IOL testing of discrete semiconductors

Supports IOL tests and power cycle tests for small discrete semiconductors!

We would like to introduce the "IOL testing of discrete semiconductors" that we conduct. Under normal temperature conditions, we repeatedly turn the power ON/OFF, applying stress to the device due to temperature changes caused by the device's own heat generation during power ON. During the power OFF (cooling) phase, forced cooling is also performed using a fan. 【Adjustment Conditions】 ■ Temperature Rise: 125℃ ■ Heating Time: 5 minutes ■ Cooling Time: 5 minutes ■ Fan Operating Time: 2 minutes *For more details, please download the PDF or feel free to contact us.

• Public Testing/Laboratory

We conduct environmental testing, as well as non-destructive observation and electrical property measurements.

At AITES, we use environmental testing equipment that conforms to standard specifications such as JIS, JEDEC, and MIL, and we accept commissioned testing for reliability evaluation of various electronics products, components, and materials. We offer a range of tests including electrical testing, non-destructive observation, and power cycle testing. 【Environmental Testing】 ■ Highly Accelerated Life Testing ■ Constant Temperature and Humidity Testing ■ Thermal Shock Testing ■ Liquid Bath Thermal Shock Testing ■ Temperature and Humidity Cycle Testing ■ In-Situ Continuous Measurement Reliability Evaluation Testing Service *For more details, please refer to the PDF materials or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis regarding the malfunctioning part!

At Aites Co., Ltd., we offer analysis services for power semiconductors. Since our separation and independence from the Quality Assurance Department of IBM Japan's Yasu office in 1993, we have cultivated our own unique analysis and evaluation techniques. We can handle not only Si semiconductors but also the trending wide bandgap semiconductors. 【Features】 ■ OBIRCH analysis supports not only Si but also SiC and GaN devices ■ FIB processing is possible from either side ■ Visualization of the depletion layer formed at the PN junction ■ Elemental analysis such as EDS and EELS is also supported *For more details, please refer to the PDF document or feel free to contact us.

• Semiconductor inspection/test equipment
• Contract Analysis
• Analysis Services

Contracting power cycle tests using a power cycle testing device! We will cooperate in improving quality along with failure analysis and assessment.

At Aites Co., Ltd., we offer contract power cycle testing using Siemens (Mentor) power cycle testing equipment. We can also handle the creation of various jigs necessary for the tests. Additionally, we accommodate various observations and measurements of power devices. We can capture changes before and after tests such as power cycle testing. 【Features】 ■ We can handle the creation of various jigs necessary for the tests. ■ We accommodate various observations and measurements of power devices. ■ We can capture changes before and after tests such as power cycle testing. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Contract measurement
• Contract Inspection

In-Situ Continuous Measurement Reliability Evaluation Testing Service

In-situ continuous measurement reliability evaluation tests involve applying stress while measuring characteristics to conduct reliability assessments. ● Accurate understanding of failure time is possible In a read-out method where samples are taken from a stress environment at a fixed time, failure can only be understood at the timing of the read-out, making it impossible to know the exact failure occurrence time. In-situ measurement allows for an accurate understanding of failure time. ● Detection of recoverable failures is possible Recoverable failures can cause significant issues in the market. In most cases, the read-out method makes it nearly impossible to detect these recoverable failures, whereas in-situ measurement enables the detection of recoverable failures, allowing for accurate judgment and assessment. ● Monitoring of stress application conditions on samples is possible The stress application status and measurement data can be confirmed in real-time.

• Testing Equipment and Devices
• Other inspection equipment and devices
• Contract Inspection

Support for the difficulties in the development and evaluation of components, devices, and materials related to semiconductor products.

【Testing, Evaluation, Analysis】 　●Reliability Testing 　　■Temperature Cycle Testing 　　■Thermal Shock Testing 　　■High-Temperature Storage Testing 　　■Highly Accelerated Life Testing 　　■Preconditioning 　　■Hot Oil Testing 　　■In-situ Continuous Measurement 　　■Ion Migration Testing 　　■Electromigration Testing 　　■Test Consulting 　●Evaluation Testing 　　■Bond Strength Testing: Pull/Shear Testing 　　■Mechanical Strength Testing: Vibration/Shock/Fall Testing/Compression Strength/Shear Strength 　　■ESD/Latch Up/CDM Testing 　　■Electrical Characteristic Measurement 　　■Salt Spray Testing 　●Analysis 　　■X-ray Transmission Observation 　　■Ultrasonic Microscope Observation 　　■Luminescence Analysis (EMS/IR-OBIRCH) 　　■Scanning Electron Microscope (SEM) 　　■Transmission Electron Microscope (TEM) 　　■Surface Contamination Analysis (TOF-SIMS) 　　■Foreign Substance Analysis (FT-IR)

• Other contract services

We thoroughly evaluate and verify power devices from every angle.

■Problem-Solving Ability Consulting that leads to solutions with knowledge and technology Supporting customer schedules with quick responses ■Investigative Ability Skills to pinpoint and visualize malfunctioning areas Deep insight and advanced, delicate sample processing techniques ■Specialized Equipment Liquid tank thermal shock testing at up to 180°C Power cycle testing essential for power semiconductors

• diode
• Transistor

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

On November 6th (Thursday) to 7th (Friday), 2025, we held the "Human Body Day 2025" at the NAC Image Technology Akasaka Multi-Purpose Space. We have uploaded videos of the highlights from each company and the presentations that took place on the day to our website. We encourage you to take a look. ---[Report on Human Body Day 2025 is here]------------------- https://info.nacinc.jp/jintaiday2025-report ------------------------------------------------------------------------- On the day of the event, participants were able to experience a wide range of products in a hands-on session format, including motion capture, force plates, eye tracking, and human body analysis software. We received numerous comments from attendees expressing high satisfaction, saying, "It was great to gain various information all at once," which makes us very happy. NAC Image Technology will continue to provide "valuable products to our customers." We hope you will join us for our next event as well.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed