TAKAYA Corporation List of Products and Services

In the component mounting process of printed circuit boards, mistakes due to incorrect component sets or implementation program errors during model changes in the mounter equipment can lead to defects on a lot basis (lot out) if discovered late, resulting in significant losses. To prevent such mistakes, there are cases where components are temporarily mounted on a bare board with double-sided tape, and each one is measured and visually inspected with an LCR meter. This inspection is referred to as "first machine check," "setup change check," or "trial run inspection," but it requires the line to be stopped until the inspection is completed, which takes time and can reduce line operating rates. Additionally, when manually checking all small components on a densely mounted board, it is difficult to completely eliminate human error. Our company recommends automatic inspection using a flying probe tester as a method to make this task easier and more efficient. This allows for accurate and quick confirmation work after line changes. Customers considering improvements in operating rates through reduced switching times of mounting machines, reduced labor costs, and decreased risks of defective products are encouraged to consider implementation.

We would like to introduce a case where a flying probe tester was implemented as a replacement for a fixture-type (press-type) tester. *Challenges - In the case of high-density mounted boards, there were components that could not be inspected with a fixture-type tester due to the difficulty of creating fixtures in narrow areas. - For low-volume production, such as maintenance parts after mass production, the cost of fixtures became high, increasing the overall cost burden, including maintenance. - There was a need to secure storage space for fixtures, which also added management hassle. *Implementation Effects - Components with narrow pitch that could not be inspected with fixtures can now be tested, enhancing reliability. - The need for fixture production has been eliminated, and there are no longer any running costs associated with maintenance. - Storage space for fixtures is no longer required, eliminating management hassle. For more details about the flying probe tester, please download the PDF catalog or feel free to contact us.

We would like to introduce a case where a flying probe tester was implemented for 100% inspection of circuit boards, which require a focus on quality and reliability. *Challenges* - There are defects that cannot be detected by AOI (automated optical inspection) or X-ray inspection, such as shorts caused by very fine wire-like solder bridges. - Subjecting a shorted circuit board to functional testing poses risks such as fire and circuit board failure, and it is difficult to identify the true location of the defect. *Implementation Effects* - By utilizing the flying probe tester, which inspects the mounting state with fine electrical signals, we were able to identify mounting defects without putting unnecessary stress on the circuit board. - By combining it with AOI and X-ray inspection, we were able to further expand the inspection range and improve reliability. For more details about the flying probe tester, please download the PDF catalog or feel free to contact us.

We would like to introduce a case where a flying probe tester was implemented for electrical testing from the prototype stage of the circuit board. *Challenges - With jig-based testers, it was necessary to recreate the jig for each prototype, leading to high costs. - When design changes occurred, the jig also had to be redone, which took time. *Benefits of Implementation - By using a flying probe tester, jig creation is unnecessary; inspection can be initiated immediately by simply creating the inspection program, enhancing quality from the prototype stage. - During design changes, adjustments can be made by merely modifying the inspection program, eliminating extra effort. - From the prototype stage, we quickly provide feedback on defects and their causes to the previous processes, allowing for improvements in circuit board manufacturing design and assembly processes from the early stages of production, thereby preventing significant issues close to mass production. For more details about the flying probe tester, please download the PDF catalog or feel free to contact us.

We would like to introduce a case where a flying probe tester was implemented shortly after the start of mass production, during the period before the completion of the fixtures. *Challenges - The creation of fixtures for fixture-based testers typically takes about a month, so if there are specification changes just before mass production, it can be difficult to arrange the fixtures in time. *Benefits of Implementation - The flying probe tester can start inspections on the same day as long as the inspection program is created. This allows for immediate inspections right after the start of mass production, when the defect rate is highest, providing reassurance to our customers. For more details about the flying probe tester, please download the PDF catalog or feel free to contact us.

We would like to introduce a case where Takaya's flying probe tester was implemented for failure board analysis in the Quality Assurance Department. *Challenges Approximately 150 to 200 boards per month are returned from domestic and international markets due to failures. Operators were repairing while searching for defective areas with handheld testers, but it was labor-intensive, so automation was desired. The main causes of defects include component lifting, pattern breaks, and component destruction. Due to the variety of product types, creating inspection jigs was costly, so inspection using the flying probe tester was introduced. The causes of defects include component lifting, pattern breaks, and component destruction. 〇Results - Faulty components were identified quickly without labor or oversight. - Simple function tests can be conducted simultaneously with operational testing. - Using the accumulation and analysis functions of inspection results, trends such as differences in failure modes based on the country of shipment for the same board can be fed back to design. For more details about the flying probe tester, please download the PDF catalog or feel free to contact us.

