saving, electrification, and weight reduction in electronics products, automobiles, and industrial equipment through ultrasonic joining devices that enable room temperature, short time, and dissimilar metal joining.

• aluminum
• Secondary Cells/Batteries

We propose customized unit rollers tailored to your needs. We accommodate various specifications for roll-to-roll lines and vertical path lines, as well as designs for fixed installation units in line equipment. Our solutions are ideal for dust removal from films, substrates, and glass panels. 【Features】 - Manufactured to order according to customer requirements. - Capable of responding to various requests for installation and mounting in existing lines and equipment. - We can produce unit rollers up to 2,600mm based on our track record. - Suitable for long products in raw material processes and slitting processes. - Enhanced structural strength improves adhesion to products, allowing for high-speed flow rates of up to 250m/min. *We also accept demo evaluations to determine if removal is possible with samples provided. *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• LCD display
• Secondary Cells/Batteries

I thoroughly explained the mechanism, advantages and disadvantages of flux acid reduction, as well as actual case studies of its application.

• Annealing furnace

This model retains the high performance of UniTemp's temperature control from Germany while incorporating only the necessary functions for reflow, making it easy to use. It is compact and easy to install. ■ Maximum temperature reach: 250℃ ■ Nitrogen gas purging possible ■ 16-step temperature program can be set ■ Automatically calculates the heat capacity of the target object for control, ensuring temperature control as set. It has high repeatability accuracy and almost zero overshoot. ■ High uniformity in heating, allowing for even heating anywhere on the heating plate.

• Annealing furnace

A variety of high-performance materials are being developed to improve product performance in a wide range of applications, including electronics. Cutting technologies that maximize the properties of these materials are in demand. Adwell's ultrasonic cutter contributes to the development and manufacturing technology of electronic products and resin/rubber products.

• Capacitor

◆Advantages of Non-Contact Type It enables cleaning of delicate materials that you want to avoid contact with, as well as uneven surfaces that are difficult to clean with contact methods (especially rollers). Additionally, because it is non-contact, it minimizes the impact on the workpiece. ◆Low Running Costs Due to the dry cleaning method, there is no need for water or chemical solution replacement, nor for expensive infrastructure development. Furthermore, the main consumable is just the filter, achieving low running costs. ◆Applications: Dust removal and foreign matter removal in the manufacturing processes of printed circuit boards, metal foils, PET films, etc. Dust removal devices, including clean rollers, have a proven track record of delivery in over 20 countries, both domestically and internationally. ◆Catalog The "Clean Roller Dust Removal Device Comprehensive Catalog" is a compilation of clean rollers and cleaners. 【Contents】 ◆ Clean Roller (Standard) ◆ Non-Contact Cleaner "RD series" ◆ Wiping Cleaner "SKF series" If you have any concerns regarding "deburring," "dust collection and removal," or "trash and dirt," please feel free to contact us. We also accommodate custom products. *For more details, please contact us or download the PDF to view.

• Printed Circuit Board
• lens
• LCD display

The "CB-600" is a flip chip bonder designed for ultra-low load applications. It enables heating and bonding from room temperature to 450°C through a tool lift operation that utilizes high-precision Z-axis control, with a ceramic heater. With a head exchange, it also supports ultrasonic bonding (customer replaceable). Additionally, due to its highly versatile equipment concept, it accommodates various packages (*1) and bonding processes (*2). *1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. *2 ACF, ACP, NCF, NCP, solder, ultrasonic, etc. 【Features】 ■ Ultra-low load compatibility ■ High-precision bonding ■ Tool lift operation utilizing high-precision Z-axis control ■ Supports ultrasonic bonding with tool exchange *For more details, please refer to the PDF document or feel free to contact us.

• Bonding Equipment

Technological development is underway to promote the use of CFRTP in automobiles, airplanes, wind power generation, and industrial equipment, where lightweight structures are required. At Adwells, we contribute to the technological advancement of CFRTP products through ultrasonic application devices that can be applied to the manufacturing of CFRTP materials, intermediate processed products, and final products.