In printed circuit board assembly, there are two methods: "Surface Mount Technology (SMT)," which involves soldering components on the surface of the printed circuit board, and "Insertion Mount Technology (IMT)," which involves inserting electrode lead terminals into the holes (through-holes) of the printed circuit board and soldering them. Takaya's flying probe tester is also skilled at inspecting insertion-mounted boards. For larger discrete components, manual assembly followed by visual inspection can lead to variability and the possibility of inspection errors. However, by using the flying probe tester, inspections can be conducted without mistakes, ensuring reliable traceability. For large hand-inserted components related to power lines, issues such as misplacement, bridging, shorts, and polarity, which are difficult to detect with AOI (automated optical inspection), can be electrically tested to prevent component and board damage during power-on, thereby reducing the occurrence of discarded boards. In recent years, as miniaturization and high-density integration of boards have progressed, surface mount technology has become mainstream, but there are still many boards manufactured using insertion mount technology. If you are facing inspection challenges, please feel free to reach out.

Takaya is a leading company in the PCB inspection machine industry, boasting the world's top market share in flying probe testers. After developing the world's first flying probe tester in 1987, it was showcased at a technology exhibition in Germany in 1988. It received high praise from the local electronics industry, which led to the start of its expansion into the European market. In 1990, sales began in the United States, another industrially advanced country. In 1995, it was awarded the "TEST INNOVATION OF THE YEAR," a prize given to the most innovative inspection machines, further recognizing its performance worldwide. Currently, Takaya has established sales and service bases in the United States, Europe, China, and Southeast Asia, with numerous sales achievements in over 46 countries. To meet the high demands from various manufacturers, new models and groundbreaking features are continuously being added, and the sales network continues to expand. If you have any issues with electrical testing of PCBs, please feel free to contact Takaya.

Introducing Flying Probe Testers to overseas bases / Please leave the local setup to Takaya. Takaya has entered into a distributor agreement with Itochu Corporation for overseas sales, establishing sales/service bases in the United States, Europe, China, and Southeast Asia, with numerous sales achievements in over 46 countries. Please make use of Takaya's Flying Probe Testers, recognized not only in Japan but also by companies and industries around the world. *For more detailed information, please refer to the related link page below.

In the February issue of the industry information magazine "PRODUCTRONIC 2021," published in Europe, we featured an article about the introduction of our testers at a major sensor manufacturer. This manufacturer handles approximately 10 million printed circuit boards and 800 million components annually and has been using Takaya's flying probe testers for about 20 years. This article includes comments from when they introduced the latest model, the APT-1600FD series. They conduct in-circuit testing directly after the PCB assembly process, which allows for very quick and reliable error detection. They also praised the ease of modifying inspections simply by adjusting the program, even if the assembly content changes during development. By eliminating the need for fixture creation, cost-effectiveness has increased, and they achieved inspection speeds approximately 2 to 2.5 times faster compared to using fixture-based testers. We encourage you to utilize Takaya's flying probe testers, recognized not only in Japan but also by companies and industries around the world. *For more detailed information, please refer to the related link page below.

At Takaya, we also accept special custom requests for flying probe testers to meet our customers' diverse needs. As an example, in response to the request to "automatically transport large and heavy boards weighing up to 30 kg," we have developed a dedicated automatic transport unit. Even very heavy boards that are difficult to carry manually can be handled safely and accurately. Additionally, to conduct special inspections alongside in-circuit testing, we have created space within the tester body to accommodate special inspection equipment, allowing for flexible customization. Even for inspections of special products that do not fit standard specifications, we can provide solutions through custom support. Please consult with our sales representative for more information.

Are you having trouble with ICT (In-Circuit Testing) for oversized PCBs? Even for oversized PCBs known as DIB (Device Interface Board) or PIB (Probe Interface Board), you can rely on Takaya's flying probe testers. By using our unique optional mechanisms, we can perform ICT inspection on PCBs up to 985x610mm in size without any modifications. Additionally, we are happy to accommodate automatic transport for heavy PCBs and individual customizations within the inspection area. For more details about Takaya's flying probe testers, please feel free to download the PDF catalog or contact your sales representative.

In the October 2023 issue of the European electronics industry magazine "EPP," an article introducing Takaya's flying probe testers has been published. Takaya Corporation and its European distributor, Cystec Europe, have maintained a long-standing partnership with Siemens in Germany. At Siemens' global flagship factory "SIEMENS Karlsruhe," 12 Takaya flying probe testers are currently in operation, ensuring the reliability of assembled circuit boards. The APT-1600FD-A achieves fully unmanned inspection 24 hours a day, 5 days a week through simultaneous inspection of both sides, automatic setup of inspection programs using new software, and automatic transport of circuit boards using an Autonomous Mobile Robot (AMR). Additionally, it supports the latest interface standards such as OPC UA, enabling integration with MES systems, as well as establishing an environment for monitoring operational rates and automatically switching inspection programs based on defect statistics. Please check the related links and download page for more information.

【Implementation Results for EMS Companies】 - By conducting electrical inspections from the prototype stage of the circuit board, we achieve quality assurance before mass production. - Early optimization of circuit board design and component selection contributes to the reduction of defects in later processes. 【Challenges Faced by Customers】 Cost of Recreating Jigs: With jig-based testers, it is necessary to recreate dedicated jigs every time there is a prototype or design change. Each design change requires modifications to the jigs, significantly increasing costs and time. Insufficient Response to Design Changes: Conventional inspection methods make it difficult to respond flexibly to design changes. There were instances where long lead times made rapid verification during the prototype stage challenging.

High-precision inspections compliant with IEC60384-1 are possible. The characteristics of electronic components such as fixed capacitors are guaranteed according to international standards, achieving improved quality for high-density boards. We flexibly respond to design changes and prototypes, providing cost-effective inspection solutions. 【Implementation Achievements】 - Conducted inspections of high-density mounted boards, achieving quality assurance tailored to precision boards. - Enabled inspections compliant with the IEC60384-1 standard (performance standards for fixed capacitors), ensuring product quality in line with international standards. 【Customer Challenges】 Narrow Pitch Between Components: In high-density boards, the space between components is extremely narrow, making physical contact difficult with traditional jig-based inspections. There is a potential decrease in inspection accuracy, especially in narrow pitch areas below 0.2mm and with high pin count components. Need for Compliance with Standards: As compliance with international standards represented by IEC60384-1 is required, a system that reliably implements inspection items based on these standards is necessary. It is particularly important to measure the characteristics of fixed capacitors and special components accurately and quickly. Limits of Inspection Coverage: In designs where the number of test points has decreased, there is a risk of reduced inspection coverage due to insufficient physical access.

In large-scale board inspections for communication infrastructure and servers, jig-less inspection is particularly effective. Even with large board sizes, it can be handled efficiently, and this inspection method combines flexibility and precision, contributing to quality improvement and cost reduction. This significantly contributes to ensuring reliability in the fields of communication infrastructure and servers. 【Implementation Results】 - Established inspection technology tailored to the quality requirements specific to large boards. - Guaranteed the reliability of high-precision boards used in communication infrastructure devices and server products. 【Challenges Faced by Customers】 Handling of large boards: With jig-based testers, designing and manufacturing jigs for large boards is difficult. Due to weight and handling constraints, setup times are prolonged. Response to design changes: Large boards have many test points, and the cost of modifying jigs increases during design changes. The flexibility of the inspection process is low, making it unsuitable for low-volume, high-variety production. Cost and storage space: Jigs for large boards have high manufacturing costs and take up storage space. When operating multiple product lines, managing jigs becomes complicated.

By combining visual inspection, non-contact scanning, and physical probing, we meet the stringent reliability standards in the medical device field, achieving both quality improvement and cost reduction. 【Implementation Achievements】 - Achieved full inspection in inline testing, ensuring product quality. - Enhanced defect detection capabilities for large substrates and complex design boards through collaboration with boundary scan technology. 【Challenges Faced by Customers】 Limitations of APT alone: Flying probe testers excel in electrical characteristic testing, but physical access for probing is difficult for components with hidden pin connections, such as BGA and QFP. In high-density substrates, there are areas that cannot be fully covered by probing alone. Constraints of AOI: Cannot detect defects (such as solder bridges or connection failures) located beneath BGA or large components. Internal connections and micro shorts in multilayer substrates cannot be detected. In large substrates, areas beyond the field of view occur, making it difficult to efficiently inspect the entire area. Challenges with large substrates and complex designs: In large substrates, inspection time tends to increase for both AOI and APT, leading to decreased productivity. Full inspection of high-density mounted substrates requires an efficient inspection system that combines physical probing and non-contact inspection.