• Secondary Cells/Batteries
• Plastic processing machines (cutting and rolling)

The RVS-210 is a tabletop vacuum solder reflow device that enables a maximum of 0.01% void-free soldering, making it suitable for solving challenges related to no-clean and lead-free processes. In addition to "hydrogen reduction" for removing the oxide layer on the metal surfaces to be joined, it also supports "formic acid reduction." The powerful reducing effect of formic acid improves wettability even without flux. Despite its compact design, which is among the smallest in the industry, it condenses all the necessary functions and performance for various prototype developments into one unit. With a wide range of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace applications. **Features** - Rapid heating at a speed of 2°C per second, significantly reducing takt time due to water cooling - Supports a maximum temperature of 400°C - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen - Almost perfectly realizes the set temperature profile with high repeatability and minimal overshoot - The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Free demo requests are also accepted. Please feel free to contact us.* *For more details, please refer to the PDF document or feel free to contact us.*

• Soldering Equipment
• Reflow Equipment

Amsonic Hamo is highly regarded for its quality and complete cleaning process. Our systems can be easily integrated into your manufacturing line in a space-saving manner, and the transition from manual to automatic cleaning simplifies operations, allowing for reductions in labor costs and minimizing the consumption of utilities such as cleaning water and detergents. The high potential of the equipment itself, along with minimized utility consumption and operating time, contributes to improving your productivity. 【Features】 ■ Validated cleaning process ■ Customized cleaning racks ■ Individually designed cleaning systems ■ High energy efficiency ■ High-spec equipment specifications that do not generate residual water *For more details, please refer to the PDF materials or feel free to contact us.

• Other cleaning machines

This is a device for performing visual inspections of power device ceramic substrates for defects such as burrs, chips, cracks, scratches, dirt, discoloration, solder overflow, foreign objects, and bulging/denting on both the front and back surfaces. By setting magazines or trays containing the ceramic substrates and operating the device, visual inspections of the front and back surfaces of the ceramic substrates are conducted, and based on the inspection results, sorting into good and defective products is performed. 【Features】 ■ Detection of "bulging" and "denting" defects through high-density 3D inspection ■ Realization of an optimal lighting environment using multi-angle lighting ■ High-speed inspection achieved with fast lighting switching and rapid image capture ■ Capable of inspecting both the front and back surfaces *For more details, please refer to the PDF document or feel free to contact us.

• Visual Inspection Equipment
• Other inspection equipment and devices
• Automatic sorting machine

This product is a system for managing attendance and movement by holding a tablet device up to a two-dimensional color code. By installing tablets in each work area, it enables not only attendance management but also work performance management. Recently, a body temperature registration feature has been newly added, allowing for the identification of contacts in the event of fever or infection by tracing back in time. Additionally, it is equipped with a "Chameleon Code" capable of high-speed and high-precision image recognition. It uses cyan, magenta, yellow, and black as the basic colors, with green, red, blue, and orange as additional colors, and is expected to be a next-generation recognition technology to replace RFID. 【Features】 ■ Non-contact simultaneous recording of body temperature, traceable ■ Body temperature registration and facial photo capture at clock-in and clock-out ■ Displays a warning if a temperature above the standard value is measured ■ Identifies all workers who clocked in on the same day and worked in the same area ■ Easy and low-cost implementation *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments
• Entrance and exit control system
• Other image-related equipment

The "CB-505" supports various packages (*1) and various bonding processes (*2) due to its highly versatile device concept. *1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. *2 ACF, ACP, NCF, NCP, ultrasonic, etc. *For more details, please refer to the PDF materials or feel free to contact us.

• Bonding Equipment

Avery Dennison SMARTRAC and Nissei's carefully selected RFID tag best selection. Ideal for all applications with low cost and high performance. 【Features】 ○ High performance ○ High quality ○ Global compatibility ○ Low cost ○ Stable supply * Additionally, we also accept requests for experiments, demonstrations, equipment rentals, and testing! Please feel free to contact us.

• IC tag reader/writer

Due to the miniaturization of size, it demonstrates excellent performance in tagging at the individual item level and suppresses material detuning. 【Features】 ○ High performance ○ High quality ○ Global compatibility ○ Low price ○ Stable supply *Samples are available upon request. Please feel free to contact us.

• IC tag reader/writer
• IC tag

It demonstrates excellent performance for small individual product-level packaging, wristbands, and other pharmaceutical applications. 【Features】 ○ High performance ○ High quality ○ Global compatibility ○ Low price ○ Stable supply * Samples are available upon request. Please feel free to contact us.

• IC tag reader/writer
• IC tag

It is designed to operate even under close contact or conditions that may confuse other inductively coupled HF and LF tags. 【Features】 ○ High performance ○ High quality ○ Global compatibility ○ Low price ○ Stable supply *Samples are available upon request. Please feel free to contact us.

• IC tag reader/writer
• IC tag

This is a product with excellent security performance for disk media and high cost efficiency. It complies with ISO 9001:2015 quality management and ISO 14001:2015 environmental management. It is an ideal product that provides an advanced media management system and offers a lifetime warranty for the library. 【Features】 ○ High performance ○ High quality ○ Global compatibility ○ Low price ○ Stable supply *Samples are available upon request. Please feel free to contact us.

• IC tag reader/writer
• IC tag

This is a product with excellent security performance for disk media and high cost efficiency. It uses paper that is resistant to aging (compliant with ISO 9706) and pH-neutral adhesives, making the paper quality suitable for archival purposes. It is an ideal product that offers an advanced media management system and provides a lifetime warranty for libraries. 【Features】 ○ High performance ○ High quality ○ Global compatibility ○ Low price ○ Stable supply *Samples are available upon request. Please feel free to contact us.

• IC tag reader/writer
• IC tag

This is a product with excellent security performance for disk media and high cost efficiency. It uses paper that is resistant to aging (compliant with ISO 9706) and pH-neutral adhesives, making the paper quality suitable for archival purposes. It is an ideal product that provides an advanced media management system and offers a lifetime warranty for libraries. 【Features】 ○ High performance ○ High quality ○ Global compatibility ○ Low price ○ Stable supply *Samples are available upon request. Please feel free to contact us.

• IC tag reader/writer
• IC tag

Best selection of RFID tags carefully chosen by SMARTRAC and Nissei. Ideal for all applications with low cost and high performance. 【Features】 ○ High performance ○ High quality ○ Global compatibility ○ Low cost ○ Stable supply * We also offer experiments, demos, equipment loans, and testing! Please feel free to contact us.

• IC tag reader/writer
• IC tag

The "MIDAS FLAGTAG" is a label tag designed to be directly attached to metallic surfaces such as metal and foil packaging. In addition to being attachable to the metallic surfaces of retail products, pharmaceuticals, and industrial goods, it can also be used on plastic and cardboard surfaces, functioning similarly to regular tags. Furthermore, the tag is compatible with RFID printers, allowing for printing and encoding. 【Features】 ■ Usable for products, authentication parts, supply chain & asset management, etc. ■ High cost-effectiveness ■ Compact size of 60mm x 21mm ■ Can also be used as a regular flat paper tag ■ The antenna part that adheres closely to the metallic surface enhances the tag's performance by utilizing the metallic surface as part of the antenna structure *For more details, please refer to the PDF document or feel free to contact us.

• IC tag
• label
• Special labels, etc.

Nissei responds to customers who need to integrate antennas into their equipment with multi-antenna technology. Nissei's multi-antenna technology enables the creation of custom antennas that can meet customer demands for high-gain and wideband antennas in a short delivery time. 【Features】 ■ High Gain: By combining multiple antennas of the same frequency to operate as a single antenna, high-gain antennas are achieved. ■ Wideband: By combining antennas from multiple bands, wideband antennas are realized. ■ Short Delivery Time: With a proven track record of obtaining telecom certifications from mobile operators, we can respond to customer demands in a short delivery time, contributing to reduced development costs. *For more details, please refer to the catalog or feel free to contact us.

• antenna

This is a high-capacity type IC tag. It demonstrates excellent resistance and performance even in harsh environments such as thick paper, plastic, low detuning materials, and others. 【Features】 ○ High performance ○ High quality ○ Global compatibility ○ Low price ○ Stable supply *Samples are available upon request. Please feel free to contact us.

• IC tag reader/writer
• IC tag

SMARTRAC and Nissei's carefully selected RFID tags - Best Selection. High-performance products that also offer large capacity. Ideal for applications on materials with high dielectric constants such as cardboard, plastic, and glass. 【Features】 ○ High performance ○ High quality ○ Global compatibility ○ Low price ○ Stable supply * Additionally, we also offer experiments, demonstrations, equipment rentals, and testing! Please feel free to contact us.