By combining electrical testing using APT with AOI, which is difficult for discrete components and hand-inserted parts, we achieve the high quality standards required for power generation and power system boards, providing an efficient inspection system. 【Implementation Results】 - Conducted implementation verification focused on discrete components, achieving quality assurance for power system boards that require high reliability. - Realized 100% inspection on boards including power lines and hand-inserted components. 【Challenges Faced by Customers】 Limitations of AOI Inspection: While AOI (Automated Optical Inspection) excels at inspecting surface-mounted components, it has limitations in the following areas: - Difficulty in inspecting hand-inserted components: It cannot sufficiently verify the quality of the implementation of power lines and large discrete components. - Insufficient confirmation of component position and polarity: AOI cannot accurately confirm electrical characteristics, leading to the risk of missing incorrect insertions or polarity issues. Risks During Power Supply: Defective components or miswiring in power lines can lead to damage to the board or destruction of components. Particularly, if the quality assurance for discrete components is inadequate, the risk of overheating or short circuits increases. Generation of Waste Boards: If the board is damaged during power-on testing, the disposal of defective boards occurs, leading to increased costs.

In the mass production process of circuit boards for consumer products, conducting constant inspections of chip components and verifying the mounter program before assembly helps prevent lot outs and defective products from being released, achieving both efficiency in the manufacturing process and improved quality. 【Implementation Results】 - In the process of switching models for mass-produced high-density assembly boards, program verification of the mounter and constant inspections of chip components were conducted. - Efficient manufacturing processes were realized through short-duration and high-precision inspections. 【Challenges Faced by Customers】 Component Set Mistakes: There is a risk of component set mistakes during the assembly process or the installation of non-specified components. Particularly in mass production, if mistakes are discovered late, it can lead to a large number of lot outs. Program Mistakes: Due to errors in the mounter's program settings, there is a possibility that incorrect components are installed on the circuit board. If a setting mistake is discovered in a later process, the costs for rework or disposal increase. Limitations of Visual Inspection: Manual and visual checks depend on the skill and fatigue of the operator, making it easy for inspection omissions and false detections to occur.

In the analysis of defective automotive circuit boards, utilizing a flying probe tester enables the rapid identification of defective areas and improves repairability. By shortening analysis time and reducing waste circuit boards, we aim to achieve both quality enhancement and cost efficiency, contributing to increased reliability in the automotive industry. 【Implementation Results】 - Analyzed defective areas of circuit boards determined to be faulty through functional testing or returned from the market due to failures. - Contributed to product improvement and defect reduction through quick identification of causes. 【Challenges Faced by Customers】 Need for Advanced Knowledge: Defect analysis requires knowledge of circuit design, implementation technology, and operational characteristics. In complex automotive circuit boards, the causes can be diverse, making analysis challenging. Prolonged Analysis Time: Manual analysis and visual confirmation can be time-consuming and may fail to identify defective areas. This is particularly difficult in multilayer boards where detecting internal connection failures or fine short circuits is challenging. Generation of Waste Circuit Boards: If defective areas cannot be identified, the entire circuit board may have to be discarded, leading to increased costs.

By utilizing color sensors for automated inspection, we overcome the limitations of visual inspection and achieve quality stabilization and efficiency. Automation reduces the burden on operators and establishes consistent inspection standards, balancing improved product reliability with cost reduction. 【Implementation Achievements】 - Transition from visual inspection to automated inspection. - Achieved quality stabilization through precise automated inspection using color sensors. 【Challenges Faced by Customers】 Operator Burden: Visual inspection relies on the skills and experience of operators, leading to issues such as fatigue and decreased concentration during long hours of work. As the burden on operators increases, the risk of decreased inspection accuracy rises. Variability in Judgment Criteria: Visual inspection involves subjective judgments by individuals, resulting in variability in quality standards. Inconsistent judgments can lead to the outflow of defective products and excessive inspection. Difficulty in Confirming LED Characteristics: Determining fine characteristics such as the color and brightness of LEDs is challenging through visual inspection. Inspections based on accurate numerical standards are required.

In the aerospace and defense sectors, where high-quality standards are required, the use of flying probe testers streamlines the inspection of low-volume production boards. The flexible inspection flow, which does not require fixtures, enables quick turnaround times and ensures traceability, achieving both quality improvement and cost reduction. 【Implementation Results】 - Conducted full inspection of low-volume production boards, achieving quality assurance for products that require high reliability. - Responded to the stringent demands specific to the aerospace and defense sectors with a high-precision inspection flow. 【Challenges Faced by Customers】 Burden of Fixture Creation: Fixture-based testers require dedicated fixtures for each board, leading to excessive costs for low-volume production. The design and manufacturing of fixtures take time, making it difficult to respond to short lead times. Difficulty in Defect Detection: There is a risk of missing fine defects (hidden shorts, internal wiring issues) that are difficult to detect with only AOI or functional testing. Particularly in multilayer boards, visual inspections and standard power-on tests are insufficient for quality assurance. Traceability Requirements: In aerospace and defense products, it is necessary to record measurement results and inspection data in detail to ensure future traceability.