• IC tag reader/writer
• IC tag

We offer the compact, lightweight, and user-friendly UHF RFID reader/writer manufactured by ATID. 【Product Lineup】 ＜ATS100＞ - Can be mounted on Android devices, allowing for reading and data processing to be completed at hand. - Easy connection to iOS/Windows devices. ＜AT388＞ - Easy to operate with one hand, enabling speedy data collection. - Supports Bluetooth, USB, and WiFi connections. ＜ATD100＞ - A desktop model convenient for data registration and tag reading on a PC. - RF output control is possible. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• PDAs and handheld terminals
• others

The "VPO-1000-300" is a tabletop vacuum process high-speed heating furnace that is suitable for research and development as well as prototype development, and is among the smallest in the industry. It supports Φ12-inch, Φ6-inch, and 4-inch sizes, and allows for the processing of small sample pieces with a dedicated susceptor. With a maximum temperature of 1000°C, it accommodates a variety of gas purge environments. It can be used for the crystal growth of new materials such as GaN and SiC, as well as for the sintering of paste materials, making it versatile. 【Features】 ■ Supports nitrogen gas, oxygen gas, forming gas (hydrogen + nitrogen) purging, as well as high-concentration hydrogen gas purging. ■ Equipped with 24 IR (infrared) heaters for precise high-speed heating. ■ High-purity quartz chamber. ■ Cooling compatible with nitrogen gas purging method. ■ Up to 4 process gas lines (MFC). ■ Achieves a vacuum level of 0.1 Pa (10^-3 Pa possible with HV model equipped with TMP). ■ Standard touch panel monitor for easy operation. *For more details, please refer to the PDF document or feel free to contact us.

• Soldering Equipment
• Heating device

The "RTP-150" is a tabletop vacuum process rapid heating furnace that is suitable for research and development as well as prototype development, classified as one of the smallest in the industry. It supports a maximum temperature of 1000°C and accommodates a variety of gas purge environments. It can be used for various purposes, including crystal growth of new materials such as GaN and SiC, as well as sintering of paste materials. 【Features】 ■ Supports nitrogen gas, oxygen gas, forming gas (hydrogen + nitrogen) purging, as well as high-concentration hydrogen gas purging. ■ Enables precise rapid heating with 24 IR (infrared) heaters on the top and bottom. ■ High-purity quartz chamber. ■ Supports cooling using nitrogen gas purging method. ■ Up to 4 process gas lines (MFC). ■ Achieves vacuum levels of 10^-1 Pa (10^-3 Pa possible with HV model equipped with TMP). ■ Standard touch panel monitor for easy operation. *For more details, please refer to the PDF document or feel free to contact us.

• Soldering Equipment
• Heating device

The "RTP-100" is a tabletop vacuum process rapid heating furnace that is suitable for research and development as well as prototype development, and is among the smallest in the industry. It supports 4-inch wafers and allows for the processing of small samples using a dedicated susceptor. With a maximum temperature of 1200°C, it accommodates a variety of gas purge environments. It can be used for various purposes, such as crystal growth of new materials like GaN and SiC, and sintering of paste materials. 【Features】 - Supports nitrogen gas, oxygen gas, and forming gas (hydrogen + nitrogen) purging, as well as high-concentration hydrogen gas purging. - Enables precise rapid heating with 18 IR (infrared) heaters on the top and bottom. - High-purity quartz chamber. - Supports cooling through nitrogen gas purging. - Up to 4 process gas lines (MFC). - Achieves a vacuum level of 10^-1 Pa (10^-3 Pa possible with the HV model equipped with TMP). - Comes standard with a touch panel monitor for easy operation. *For more details, please refer to the PDF document or feel free to contact us.

• Soldering Equipment
• Heating device

The "AZ9T/AZ9C" is a microscope that achieves a working distance (WD) of 90 mm, an optical 10x zoom, and a resolution of 3 μm. During profile execution, it has previously been difficult to confirm the status of objects within the chamber. By attaching this product to the "viewing window" standardly equipped on the reflow unit and connecting it to the main unit, you can observe the melting of solder in real-time. Additionally, with a working distance (WD) of 90 mm, it captures sharp and clear images even when passing through the glass of the viewing window (10 mm thick). Furthermore, data can be saved to a PC not only as still images but also as videos. 【Features】 ■ Real-time observation of solder melting ■ Sharp and clear imaging even when passing through the glass of the viewing window (10 mm thick) ■ Data can be saved to a PC as still images or videos *For more details, please refer to the PDF document or feel free to contact us.

• Microscope
• Other microscopes

The "RSS-110-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean, void removal, and lead-free processes. It supports traditional "flux," "hydrogen reduction," and reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability even without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace applications. 【Features】 ■ Rapid heating at 2°C per second, significantly reducing takt time due to water cooling ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly exact realization of the set temperature profile High repeatability with almost zero overshoot ■ Minimal in-plane temperature difference on the heating plate, allowing uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

• Soldering Equipment
• Reflow Equipment

The "RSS-160-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean flux, void removal, and lead-free processes. In addition to conventional "flux" and "hydrogen reduction," it also supports reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. Despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to support a wide range of prototype development. 【Features】 ■ Rapid heating at 100°C per minute, and with water cooling, significantly reduces takt time ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly achieves the set temperature profile as is, with high repeatability and almost zero overshoot ■ The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

• Soldering Equipment
• Reflow Equipment

The "RSS-210-S" is a desktop vacuum solder reflow device that is suitable for solving challenges related to no-clean flux, void removal, and lead-free processes. It supports traditional "flux," "hydrogen reduction," and reduction using "formic acid." With the powerful reducing effect of formic acid, it effectively removes the oxide film on metal surfaces such as substrates, achieving improved wettability even without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting that meets the standards required for power devices and aerospace applications. 【Features】 ■ Rapid heating at 4°C per second, significantly reducing takt time due to water cooling ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot ■ The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

• Soldering Equipment
• Reflow Equipment

The "RSS-3×210-S" is a desktop vacuum solder reflow device that enables a maximum void-free rate of 0.01%, making it suitable for solving challenges related to no-clean and lead-free soldering. It supports the removal of oxide films on the metal surfaces to be joined through "hydrogen reduction" and "formic acid reduction." The strong reducing effect of formic acid enhances wettability even without flux. Additionally, despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to accommodate a wide range of prototype development. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required in power devices and aerospace applications. **Features** - Rapid heating at a speed of 2°C per second, significantly reducing takt time due to water cooling - Near-zero in-plane temperature difference on the heating plate, allowing for uniform heating of large objects - Nearly exact realization of the set temperature profile, with high repeatability and almost zero overshoot - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen *We also accept requests for free demonstrations. Please feel free to contact us.* *For more details, please refer to the PDF document or feel free to reach out to us.*

• Soldering Equipment
• Reflow Equipment

The "RSO-200" is a desktop vacuum solder reflow device that enables a void-free rate of up to 0.01%, making it suitable for solving challenges related to no-clean and lead-free soldering. In addition to "hydrogen reduction" for removing oxide films from the metal surfaces to be joined, it also supports "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Moreover, despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to accommodate a wide range of prototype development. With its diverse reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. 【Features】 ■ Ultra-fast heating rate of 10°C per second, significantly reducing takt time with water cooling ■ Supports maximum temperature of 650°C ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly achieves the set temperature profile as is, with high repeatability and almost zero overshoot ■ The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF document or feel free to contact us.

• Soldering Equipment
• Reflow Equipment

This product is a tabletop vacuum solder reflow device that enables a maximum of 0.01% void-free soldering, making it suitable for addressing challenges related to fluxless and lead-free applications. It supports the removal of oxide films on the metal surfaces to be joined through "hydrogen reduction" and "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Additionally, despite its compact design, which is among the smallest in the industry, it consolidates the functions and performance needed for everything from prototype development to mass production into a single unit. With a wide variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. **Features** - Rapid heating at a speed of 2.5°C per second, significantly reducing takt time with water cooling - Maximum reachable temperature of 450°C (optional up to 650°C) - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen - Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot - The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Free demo requests are also accepted. Please feel free to contact us.* *For more details, please refer to the PDF materials or feel free to reach out to us.*

• Soldering Equipment
• Reflow Equipment

This product is an ultraviolet (UV) irradiation device. Despite being compact and reasonably priced, it thoroughly pursues cost-effectiveness in "curing" (i.e., effectiveness). It is utilized in various fields such as research and development of semiconductors, resin materials, films, and adhesives. Additionally, we also offer a fluorescent lamp type (note: this product uses LED lighting)! 【Features】 ■ UV irradiation is possible from both the top and bottom by changing the direction of the lamp ■ Compact and lightweight ■ Lamp lifespan exceeds 20,000 hours ■ Easy operation with a liquid crystal display *For more details, please download the PDF or feel free to contact us.

• Other semiconductor manufacturing equipment